公开(公告)号：US20150036562A1

公开(公告)日：2015-02-05

申请号：US14012239

申请日：2013-08-28

Applicant: BROADCOM CORPORATION

Inventor： Yaacov Sturkovich ,  Igal Yehuda Kushnir

IPC: H04L7/033 ,  H04B7/04

CPC classification number: H03L7/06 ,  H04B7/0413 ,  H04W56/00

Abstract: A method and system is provided for sharing of bandwidth on intermediate frequency cabling connections between indoor and outdoor units of a MIMO microwave communications system. Phase locked loop design assists in creating synchronization signals to be transmitted over the cable connecting the indoor units and outdoor units.

Abstract translation: 提供了一种用于在MIMO微波通信系统的室内和室外单元之间的中频布线连接上共享带宽的方法和系统。 锁相环设计有助于创建通过连接室内机和室外机的电缆传输的同步信号。

公开(公告)号：US20160204909A1

公开(公告)日：2016-07-14

申请号：US14614792

申请日：2015-02-05

Applicant: Broadcom Corporation

Inventor： Igal Yehuda Kushnir ,  Ido Mordechai Bettesh ,  Yaacov Sturkovich

IPC: H04L5/00

CPC classification number: H03L7/00

Abstract: A system and method for system, method and apparatus for phase hits and microphonics cancellation. In addition to a first RF synthesizer source, a device also includes a second stable reference signal source that operates at a lower frequency as compared to the RF synthesizer source. The second stable reference signal source is selected with good phase noise characteristics and can be used to correct phase error events.

Abstract translation: 用于相位匹配和麦克风取消的系统，方法和装置的系统和方法。 除了第一RF合成器源之外，器件还包括与RF合成器源相比在较低频率下操作的第二稳定参考信号源。 选择第二稳定参考信号源具有良好的相位噪声特性，可用于校正相位误差事件。

公开(公告)号：US20140291835A1

公开(公告)日：2014-10-02

申请号：US13852411

申请日：2013-03-28

Applicant: BROADCOM CORPORATION

Inventor： Sergei DEMIN ,  Shaul Klein ,  Igal Yehuda Kushnir

IPC: H01L23/498

CPC classification number: H01L23/66 ,  H01L24/73 ,  H01L2223/6627 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/15159 ,  H01L2924/15311 ,  H01P3/00 ,  H01P5/107 ,  H05K1/0243 ,  H05K2201/09072 ,  H01L2924/00012 ,  H01L2924/00

Abstract: Embodiments described herein include an integrated circuit (IC) device. For example, the IC device can include a substrate configured to be coupled to a printed circuit board (PCB), an IC die attached to the substrate, and a waveguide launcher formed on the substrate. The waveguide launcher is electrically coupled to the IC die through the substrate.

Abstract translation: 本文描述的实施例包括集成电路（IC）装置。 例如，IC器件可以包括被配置为耦合到印刷电路板（PCB）的基板，附着到基板的IC芯片和形成在基板上的波导发射器。 波导发射器通过衬底电耦合到IC管芯。

公开(公告)号：US09407271B2

公开(公告)日：2016-08-02

申请号：US14012239

申请日：2013-08-28

Applicant: BROADCOM CORPORATION

Inventor： Yaacov Sturkovich ,  Igal Yehuda Kushnir

IPC: H04B7/00 ,  H03L7/06 ,  H04B7/04 ,  H04W56/00

CPC classification number: H03L7/06 ,  H04B7/0413 ,  H04W56/00

Abstract: A method and system is provided for sharing of bandwidth on intermediate frequency cabling connections between indoor and outdoor units of a MIMO microwave communications system. Phase locked loop design assists in creating synchronization signals to be transmitted over the cable connecting the indoor units and outdoor units.

Abstract translation: 提供了一种用于在MIMO微波通信系统的室内和室外单元之间的中频布线连接上共享带宽的方法和系统。 锁相环设计有助于创建通过连接室内机和室外机的电缆传输的同步信号。

公开(公告)号：US09136230B2

公开(公告)日：2015-09-15

申请号：US13852411

申请日：2013-03-28

Applicant: Broadcom Corporation

Inventor： Sergei Demin ,  Shaul Klein ,  Igal Yehuda Kushnir

IPC: H01L23/498 ,  H01L23/66 ,  H01P3/00 ,  H01P5/107 ,  H05K1/02

CPC classification number: H01L23/66 ,  H01L24/73 ,  H01L2223/6627 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/15159 ,  H01L2924/15311 ,  H01P3/00 ,  H01P5/107 ,  H05K1/0243 ,  H05K2201/09072 ,  H01L2924/00012 ,  H01L2924/00

Abstract: Embodiments described herein include an integrated circuit (IC) device. For example, the IC device can include a substrate configured to be coupled to a printed circuit board (PCB), an IC die attached to the substrate, and a waveguide launcher formed on the substrate. The waveguide launcher is electrically coupled to the IC die through the substrate.

Abstract translation: 本文描述的实施例包括集成电路（IC）装置。 例如，IC器件可以包括被配置为耦合到印刷电路板（PCB）的基板，附着到基板的IC芯片和形成在基板上的波导发射器。 波导发射器通过衬底电耦合到IC管芯。