公开(公告)号：US3904461A

公开(公告)日：1975-09-09

申请号：US50718474

申请日：1974-09-09

申请人： BENDIX CORP

发明人： ESTEP GORDON J ,  BURTON BERNARD LEE

IPC分类号： H01L21/00 ,  H01L21/60 ,  H01L21/607 ,  H01L21/70 ,  H01L23/498 ,  H01L23/522 ,  H05K1/03 ,  H05K1/16 ,  H05K3/06 ,  H05K3/38 ,  C23F1/02

CPC分类号： H05K1/167 ,  H01L21/00 ,  H01L21/707 ,  H01L23/49866 ,  H01L23/522 ,  H01L24/81 ,  H01L2224/45124 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K1/0306 ,  H05K3/064 ,  H05K3/388 ,  H05K2201/0317 ,  H05K2201/0347 ,  H05K2203/0361 ,  H05K2203/072 ,  Y10T29/49099 ,  Y10T29/49128 ,  H01L2924/00 ,  H01L2224/48

摘要： A metalization process for the manufacture of hybrid integrated circuit elements including boards and semiconductors to be attached thereto involves applying to a substrate of insulating material such as aluminum oxide, successive layers of sputtered nickel-chromium and nickel, an electroless deposit of nickelboron and, frequently, an electro-deposited layer of gold. The assembly is then normally heat-treated to stabilize the resistive layer. The addition of the nickel-boron layer provides many advantages in that reliable low-temperature solder connections may be made to it, ultrasonic wire bonds of high reliability may be accomplished with the usual aluminum wire supplied with most discrete components, the heat-treating step is considerably shortened in time with greater stability of resistance values, and the assemblies thus manufactured are capable of operating in comparatively high-temperature environments. The same metalization process applied to semiconductors renders them easily solderable and avoids using high temperature eutectic bonding with the accompanying exposure of the semiconductors to elevated temperatures, often for prolonged periods. As a result, circuit assemblies thus manufactured are readily repairable, in most instances, since no high-temperature bonds are required.

摘要翻译： 用于制造包括要附着在其上的板和半导体的混合集成电路元件的金属化工艺包括将诸如氧化铝的绝缘材料的衬底，溅射的镍 - 铬和镍的连续层，镍 - 硼的无电沉积和 经常是电沉积的金层。 然后通常对组件进行热处理以稳定电阻层。 镍 - 硼层的添加提供了许多优点，因为可以制造出可靠的低温焊料连接，高可靠性的超声波引线接合可以用大多数分立元件提供的通常的铝线来实现，热处理步骤 大大缩短了电阻值的稳定性，并且由此制造的组件能够在较高温度的环境中工作。 应用于半导体的相同的金属化工艺使得它们易于焊接，并避免使用高温共晶结合，伴随着半导体的暴露于升高的温度，通常是长时间的。 结果，如此制造的电路组件在大多数情况下易于修复，因为不需要高温键。

公开(公告)号：US3907565A

公开(公告)日：1975-09-23

申请号：US42774873

申请日：1973-12-26

申请人： BENDIX CORP

发明人： BURTON BERNARD LEE ,  TAKAKI MINORU ,  HALL ROGER D

IPC分类号： H01Q11/04 ,  G03F7/00 ,  H01Q9/27 ,  H05K1/00 ,  H05K3/00 ,  H05K3/06 ,  H05K3/38 ,  G03C5/00

CPC分类号： G03F7/00 ,  H01Q9/27 ,  H05K1/0284 ,  H05K3/0082 ,  H05K3/064 ,  H05K3/386 ,  H05K2201/09018 ,  H05K2203/056 ,  H05K2203/0759

摘要： An antenna and method of manufacture are described in which a spiral microwave antenna is formed over a domed substrate of epoxy glass resin. A copper foil member is formed over a die by spinning or burnishing to a domed configuration matching that of the substrate. The copper member is then given a coating of primer and clamped over the substrate which has been coated with an epoxy cement, and the assembly subjected to heat and pressure sufficient to bond the foil to the substrate. The assembled antenna blank is then coated with photo-resist material and illuminated from a source of collimated light through a photo negative which is carefully centered to expose the desired spiral pattern on the photo-resist material. The photo-resist is then developed and rinsed, and the blank is baked to harden the exposed photo-resist. The blank is then etched to remove the unwanted copper, leaving the desired antenna pattern. The copper pattern is then preferably plated with tin and the assembly trimmed and drilled as desired.

摘要翻译： 描述了一种天线和制造方法，其中螺旋式微波天线形成在环氧树脂玻璃树脂的圆顶基底上。 通过旋转或抛光在模具上形成铜箔部件至与基板相匹配的圆顶形结构。 然后将铜构件涂覆底漆并夹在已经涂覆有环氧胶泥的基材上，并且该组件受到足以将箔结合到基材上的加热和压力。 然后将组装的天线坯料涂覆有光致抗蚀剂材料，并从准直光源通过光负极照射，该光负极小心居中以暴露光刻胶材料上所需的螺旋图案。 然后显影和冲洗光致抗蚀剂，并烘烤该坯料以硬化曝光的光致抗蚀剂。 然后蚀刻该坯料以除去不想要的铜，留下所需的天线图案。 铜图案然后优选地镀锡，并且根据需要修整和钻孔组件。