公开(公告)号：US20220115572A1

公开(公告)日：2022-04-14

申请号：US17280387

申请日：2020-01-22

Applicant: BOE Technology Group Co., Ltd.

Inventor： Wei YANG ,  Ke WANG ,  Muxin DI

IPC: H01L33/62 ,  H01L33/00

Abstract: The present application discloses a drive backplane and a preparation method thereof, a display panel, and a display device. The drive backplane includes a flexible substrate provided with a first via hole; a first passivation layer located on a side of the flexible substrate and provided with a second via hole, an orthographic projection of the second via hole being at least partially overlapped with an orthographic projection of the first via hole; a thin film transistor located on a side, facing away from the flexible substrate, of the first passivation layer; and an electrical connecting structure, including a signal trace and a connecting terminal.

公开(公告)号：US20210305283A1

公开(公告)日：2021-09-30

申请号：US17265228

申请日：2020-05-19

Applicant: BOE Technology Group Co., Ltd.

Inventor： Muxin DI ,  Zhiwei LIANG ,  Yingwei LIU ,  Ke WANG ,  Zhanfeng CAO ,  Guangcai YUAN

IPC: H01L27/12 ,  H01L23/498 ,  H01L25/075 ,  H01L29/786 ,  H01L33/62

Abstract: A display panel, a manufacturing method thereof, and a display device. The manufacturing method comprises: sequentially forming a sacrificial layer and a flexible substrate on a surface of a side of a rigid base plate; forming a connection-via pair in the flexible substrate; forming a conductive layer on the flexible substrate, and forming connection portions; forming a leveling layer; forming driving circuits corresponding one-to-one to the connection-via pairs on the flexible substrate, and forming a driving chip on a side of the driving circuits facing away from the flexible substrate, the driving chip being electrically connected to the driving circuits; separating the sacrificial layer from the flexible substrate; and forming a micro LED device on a surface of the flexible substrate facing away from the driving circuits, the micro LED device being electrically connected to the connection portions.

公开(公告)号：US20230097502A1

公开(公告)日：2023-03-30

申请号：US16982217

申请日：2019-12-19

Applicant: BOE Technology Group Co., Ltd.

Inventor： Zhiwei LIANG ,  Yingwei LIU ,  Zhijun LV ,  Ke WANG ,  Zhanfeng CAO ,  Hsuanwei MAI ,  Guangcai YUAN ,  Muxin DI

IPC: H01L33/62 ,  H01L25/075 ,  H01L23/00

Abstract: A display backboard and a manufacturing method thereof, and a display device are provided. The display backboard includes: a driving substrate; a plurality of driving electrodes on the driving substrate; and a plurality of connection structures respectively on the plurality of driving electrodes. The connection structure includes: at least one conductive component on the driving electrode; and a restriction component on a side of the driving electrodes provided with the at least one conductive component and in at least a part of a peripheral region of the at least one conductive component. The restriction component protrudes from the driving electrode and has a first height in a direction perpendicular to the driving substrate.

公开(公告)号：US20220216183A1

公开(公告)日：2022-07-07

申请号：US17422220

申请日：2020-10-21

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Mingxing WANG ,  Meng YAN ,  Qingxun ZHANG ,  Qian WU ,  Xuan FENG ,  Xiawei YUN ,  Guangcai YUAN ,  Xue DONG ,  Muxin DI ,  Zhiwei LIANG ,  Ke WANG

IPC: H01L25/065 ,  H01L27/15 ,  H01L23/498 ,  H01L23/00

Abstract: A display substrate and a display device are provided. The display substrate includes a backplane including a plurality of pixel regions; and light emitting units arranged in one-to-one correspondence with the plurality of pixel regions. Each light emitting unit includes light emitting sub-units arranged in a plurality of rows and a plurality of columns, each row of light emitting sub-units includes a plurality of light emitting sub-units arranged along a row direction, each column of light emitting sub-units includes one light emitting sub-unit, and orthographic projections of light emitting regions of two adjacent columns of light emitting sub-units on a first straight line extending along a column direction are not overlapped; and in each light emitting unit, there is no gap between orthographic projections of the light emitting regions of the two adjacent columns of light emitting sub-units on a second straight line extending along the row direction.

公开(公告)号：US20210408168A1

公开(公告)日：2021-12-30

申请号：US16605493

申请日：2019-04-28

Applicant: BOE Technology Group Co., Ltd.

Inventor： Shuang LIANG ,  Yingwei LIU ,  Zhanfeng CAO ,  Zhiwei LIANG ,  Muxin DI

IPC: H01L27/32 ,  H01L41/113

Abstract: Disclosed herein is a photoelectric sensor, display panel and their manufacturing method. The photoelectric sensor may comprise a photodeformable unit and a piezoelectric unit in contact with the photodeformable unit.

