公开(公告)号：US20040020601A1

公开(公告)日：2004-02-05

申请号：US10631303

申请日：2003-07-29

Applicant: Applied Materials, Inc.

Inventor： Jun Zhao ,  Farhad Moghadam ,  Tim Weidman ,  Rick J. Roberts ,  Hari Ponnekanti ,  Chau T. Nguyen ,  Satish Sundar ,  David H. Quach ,  Sasson Somekh

IPC: H01L021/306 ,  C23C016/00

CPC classification number: H01L21/67161 ,  H01L21/02126 ,  H01L21/02203 ,  H01L21/02216 ,  H01L21/02282 ,  H01L21/02304 ,  H01L21/02337 ,  H01L21/0234 ,  H01L21/02362 ,  H01L21/31695 ,  H01L21/67167 ,  H01L21/67184 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/67201 ,  H01L21/67742 ,  H01L21/76807

Abstract: A series of modular apparatuses for processing substrates using a unique combinations of a substrate coating subsystem, a substrate curing subsystem and a PECVD-based capping subsystem. The individual subsystems are capable of being combined with one another for creating unique integrated substrate processing apparatuses that enable combined processing by the coating, curing and capping subsystems in an integrated and controlled environment, thus enabling the processing of substrates in an efficient manner, while minimizing the exposure of the substrates to an external environment and minimizing the condensation of vapors while the substrate is processed by the cure and capping subsystems.

Abstract translation: 一系列用于使用基板涂层子系统，基板固化子系统和基于PECVD的封盖子系统的独特组合来处理衬底的模块化装置。 各个子系统能够彼此组合，用于创建独特的集成基板处理设备，其能够通过在集成和受控环境中的涂层，固化和封盖子系统进行组合处理，从而能够以有效的方式处理基板，同时最小化 衬底暴露于外部环境，并且在通过固化和封盖子系统处理衬底的同时使蒸气冷凝最小化。

公开(公告)号：US20040018070A1

公开(公告)日：2004-01-29

申请号：US10206724

申请日：2002-07-25

Applicant: APPLIED MATERIALS, INC.

Inventor： Jun Zhao ,  Satish Sundar ,  Vinay K. Shah ,  Hari K. Ponnekanti ,  Mario Dave Silvetti ,  Michael Robert Rice ,  Avi Tepman ,  Farhad K. Moghadam

IPC: B65G049/07

CPC classification number: H01L21/67742

Abstract: Embodiments of the present invention are directed to substrate processing systems having substrate transferring mechanisms that are compact, have small footprints, and provide fast and efficient substrate transfer to achieve high throughput. In specific embodiments, a unit slab construction is used for the chambers around the substrate transferring mechanism, enabling efficient system construction with improved alignment and at a lower cost. The chambers may share gas, pump, and other utilizes. In one embodiment, an apparatus for processing substrates includes at least three robot blades each configured to support a substrate. A robot is coupled with the at least three robot blades to simultaneously move the robot blades between at least three chambers and simultaneously transfer each of the substrates supported on the robot blades from one chamber to another chamber.

Abstract translation: 本发明的实施例涉及具有紧凑的基板转移机构，具有小的占地面积并且提供快速和有效的基板转移以实现高产量的基板处理系统。 在具体实施例中，单元板结构用于基板传送机构周围的室，使得能够以更低的成本改进对准和高效的系统构造。 这些室可以共享气体，泵和其他利用。 在一个实施例中，用于处理衬底的装置包括至少三个机器人刀片，每个机器人刀片被配置为支撑衬底。 机器人与所述至少三个机器人刀片耦合以同时在至少三个腔室之间移动所述机器人刀片，并且同时将支撑在所述机器人刀片上的每个基底从一个腔室传送到另一个腔室。

公开(公告)号：US20020009359A1

公开(公告)日：2002-01-24

申请号：US09960009

申请日：2001-09-21

Applicant: Applied Materials, Inc.

Inventor： Satish Sundar

IPC: B66C023/00

CPC classification number: H01L21/68707 ,  B25J15/0206

Abstract: The present invention generally provides a robot that can transfer workpieces, such as silicon wafers, at increased speeds and accelerations and decelerations. More particularly, the present invention provides a robot wrist associated with the robot arm for mechanically clamping a workpiece to a workpiece handling member attached to the arm. The workpiece clamp selectively applies sufficient force to hold the workpiece and prevent slippage and damage to the workpiece during rapid rotation and linear movement of the handling member. In one embodiment, a clamp for securing silicon wafers uses two clamp fingers connected to a single flexure member to position and hold the wafer with minimal particle generation and wafer damage. The clamp is designed so that wafers are normally clamped except near full extension of the workpiece handling member to deliver or pick up a wafer.

Abstract translation: 本发明通常提供一种能够以增加的速度和加速度和减速度传送诸如硅晶片的工件的机器人。 更具体地，本发明提供了一种与机器人臂相关联的机械手，用于将工件机械地夹持到附接到臂的工件处理构件。 工件夹具选择性地施加足够的力来保持工件，并且在处理构件的快速旋转和线性移动期间防止滑动和损坏工件。 在一个实施例中，用于固定硅晶片的夹具使用连接到单个挠曲构件的两个夹钳指状件，以最小的颗粒产生和晶片损坏来定位和保持晶片。 夹具被设计成使得晶片通常被夹紧，除了工件处理构件的完全延伸以便递送或拾取晶片。

公开(公告)号：US20020098072A1

公开(公告)日：2002-07-25

申请号：US09765830

申请日：2001-01-19

Applicant: Applied Materials, Inc.

