公开(公告)号：US4902237A

公开(公告)日：1990-02-20

申请号：US331214

申请日：1989-03-30

Applicant: Curtis L. Huetson

Inventor： Curtis L. Huetson

IPC: H01R12/57 ,  H05K3/30 ,  H05K3/34 ,  H05K13/04

CPC classification number: H05K13/046 ,  H05K3/301 ,  H05K3/308 ,  H05K3/3426 ,  H05K2201/09954 ,  H05K2201/10295 ,  H05K2201/1031 ,  H05K2201/10325 ,  H05K2201/10636 ,  H05K2201/10651 ,  H05K2201/10962 ,  H05K3/3447 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49149

Abstract: An adaptor for interfacing a surface mount or through-hole electrical component to a printed circuit board. In one orientation of the adaptor relative to the printed circuit board, the adaptor receives a through-hole component and interfaces this component to a printed circuit board position designed for a surface mount component. In another orientation of the adaptor relative to the printed circuit board, the adaptor receives a surface mount component and interfaces this component to a printed circuit board position designed for a through-hole component. Advantageously, the adaptor is compatible with high-volume assembly techniques, such as wave soldering and machine insertion.

Abstract translation: 用于将表面安装或通孔电气部件连接到印刷电路板的适配器。 在适配器相对于印刷电路板的一个方向上，适配器接收通孔部件并将该部件接合到为表面安装部件设计的印刷电路板位置。 在适配器相对于印刷电路板的另一方向，适配器接收表面安装部件并将该部件接合到为通孔部件设计的印刷电路板位置。 有利的是，适配器与诸如波峰焊接和机器插入之类的大容量装配技术兼容。

公开(公告)号：US5414219A

公开(公告)日：1995-05-09

申请号：US232791

申请日：1994-04-22

Applicant: Curtis L. Huetson ,  Rick D. Jussel

Inventor： Curtis L. Huetson ,  Rick D. Jussel

IPC: H05K1/00 ,  H05K1/11

CPC classification number: H05K1/0293 ,  H05K1/11 ,  H05K2201/0305 ,  H05K2201/09381 ,  H05K2203/173 ,  H05K2203/175

Abstract: A circuit control device includes two intermating foil pads separated from one another by a narrow gap having a maximum dimension of 0.006 inches. A circuit path having one side connected to one of the pads and a second side connected to the other of the pads is selectively closed and opened by solder application and removal operations. Interdigitated, triangular fingers which are intermated to form the device ensure the formation of acutely angled junctures along the gap to ensure solder bridging of the gap. Emergency control elements are coupled to the circuit control device to permit control of an associated circuit path if the circuit control device itself fails. In that event, an emergency control device is coupled to the emergency control elements to control opening and closing of the circuit path.

Abstract translation: 电路控制装置包括通过具有0.006英寸的最大尺寸的窄间隙彼此分离的两个相互隔离的箔片垫。 具有连接到一个焊盘的一侧的电路路径和连接到另一焊盘的第二侧通过焊料施加和去除操作选择性地闭合和打开。 交错的三角形指状物，以便形成该装置，确保沿间隙形成锐角接合部，以确保间隙的焊接桥接。 如果电路控制装置自身失效，紧急控制元件被耦合到电路控制装置以允许控制相关联的电路路径。 在这种情况下，紧急控制装置耦合到应急控制元件以控制电路路径的打开和关闭。

公开(公告)号：US4624302A

公开(公告)日：1986-11-25

申请号：US626793

申请日：1984-07-02

Applicant: John R. Hayden ,  Curtis L. Huetson

Inventor： John R. Hayden ,  Curtis L. Huetson

IPC: B23K1/20 ,  H05K3/34 ,  H01L23/40 ,  F28F13/00

CPC classification number: H05K3/3494 ,  B23K1/20 ,  B23K2201/40 ,  H01L2924/0002 ,  H05K2203/111 ,  H05K2203/1581 ,  Y10S269/903

Abstract: A heating device is disclosed wherein a printed circuit board is uniformly preheated before discrete electronic components are soldered onto the boards. The soldering process includes a reflow stage where the boards are subject to rapid temperature change causing internal heat stresses which warp the boards if they haven't been preheated. The device comprises a non-conductive body and conductive elements, such as steel staples, embedded in said body. The staples extend through both sides of said body making contact with a heating surface and supporting the printed circuit board which sits upon them. The staples are spaced and arranged so the components' electrical pins which extend beyond the bottom surface of the board pass into the bed of staples without interference. Therefore, heat is transferred from the heating surface directly to the board via the conducting staples in a uniform fashion.

Abstract translation: 公开了一种加热装置，其中在离散的电子部件被焊接到板之前，印刷电路板被均匀地预热。 焊接过程包括回流阶段，其中板受到快速的温度变化，导致内部热应力，如果板未被预热则翘曲板。 该装置包括非导电体和嵌入所述体内的诸如钢钉的导电元件。 订书钉延伸穿过所述主体的两侧，与加热表面接触并支撑其上的印刷电路板。 订书针间隔开并布置成使得延伸超过板的底表面的组件电脚进入订书钉床而不受干扰。 因此，以均匀的方式，热量通过导电订书钉从加热面直接传递到基板。