公开(公告)号：US20170230011A1

公开(公告)日：2017-08-10

申请号：US15312717

申请日：2015-04-29

Applicant: CommScope Technologies LLC

Inventor： Sammit A. Patel ,  Yongjie Xu ,  Qiyun Gu ,  Richard W. Brown

IPC: H03F1/30 ,  H03F3/213 ,  H03F3/193 ,  H01L23/427 ,  H01L23/66 ,  H03F3/21 ,  H01L25/10 ,  H05K1/02 ,  H05K1/18 ,  H01L23/40 ,  H01L25/00 ,  H05K3/34 ,  H03F3/195 ,  H01L25/11

CPC classification number: H03F1/301 ,  H01L23/4006 ,  H01L23/427 ,  H01L23/66 ,  H01L29/7816 ,  H01L2023/4031 ,  H01L2023/4062 ,  H01L2023/4087 ,  H01L2223/6644 ,  H01L2924/0002 ,  H03F3/213 ,  H03F2200/411 ,  H03F2200/447 ,  H03F2200/451 ,  H05K1/0203 ,  H05K1/183 ,  H05K3/3421 ,  H05K3/3463 ,  H05K7/2029 ,  H05K7/20336 ,  H05K7/20936 ,  H05K2201/064 ,  H05K2201/09036 ,  H05K2201/09063 ,  H05K2201/10166 ,  H01L2924/00

Abstract: In one embodiment, an electronic system includes a printed circuit board, one or more packaged semiconductor devices, and a vapor chamber having a top and a bottom and enclosing a sealed cavity that is partially filled with a coolant. The vapor chamber comprises a thermo-conductive and electro-conductive material. The top of the vapor chamber has one or more depressions formed therein, each depression receiving and thermo-conductively connected to at least part of a bottom of a corresponding packaged semiconductor device, which is mounted through a corresponding aperture in the PCB. A heat sink may be thermo-conductively attached to the bottom of the vapor chamber.

公开(公告)号：US20230155699A1

公开(公告)日：2023-05-18

申请号：US17987031

申请日：2022-11-15

Applicant: CommScope Technologies LLC

Inventor： Chengcheng Tang ,  Sammit A. Patel ,  XiaoHua Hou

IPC: H04B17/21 ,  H04B17/11

CPC classification number: H04B17/21 ,  H04B17/11

Abstract: A method of calibrating an active antenna module that includes a radio and an active antenna unit is provide di which information is read from a data storage device that is mounted on the active antenna unit. The radio is connected to the active antenna unit. The radio is calibrated using the information read from the data storage device.

公开(公告)号：US10103692B2

公开(公告)日：2018-10-16

申请号：US15312717

申请日：2015-04-29

Applicant: CommScope Technologies LLC

Inventor： Sammit A. Patel ,  Yongjie Xu ,  Qiyun Gu ,  Richard W. Brown

IPC: H03F1/30 ,  H05K7/20 ,  H01L23/427 ,  H05K3/34 ,  H05K1/18 ,  H03F3/213 ,  H01L23/66 ,  H05K1/02 ,  H01L23/40 ,  H01L29/78

Abstract: In one embodiment, an electronic system includes a printed circuit board, one or more packaged semiconductor devices, and a vapor chamber having a top and a bottom and enclosing a sealed cavity that is partially filled with a coolant. The vapor chamber comprises a thermo-conductive and electro-conductive material. The top of the vapor chamber has one or more depressions formed therein, each depression receiving and thermo-conductively connected to at least part of a bottom of a corresponding packaged semiconductor device, which is mounted through a corresponding aperture in the PCB. A heat sink may be thermo-conductively attached to the bottom of the vapor chamber.