Abstract:
Tunneling-enhanced, floating gate semiconductor devices and methods for forming such devices are described. In one embodiment, a p-n junction device is formed with a floating gate that is partially doped with n- and p-type impurities. Two regions on either side of an n+ doped region in the floating gate and a surface region on a substrate are implanted with the impurities based on a number of predetermined configurations. In another embodiment, a transistor type semiconductor device is configured with implanted impurities in two regions of its floating gate as well as two surface regions in its substrate. Enhanced tunneling junction enables use of lower tunneling voltages in applications such as programming NVM cells.
Abstract:
A translation system for translating source text from a first language to target text in a second language. The system comprises a translation memory (TM) module that stores translation segments. The TM module is operable to generate a TM target text output in response to source text. A statistical translation machine (SMT) module is configured to generate translations on the basis of statistical models whose parameters are derived from the analysis of bilingual text corpora. The SMT module is operable to generate a SMT target text output in response to source text. An extractor is configured to extract features from the TM target text output and the SMT target text output. A vector generator is configured to generate a vector with a unified feature set derived from the extracted features and features associated with the SMT module and the TM module. A recommender is operable to read the vector and determine whether the TM target text output or the SMT target text output is optimum for post editing.
Abstract:
Two floating gate devices are arranged in a redundant configuration in a non-volatile memory (NVM) of a Radio Frequency Identification (RFID) tag such that stress induced leakage current (SILC) or other failures do not result in a complete loss of memory storage. The redundant NVM may be arranged as a series configuration, a parallel configuration, a single-ended device, a differential device, a simple logic circuit function, and/or a complex logic circuit function.
Abstract:
Two floating gate devices are arranged in a redundant configuration in a non-volatile memory (NVM) of a Radio Frequency Identification (RFID) tag such that stress induced leakage current (SILC) or other failures do not result in a complete loss of memory storage. The redundant NVM may be arranged as a series configuration, a parallel configuration, a single-ended device, a differential device, a simple logic circuit function, and/or a complex logic circuit function.
Abstract:
An integrated circuit metal oxide semiconductor device comprises a gate region and a dielectric layer positioned therein, wherein the dielectric layer is substantially free of germanium diffused therein from a silicon germanium layer of the device. The method comprises depositing a dummy replacement gate, subjecting the device to high temperature processing, removing the dummy gate, and then depositing a dielectric material and a final gate material within the formed gate region. Because the dielectric material is deposited after high temperature processing of the device, there is negligible diffusion of germanium into the dielectric material.
Abstract:
A method of fabricating a sub-micron MOS transistor includes preparing a substrate, including isolating an active region therein; depositing a gate oxide layer; depositing a first selective etchable layer over the gate oxide layer; depositing a second selective etchable layer over the first selective etchable layer; etching the structure to undercut the first selective etchable layer; implanting ions in the active region to form a source region and a drain region; depositing and planarizing the oxide; removing the remaining first selective etchable layer and the second selective etchable layer; depositing a gate electrode; and depositing oxide and metallizing the structure. A sub-micron MOS transistor includes a substrate; and an active region, including a gate region having a length of less than one micron; a source region including a LDD source region; and a drain region including a LDD drain region.
Abstract:
A method of fabricating a dual metal gate CMOS includes forming a gate oxide in a gate region and depositing a place-holder gate in each of a n-well and p-well; removing the place-holder gate and gate oxide; depositing a high-k dielectric in the gate region; depositing a first metal in the gate region of the p-well; depositing a second metal in the gate region of each of the n-well and p-well; and insulating and metallizing the structure. A dual metal gate CMOS of the invention includes PMOS transistor and a NMOS transistor. In the NMOS, a gate includes a high-k cup, a first metal cup formed in the high-k cup, and a second metal gate formed in the first metal cup. In the PMOS, a gate includes a high-k cup and a second metal gate formed in the high-k cup.
Abstract:
A thin film structure includes a substantially single-phase, c-axis PGO film on an insulator for use in metal ferroelectric insulator semiconductor single transistor non-volatile memory applications. The PGO on insulator structure can also be used in capacitors, pyroelectric infrared sensors, optical displays, optical switches, piezoelectric transducers, and surface acoustic wave devices. In a preferred embodiment, the PGO film is deposited on a Zirconium Oxide insulator layer.
Abstract:
A Schottky junction diode device having improved performance and a multiple well structure is fabricated in a conventional CMOS process. A substrate including a material doped to a first conductivity type is formed. A first well is disposed over the substrate. The first well includes a material doped differently, such as to a second conductivity type opposite that of the first conductivity type. A second well is disposed within the first well. A region of metal-containing material is disposed in the second well to form a Schottky junction at an interface between the region of metal-containing material and the second well. In one embodiment, a second well contact is disposed in a portion of the second well.
Abstract:
Apparatus, systems, and methods may include managing electrostatic discharge events in radio frequency identification (RFID) devices by using a semiconductor circuit having a non-aligned gate to implement a snap-back voltage protection mechanism. Such circuits may be formed by doping a semiconductor substrate to form a first conductive region as a well, forming one of a source region and a drain region in the well, depositing a layer of polysilicon on the substrate to establish a gating area that does not overlap the one of the source region and the drain region, and forming an integrated circuit including an RFID circuit that is supported by the substrate to couple to the one of the source region and the drain region to provide snap-back voltage operation at a node between the integrated circuit and the source or drain region. Additional apparatus, systems, and methods are disclosed.