Inventor： Satish Sundar

IPC: B66C023/00

CPC classification number: B25J9/042 ,  H01L21/67742

Abstract: A robot apparatus is to be mounted on a robot hub, and includes a main robot link, a first robot extension arm, a second robot extension arm, a first robot blade, a second robot blade. A hub motor, a first extension motor, and a second extension motor. The main robot link is fixedly mounted to the robot hub. The first robot extension arm is rotatably mounted to a first end of the main robot link. The second robot extension arm is rotatably mounted to a second end of the main robot link. The first end of the main robot link is located on a distal end of the main robot link from the second end of the main robot link. The first robot blade is mounted to the first robot extension arm. The second robot blade is mounted to the second robot extension arm. The hub motor provides controllable rotational motion of the main robot link about the robot hub. The first extension motor is configured to provide controllable simultaneous extension or retraction of the first robot extension arm and the first robot blade. The second extension motor is configured to provide controllable simultaneous extension or retraction of the second robot extension arm and the second robot blade.

Abstract translation: 机器人装置将安装在机器人轮毂上，并且包括主机器人连杆，第一机器人延伸臂，第二机器人延伸臂，第一机器人叶片，第二机器人叶片。 轮毂马达，第一延伸马达和第二延伸马达。 主机器人连杆固定安装在机器人轮毂上。 第一机器人延伸臂可旋转地安装到主机器人连杆的第一端。 第二机器人延伸臂可旋转地安装到主机器人连杆的第二端。 主机器人连杆的第一端位于主机器人连杆的从主机器人连杆的第二端的远端。 第一个机器人刀片安装到第一个机器人伸展臂。 第二机器人刀片安装到第二机器人延伸臂。 轮毂电机提供主机器人连杆关于机器人轮毂的可控旋转运动。 第一延伸电动机被配置为提供第一机器人延伸臂和第一机器人叶片的可控的同时延伸或缩回。 第二延伸电动机构造成提供第二机器人延伸臂和第二机器人叶片的可控的同时延伸或缩回。

公开(公告)号：US20020051704A1

公开(公告)日：2002-05-02

申请号：US10032663

申请日：2001-10-23

Applicant: Applied Materials, Inc.

Inventor： Satish Sundar ,  Ned G. Matthews

IPC: B25J015/00

CPC classification number: H01L21/68707 ,  B25J15/0206

Abstract: The present invention generally provides a robot that can transfer workpieces, such as silicon wafers, at increased speeds and accelerations and decelerations. More particularly, the present invention provides a robot wrist associated with the robot arm for mechanically clamping a workpiece to a workpiece handling member attached to the arm. The wafer clamp selectively applies sufficient force to hold the workpiece and prevent slippage and damage to the workpiece during rapid rotation and linear movement of the handling member. In a particular embodiment, a clamp for securing silicon wafers uses a flexure assembly to position and hold the wafer with minimal particle generation and wafer damage. The clamp is designed so that the wafers are normally clamped near full extension of the workpiece handling member to deliver or pick up a wafer. A particular embodiment uses a pneumatic cylinder to actuate the flexure assembly so that the flexure assembly moves outwardly and rearwardly away from the wafer when actuated at or near full extension of the workpiece handling member.

Abstract translation: 本发明通常提供一种能够以增加的速度和加速度和减速度传送诸如硅晶片的工件的机器人。 更具体地，本发明提供了一种与机器人臂相关联的机械手，用于将工件机械地夹持到附接到臂的工件处理构件。 晶片夹具选择性地施加足够的力来保持工件，并且在处理构件的快速旋转和线性移动期间防止滑动和损坏工件。 在特定实施例中，用于固定硅晶片的夹具使用挠曲组件来以最小的颗粒产生和晶片损坏来定位和保持晶片。 夹具被设计成使得晶片通常被夹持在工件处理构件的完全延伸附近以递送或拾取晶片。 特定实施例使用气动缸来致动弯曲组件，使得挠曲组件在工件处理构件的全部延伸处或在其附近被致动时向外和向后移动远离晶片。

公开(公告)号：US20010016157A1

公开(公告)日：2001-08-23

申请号：US09846472

申请日：2001-04-30

Applicant: Applied Materials, Inc.

Inventor： Satish Sundar

IPC: G06F007/00 ,  B65G001/00

CPC classification number: H01L21/67167 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/67201 ,  H01L21/67248 ,  H01L21/67276 ,  H01L21/67742 ,  Y10S414/139

Abstract: An apparatus for processing wafers generally comprising a transfer chamber, a loadlock chamber mounted on the transfer chamber, one or more processing chambers mounted on the transfer chamber, a wafer handling member disposed in the transfer chamber, and a system controller programmed to move wafers through the transfer chamber following time optimal paths.