Optical coupling assemblies for coupling optical cables to silicon-based laser sources

    公开(公告)号:US10168492B2

    公开(公告)日:2019-01-01

    申请号:US15014560

    申请日:2016-02-03

    Abstract: Optical coupling assemblies for silicon-based optical sources are disclosed. In one embodiment, an optical coupling assembly includes an optical coupling carrier frame and a jumper cable assembly. The optical coupling carrier frame includes a frame portion defining an integrated circuit opening operable to receive an integrated circuit assembly, and a connector portion extending from the frame portion. The connector portion includes a channel operable to receive an optical connector of an optical cable assembly. The jumper cable assembly is disposed within the connector portion. The jumper cable assembly includes a plurality of jumper optical fibers, a jumper ferrule coupled to a first end of the plurality of jumper optical fibers, and an optical turn assembly coupled to a second end of the plurality of jumper optical fibers. The optical turn assembly is operable to optically turn optical signals propagating within the optical turn assembly.

    OPTICAL COUPLING ASSEMBLIES FOR COUPLING OPTICAL CABLES TO SILICON-BASED LASER SOURCES
    2.
    发明申请
    OPTICAL COUPLING ASSEMBLIES FOR COUPLING OPTICAL CABLES TO SILICON-BASED LASER SOURCES 审中-公开
    用于将光电耦合到基于硅的激光源的光耦合组件

    公开(公告)号:US20160231513A1

    公开(公告)日:2016-08-11

    申请号:US15014560

    申请日:2016-02-03

    Abstract: Optical coupling assemblies for silicon-based optical sources are disclosed. In one embodiment, an optical coupling assembly includes an optical coupling carrier frame and a jumper cable assembly. The optical coupling carrier frame includes a frame portion defining an integrated circuit opening operable to receive an integrated circuit assembly, and a connector portion extending from the frame portion. The connector portion includes a channel operable to receive an optical connector of an optical cable assembly. The jumper cable assembly is disposed within the connector portion. The jumper cable assembly includes a plurality of jumper optical fibers, a jumper ferrule coupled to a first end of the plurality of jumper optical fibers, and an optical turn assembly coupled to a second end of the plurality of jumper optical fibers. The optical turn assembly is operable to optically turn optical signals propagating within the optical turn assembly.

    Abstract translation: 公开了一种用于硅基光源的光耦合组件。 在一个实施例中,光耦合组件包括光耦合支架框架和跳线电缆组件。 光耦合载体框架包括限定可操作以接收集成电路组件的集成电路开口的框架部分和从框架部分延伸的连接器部分。 连接器部分包括可操作以接收光缆组件的光连接器的通道。 跳线电缆组件设置在连接器部分内。 跳线电缆组件包括多个跳线光纤,耦合到多个跳线光纤的第一端的跳线套圈以及耦合到多个跨接光纤的第二端的光学转向组件。 光学旋转组件可操作以光学地旋转在光学转向组件内传播的光学信号。

    CONTROLLED-CONTACT METHOD OF MEASURING INSERTION LOSS IN OPTICAL FIBER CONNECTORS
    3.
    发明申请
    CONTROLLED-CONTACT METHOD OF MEASURING INSERTION LOSS IN OPTICAL FIBER CONNECTORS 有权
    光纤连接器测量插入损失的控制接触方法

    公开(公告)号:US20160091392A1

    公开(公告)日:2016-03-31

    申请号:US14501542

    申请日:2014-09-30

    CPC classification number: G01M11/30 G01M11/33 G02B6/385

    Abstract: A controlled-contact method of measuring an insertion loss of a compressible DUT having a first ferrule with a first optical fiber and a first end face is disclosed. The method utilizes a compressible reference connector having a second ferrule with a second optical fiber and a second end face. The method includes: axially aligning the first and second ferrules to define a gap with an axial gap distance of greater than 150 μm; moving the reference connector at a connector velocity in the range from 1 mm/s to 5 mm/s; when the gap distance is less than 150 μm, reducing the connector velocity to between 10 μm/s and 500 μm/s until contact while continuing to measure the coupled optical power; after contact, increasing the connector velocity as the reference and DUT connector axially compress. The insertion loss is determined from ongoing measurements of the coupled optical power.

    Abstract translation: 公开了一种用第一光纤和第一端面测量具有第一套圈的可压缩DUT的插入损耗的受控接触方法。 该方法利用具有带有第二光纤和第二端面的第二套圈的可压缩参考连接器。 该方法包括:轴向对准第一和第二套圈以限定具有大于150μm的轴向间隙距离的间隙; 以1 mm / s至5 mm / s范围内的连接器速度移动参考连接器; 当间隙距离小于150μm时,将连接器速度降低到10μm/ s至500μm/ s之间,直到接触,同时继续测量耦合的光功率; 接触后,增加作为参考和DUT连接器轴向压缩的连接器速度。 插入损耗由耦合光功率的持续测量来确定。

    Laminated glass bend optical interconnection apparatus and methods

    公开(公告)号:US10422950B2

    公开(公告)日:2019-09-24

    申请号:US15890607

    申请日:2018-02-07

    Abstract: The optical interconnection apparatus includes a laminated structure having an inner glass sheet, an adhesive layer, and an outer glass sheet. The laminated structure has a first bend section with bend angle and front and back opposite ends. An optical fiber is operably supported by the laminated structure so that it has a second bend section that follows the first bend section. The front end of the optical fiber resides proximate to the front end of the laminated structure and the back end of the optical fiber resides proximate to the back end of the laminated structure. The first bend section is formed by bending the laminated structure and then curing the adhesive. A protective coating can be deposited over the optical fiber and a portion of the laminated structure.

    Optical-electrical printed circuit boards with integrated optical waveguide arrays and photonic assemblies using same

    公开(公告)号:US10234644B1

    公开(公告)日:2019-03-19

    申请号:US15789132

    申请日:2017-10-20

    Abstract: The optical-electrical printed circuit board disclosed herein includes a waveguide link assembly and a printed circuit board assembly. The printed circuit board assembly has first and second PCB layers between which optical waveguides of the waveguide link assembly are disposed. The end faces the optical waveguides are accessible through an access aperture in the printed circuit board assembly. An optical interconnector can be used to optically connect the optical waveguides to waveguides of an optical-electrical integrated circuit operably disposed on the printed circuit board assembly to form a photonic device. A waveguide bending structure can be used to bend the optical waveguides to facilitate optical coupling to the optical interconnector or directly to the waveguides of the optical-electrical integrated circuit. Methods of forming an optical-electrical printed circuit board, a photonic assembly and a photonic device are also disclosed.

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