Sensing Module for Light-Emitting Devices and Testing Apparatus Using the Same
    1.
    发明申请
    Sensing Module for Light-Emitting Devices and Testing Apparatus Using the Same 审中-公开
    用于发光装置的感应模块及其使用的测试装置

    公开(公告)号:US20110063608A1

    公开(公告)日:2011-03-17

    申请号:US12857036

    申请日:2010-08-16

    IPC分类号: G01N21/01

    摘要: A sensing module for light-emitting devices includes a substrate having at least one first hole and at least one second hole connected to the first hole, an optical device positioned in the first hole and configured to collect emitting lights from the light-emitting device to the first hole, a light-guiding device positioned in the second hole, a reflector positioned in the first hole and configured to reflect the emitting lights from the light-emitting device to the light-guiding device, and an optical coupler positioned at a front end of the substrate and coupled with the light-guiding device.

    摘要翻译: 一种用于发光器件的感测模块包括具有至少一个第一孔和连接到第一孔的至少一个第二孔的衬底,位于第一孔中的光学器件,其被配置成将从发光器件发出的光聚集到 所述第一孔,定位在所述第二孔中的导光装置,位于所述第一孔中的反射器,其被配置为将所述发光装置从所述发光装置反射到所述导光装置;以及光耦合器, 并且与导光装置耦合。

    Testing apparatus for light-emitting devices with a design for a removable sensing module
    2.
    发明授权
    Testing apparatus for light-emitting devices with a design for a removable sensing module 有权
    具有可移动感测模块设计的发光装置的测试装置

    公开(公告)号:US08389926B2

    公开(公告)日:2013-03-05

    申请号:US12857310

    申请日:2010-08-16

    IPC分类号: H01J5/02

    CPC分类号: G01N21/255

    摘要: A sensing module for light-emitting devices includes a circuit board having at least one retaining region configured to retain an optical sensor, at least one circuit configured to electrically connect the optical sensor to an output interface at a front end of the circuit board, a substrate positioned on the circuit board and having at least one aperture exposing the retaining regions, and an optical device positioned on the aperture and configured to collect emitting lights from a light-emitting device to the retaining region through the aperture.

    摘要翻译: 一种用于发光装置的感测模块包括电路板,该电路板具有被配置为保持光学传感器的至少一个保持区域,至少一个电路被配置为将光学传感器电连接到电路板的前端处的输出接口, 位于所述电路板上并具有暴露所述保持区域的至少一个孔的衬底,以及定位在所述孔上并被配置为收集从发光器件通过所述孔将光发射到所述保持区域的光学器件。

    Testing Apparatus for Light-Emitting Devices
    3.
    发明申请
    Testing Apparatus for Light-Emitting Devices 有权
    发光装置测试装置

    公开(公告)号:US20110062317A1

    公开(公告)日:2011-03-17

    申请号:US12857310

    申请日:2010-08-16

    IPC分类号: H01J40/14

    CPC分类号: G01N21/255

    摘要: A sensing module for light-emitting devices includes a circuit board having at least one retaining region configured to retain a optical sensor, at least one circuit configured to electrically connect the optical sensor to an output interface at a front end of the circuit board, a substrate positioned on the circuit board and having at least one aperture exposing the retaining regions, and an optical device positioned on the aperture and configured to collect emitting lights from a light-emitting device to the retaining region through the aperture.

    摘要翻译: 一种用于发光装置的感测模块包括具有至少一个保持区域的电路板,该保持区域被配置为保持光学传感器,至少一个电路被配置为将光学传感器电连接到电路板的前端处的输出接口, 位于所述电路板上并具有暴露所述保持区域的至少一个孔的衬底,以及定位在所述孔上并被配置为收集从发光器件通过所述孔将光发射到所述保持区域的光学器件。

    Heating apparatus for semiconductor devices
    4.
    发明授权
    Heating apparatus for semiconductor devices 有权
    半导体器件加热装置

    公开(公告)号:US07675307B2

    公开(公告)日:2010-03-09

    申请号:US12050204

    申请日:2008-03-18

    IPC分类号: G01R31/28

    摘要: A heating apparatus for semiconductor devices comprises an oven including a front wall having a plurality of front openings and a back wall having a plurality of back openings each with isolating self-closing doors, a carrier module configured to load semiconductor devices into the oven through the front opening in a removable manner, a temperature-controlling module configured to control the temperature of the oven, and a test module positioned at a backside of the oven and configured to generate, receive or switch electrical test signals for the semiconductor devices in the oven.

    摘要翻译: 一种用于半导体器件的加热装置包括一个烤箱,其包括具有多个前开口的前壁和具有多个后开口的后壁,每个后开口均具有隔离自闭门,载体模块配置成通过 可拆卸方式的前开口,配置成控制烤箱温度的温度控制模块和位于烤箱后侧的测试模块,并且被配置为产生,接收或切换烤箱中半导体器件的电测试信号 。

    HEATING APPARATUS FOR SEMICONDUCTOR DEVICES
    5.
    发明申请
    HEATING APPARATUS FOR SEMICONDUCTOR DEVICES 有权
    加热装置用于半导体器件

    公开(公告)号:US20090237102A1

    公开(公告)日:2009-09-24

    申请号:US12050204

    申请日:2008-03-18

    IPC分类号: F27B9/02 G01R33/26

    摘要: A heating apparatus for semiconductor devices comprises an oven including a front wall having a plurality of front openings and a back wall having a plurality of back openings each with isolating self-closing doors, a carrier module configured to load semiconductor devices into the oven through the front opening in a removable manner, a temperature-controlling module configured to control the temperature of the oven, and a test module positioned at a backside of the oven and configured to generate, receive or switch electrical test signals for the semiconductor devices in the oven.

    摘要翻译: 一种用于半导体器件的加热装置包括一个烤箱,其包括具有多个前开口的前壁和具有多个后开口的后壁,每个后开口均具有隔离自闭门,载体模块配置成通过 可拆卸方式的前开口,配置成控制烤箱温度的温度控制模块和位于烤箱后侧的测试模块,并且被配置为产生,接收或切换烤箱中半导体器件的电测试信号 。

    High-precision semiconductor device probing apparatus and system thereof
    6.
    发明授权
    High-precision semiconductor device probing apparatus and system thereof 有权
    高精度半导体器件探测装置及其系统

    公开(公告)号:US09329205B2

    公开(公告)日:2016-05-03

    申请号:US13425170

    申请日:2012-03-20

    IPC分类号: G01R1/067 G01R1/073 G01R31/28

    摘要: A high precision semiconductor probing system includes a probe head, a circuit board positioned above the probe head, and an optical microscope, wherein the probe head has a plurality of vertical probes and at least one cantilever probe having a vertical body positioned therein. The cantilever probe is disposed close to an edge of the probe head and extends laterally out from the probe head, in order to facilitate the visual alignment viewing from top of the probing apparatus. The optical microscope is positioned on top of the probing apparatus and is configured to have a line of sight directed to the tip of the cantilever probe.

    摘要翻译: 高精度半导体探测系统包括探针头,位于探针头上方的电路板和光学显微镜,其中探头具有多个垂直探针和至少一个垂直体定位在其中的悬臂探头。 悬臂探头靠近探头的边缘设置,并从探针头侧向伸出,以便于从探测装置的顶部观察视觉对准。 光学显微镜位于探测装置的顶部,并被配置成具有指向悬臂探针的尖端的视线。