公开(公告)号：US20220376137A1

公开(公告)日：2022-11-24

申请号：US17435016

申请日：2020-11-06

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Mingxing WANG ,  Binbin TONG ,  Lizhen ZHANG ,  Chenyang ZHANG ,  Zhen ZHANG ,  Xiawei YUN ,  Guangcai YUAN ,  Xue DONG ,  Muxin DI ,  Zhiwei LIANG ,  Ke WANG ,  Zhanfeng CAO

IPC: H01L33/38 ,  H01L33/46 ,  H01L33/62 ,  H01L33/00 ,  H01L25/075

Abstract: A light-emitting diode (LED) chip includes a plurality of epitaxial structures, at least one first electrode, and a plurality of second electrodes. Any two adjacent epitaxial structures of the plurality of epitaxial structures have a gap therebetween. Each epitaxial structure includes a first semiconductor pattern, a light-emitting pattern and a second semiconductor pattern stacked in sequence. First semiconductor patterns in at least two of the plurality of epitaxial structures are connected to each other to form a first semiconductor layer. A first electrode is electrically connected to the first semiconductor layer. Each second electrode is electrically connected to the second semiconductor pattern in at least one of the plurality of epitaxial structures.

公开(公告)号：US20220223775A1

公开(公告)日：2022-07-14

申请号：US17615075

申请日：2020-11-04

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Yingwei LIU ,  Zhanfeng CAO ,  Zhiwei LIANG ,  Ke WANG ,  Muxin DI ,  Shuang LIANG ,  Yankai GAO

IPC: H01L33/62 ,  H01L33/00 ,  H01L33/38 ,  H01L25/075 ,  G09F9/302

Abstract: A method of manufacturing a driving backplane for display includes: forming a first conductive pattern layer including first conductive lines on a base; and forming a second conductive pattern layer including electrode groups and second conductive lines on a side of the first conductive pattern layer away from the base. The first conductive lines and the second conductive lines cross and are insulated from each other; an electrode group includes a first electrode and a second electrode electrically connected to a corresponding second conductive line. Orthogonal projections, on the base, of the first electrode and a corresponding first conductive line have an overlapping region, and a portion of the first electrode, whose orthogonal projection on the base is located in the overlapping region, is in contact with a portion of the first conductive line, whose orthogonal projection on the base is located in the overlapping region.

公开(公告)号：US20220199862A1

公开(公告)日：2022-06-23

申请号：US17279488

申请日：2020-05-28

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Zhiwei LIANG ,  Yingwei LIU ,  Guoqiang WANG ,  Muxin DI ,  Ke WANG ,  Hsuanwei MAI ,  Zhanfeng CAO

IPC: H01L33/44 ,  H01L27/15

Abstract: Embodiments of the present disclosure provide an intermediate substrate, including: a first substrate; a black photoresist layer on a side of the first substrate; and a plurality of light emitting devices on a side of the black photoresist layer away from the first substrate. Each of the plurality of light emitting devices has a light-exiting side for emergence of light emitted by the light emitting device, the light-exiting side is in contact with the black photoresist layer, and the light emitting device includes a driving electrode for introducing a driving signal.

公开(公告)号：US20210043619A1

公开(公告)日：2021-02-11

申请号：US16920771

申请日：2020-07-06

Applicant: BOE Technology Group Co., Ltd.

Inventor： Yingwei LIU ,  Ke WANG ,  Zhiwei LIANG ,  Muxin DI ,  Zhanfeng CAO ,  Shuang LIANG ,  Guangcai YUAN ,  Qi YAO ,  Dongni LIU

IPC: H01L25/18 ,  H01L23/538 ,  H01L23/00 ,  H01L25/00

Abstract: Provided are a display structure and a preparation method thereof, and a display apparatus. The display structure includes a flexible back plate and a display substrate which are stacked, the flexible back plate including a bonding electrode for bonding to an integrated circuit chip, and the flexible back plate being bent to form a bent portion on which the bonding electrode is located.

公开(公告)号：US20230378414A1

公开(公告)日：2023-11-23

申请号：US18228281

申请日：2023-07-31

Applicant: BOE Technology Group Co., Ltd.

Inventor： Zhiwei LIANG ,  Yingwei LIU ,  Zhijun LV ,  Ke WANG ,  Zhanfeng CAO ,  Hsuanwei MAI ,  Guangcai YUAN ,  Muxin DI

IPC: H01L33/62 ,  H01L23/00 ,  H01L25/075

CPC classification number: H01L33/62 ,  H01L24/03 ,  H01L24/05 ,  H01L25/0753 ,  H01L2224/02166 ,  H01L2224/02185 ,  H01L2224/0219 ,  H01L2224/03013 ,  H01L2224/03462 ,  H01L2224/03614 ,  H01L2224/03622 ,  H01L2224/0401 ,  H01L2224/05017 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/0518 ,  H01L2933/0066

Abstract: A display backboard and a manufacturing method thereof, and a display device are provided. The display backboard includes: a driving substrate; a plurality of driving electrodes on the driving substrate; and a plurality of connection structures respectively on the plurality of driving electrodes. The connection structure includes: at least one conductive component on the driving electrode; and a restriction component on a side of the driving electrodes provided with the at least one conductive component and in at least a part of a peripheral region of the at least one conductive component. The restriction component protrudes from the driving electrode and has a first height in a direction perpendicular to the driving substrate.