Method and composition for quantifying protein using tagged standards

    公开(公告)号:US12259356B2

    公开(公告)日:2025-03-25

    申请号:US17544591

    申请日:2021-12-07

    Abstract: Methods and reference compositions for quantifying protein using tagged standards. In an exemplary method, a reference composition and a protein may be electrophoresed in respective lanes of a gel. The reference composition may include quantitation standards of different size and each including a tag present at a different concentration. The quantitation standards and the protein may be transferred from the gel to a solid support to create a blot. Luminescence may be detected from the blot to obtain respective luminescence values separately representing an abundance of the tag of each quantitation standard and an abundance of the protein. A quantity of the protein may be determined using the respective luminescence values.

    Electronic component assembly with thermally conductive structures for image sensors

    公开(公告)号:US11553116B2

    公开(公告)日:2023-01-10

    申请号:US17108672

    申请日:2020-12-01

    Abstract: An electronic component assembly having thermal pads with thermal vias coupling an image sensor and a camera board fab is provided for heat dissipation. The electronic component assembly can include: a circuit board having at least one thermal pad disposed on a top surface of the circuit board; and an image sensor disposed on the top surface of the circuit board, having at least one conductive pad disposed at at least one corner of the image sensor. The at least one thermal pad is coupled to the at least one conductive pad of the image sensor and the at least one thermal pad is formed with a plurality of first thermal vias penetrating the thermal pad and the circuit board for transfer of heat of the image sensor.

    Saturation avoidance in digital imaging

    公开(公告)号:US11212454B2

    公开(公告)日:2021-12-28

    申请号:US16597665

    申请日:2019-10-09

    Abstract: A method of image capture helps avoid saturation in digital imaging. In one implementation, the method includes capturing a first digital image of a target using an electronic array light sensor, and identifying one or more saturated pixels in the first digital image. The method further includes identifying a region of interest in the first digital image, the region of interest encompassing the one or more identified saturated pixels. The method also includes capturing a second digital image of the target using the electronic array light sensor. The second digital image encompasses only the region of interest, and the second digital image is captured with a shorter exposure time than the first digital image. The first and second digital images may be combined into a high dynamic range image. Systems for digital imaging may be based on complementary metal oxide semiconductor (CMOS) or charge coupled device (CCD) sensors.

    ELECTRONIC COMPONENT ASSEMBLY WITH THERMALLY CONDUCTIVE STRUCTURES FOR IMAGE SENSORS

    公开(公告)号:US20210176386A1

    公开(公告)日:2021-06-10

    申请号:US17108672

    申请日:2020-12-01

    Abstract: An electronic component assembly having thermal pads with thermal vias coupling an image sensor and a camera board fab is provided for heat dissipation. The electronic component assembly can include: a circuit board having at least one thermal pad disposed on a top surface of the circuit board; and an image sensor disposed on the top surface of the circuit board, having at least one conductive pad disposed at at least one corner of the image sensor. The at least one thermal pad is coupled to the at least one conductive pad of the image sensor and the at least one thermal pad is formed with a plurality of first thermal vias penetrating the thermal pad and the circuit board for transfer of heat of the image sensor.

    Modular microscope construction
    9.
    发明授权

    公开(公告)号:US09971138B2

    公开(公告)日:2018-05-15

    申请号:US14262559

    申请日:2014-04-25

    CPC classification number: G02B21/06 G02B21/125 G02B21/16 G02B21/24 G02B21/365

    Abstract: A system, apparatus and method for using modular microscopes is disclosed. Connecting the housings of the individual microscope modules provide the structural framework of the modular microscope. Furthermore, the modular microscope can include specialized software, the distribution and use of which can be controlled using security keys or identifiers stored on one or more of the microscope modules. The security keys and identifiers can be based on calibration data associated with the physical, electrical, or optical properties of one of more of the modules. The illumination modules disclosed provide for selectable wavelengths and controllable levels of output illumination for both bright field and dark field illumination.

    MODULAR MICROSCOPE CONSTRUCTION
    10.
    发明申请
    MODULAR MICROSCOPE CONSTRUCTION 有权
    模块化显微镜结构

    公开(公告)号:US20140293412A1

    公开(公告)日:2014-10-02

    申请号:US14262559

    申请日:2014-04-25

    CPC classification number: G02B21/06 G02B21/125 G02B21/16 G02B21/24 G02B21/365

    Abstract: A system, apparatus and method for using modular microscopes is disclosed. Connecting the housings of the individual microscope modules provide the structural framework of the modular microscope. Furthermore, the modular microscope can include specialized software, the distribution and use of which can be controlled using security keys or identifiers stored on one or more of the microscope modules. The security keys and identifiers can be based on calibration data associated with the physical, electrical, or optical properties of one of more of the modules. The illumination modules disclosed provide for selectable wavelengths and controllable levels of output illumination for both bright field and dark field illumination.

    Abstract translation: 公开了一种使用模块显微镜的系统,装置和方法。 连接各个显微镜模块的外壳提供了模块化显微镜的结构框架。 此外,模块化显微镜可以包括专门的软件,可以使用存储在一个或多个显微镜模块上的安全密钥或标识符来控制其分布和使用。 安全密钥和标识符可以基于与多个模块之一的物理,电或光学特性相关联的校准数据。 所公开的照明模块为亮场和暗场照明提供了可选择的波长和输出照明的可控电平。

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