公开(公告)号：US20040020601A1

公开(公告)日：2004-02-05

申请号：US10631303

申请日：2003-07-29

Applicant: Applied Materials, Inc.

Inventor： Jun Zhao ,  Farhad Moghadam ,  Tim Weidman ,  Rick J. Roberts ,  Hari Ponnekanti ,  Chau T. Nguyen ,  Satish Sundar ,  David H. Quach ,  Sasson Somekh

IPC: H01L021/306 ,  C23C016/00

CPC classification number: H01L21/67161 ,  H01L21/02126 ,  H01L21/02203 ,  H01L21/02216 ,  H01L21/02282 ,  H01L21/02304 ,  H01L21/02337 ,  H01L21/0234 ,  H01L21/02362 ,  H01L21/31695 ,  H01L21/67167 ,  H01L21/67184 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/67201 ,  H01L21/67742 ,  H01L21/76807

Abstract: A series of modular apparatuses for processing substrates using a unique combinations of a substrate coating subsystem, a substrate curing subsystem and a PECVD-based capping subsystem. The individual subsystems are capable of being combined with one another for creating unique integrated substrate processing apparatuses that enable combined processing by the coating, curing and capping subsystems in an integrated and controlled environment, thus enabling the processing of substrates in an efficient manner, while minimizing the exposure of the substrates to an external environment and minimizing the condensation of vapors while the substrate is processed by the cure and capping subsystems.

Abstract translation: 一系列用于使用基板涂层子系统，基板固化子系统和基于PECVD的封盖子系统的独特组合来处理衬底的模块化装置。 各个子系统能够彼此组合，用于创建独特的集成基板处理设备，其能够通过在集成和受控环境中的涂层，固化和封盖子系统进行组合处理，从而能够以有效的方式处理基板，同时最小化 衬底暴露于外部环境，并且在通过固化和封盖子系统处理衬底的同时使蒸气冷凝最小化。