Abstract:
A static random access memory with data controlled power supply, which comprises a memory cell circuit and at least one Write-assist circuit, for providing power to the memory cell circuit according to data to be written to the memory cell circuit.
Abstract:
A high load driving device is disclosed. The driving device comprises an inverter receiving a digital voltage. The inverter reverses the digital voltage, and then sends out it. The output terminal of the inverter is coupled to a capacitor, a first P-type field-effect transistor (FET), a second P-type FET, a first N-type FET, and a third N-type FET. A push-up circuit is composed of these transistors and a second N-type FET and coupled to a P-type push-up FET. A load is coupled to a high voltage through the P-type push-up FET. When the digital voltage rises from a low level to a high level, the push-up circuit utilizes the original voltage drop of the capacitor to control the P-type push-up FET, whereby the gate voltage of the P-type push-up FET is at a low stabilization voltage that is lower than the ground potential. Then, the load is driven rapidly.
Abstract:
A static memory cell is provided. The static memory cell includes a data latch circuit and a voltage provider. The data latch circuit is configured to store a bit data. The data latch circuit has a first inverter and a second inverter, and the first inverter and the second inverter are coupled to each other. The first inverter and the second inverter respectively receive a first voltage and a second voltage as power voltages. The voltage provider provides the first voltage and the second voltage to the data latch circuit. When the bit data is written to the data latch circuit, the voltage provider adjusts a voltage value of one of the first and second voltages according to the bit data.
Abstract:
A static random access memory with data controlled power supply, which comprises a memory cell circuit and at least one Write-assist circuit, for providing power to the memory cell circuit according to data to be written to the memory cell circuit.
Abstract:
The present invention proposes a gate oxide breakdown-withstanding power switch structure, which is connected with an SRAM and comprises a first CMOS switch and a second CMOS switch respectively having different gate-oxide thicknesses or different threshold voltages. The CMOS switch, which has a normal gate-oxide thickness or a normal threshold voltage, provides current for the SRAM to wake up the SRAM from a standby or sleep mode to an active mode. The CMOS switch, which has a thicker gate-oxide thickness or a higher threshold voltage, provides current for the SRAM to work in an active mode. The present invention prevents a power switch from gate-oxide breakdown lest noise margin, stabilization and performance of SRAM be affected.
Abstract:
A Random Access Memory (RAM) with a plurality of cells is provided. In an embodiment, the cells of a same column are coupled to a same pair of bit-lines and are associated to a same power controller. Each cell has two inverters; the power controller has two power-switches. For the cells of the same column, the two power-switches respectively perform independent supply voltage controls for the two inverters in each cell according to data-in voltages of the bit-lines during Write operation.
Abstract:
The present invention provides a Schmitt trigger-based FinFET static random access memory (SRAM) cell, which is an 8-FinFET structure. A FinFET has the functions of two independent gates. The new SRAM cell uses only 8 FinFET per cell, compared with the 10-FinFET structure in previous works. As a result, the cell structure of the present invention can save chip area and raise chip density. Furthermore, this new SRAM cell can effectively solve the conventional problem that the 6T SRAM cell is likely to have read errors at a low operating voltage.
Abstract:
Methods and apparatus are provided for varying one or more of a supply voltage and reference voltage in an integrated circuit, using independent control of a diode voltage in an asymmetrical double-gate device. An integrated circuit is provided that is controlled by one or more of a supply voltage and a reference voltage. The integrated circuit comprises an independently controlled asymmetrical double-gate device to adjust one or more of the supply voltage and the reference voltage. The independent control may comprise, for example, a back gate bias. The independently controlled asymmetrical double-gate device may be employed in a number of applications, including voltage islands, static RAM, and to improve the power and performance of a processing unit.
Abstract:
Techniques are provided for employing independent gate control in asymmetrical memory cells. A memory circuit, such as an SRAM circuit, can include a number of bit line structures, a number of word line structures that intersect the bit line structures to form a number of cell locations, and a number of asymmetrical memory cells located at the cell locations. Each of the asymmetrical cells can be selectively coupled to a corresponding one of the bit line structures under control of a corresponding one of the word line structures. Each of the cells can include a number of field effect transistors (FETS), and at least one of the FETS can be configured with separately biased front and back gates. One gate can be biased separately from the other gate in a predetermined manner to enhance read stability of the asymmetrical cell.
Abstract:
A cascaded pass-gate test circuit including interposed split-output drive devices provides accurate measurement of critical timing parameters of pass gates. The rise time and fall time of signals passed through the pass gate can be separately measured in a ring oscillator or one-shot delay line configuration. Inverters or other buffer circuits are provided as drive devices to couple the pass gates in cascade. The final complementary tree in each drive device is split so that the only one of the output pull-down transistor or pull-up transistor is connected to the next pass gate input, while the other transistor is connected to the output of the pass gate. The result is that the state transition associated with the device connected to the pass gate input is dominant in the delay, while the other state transition is propagated directly to the output of the pass gate, bypassing the pass gate.