公开(公告)号：US20140356657A1

公开(公告)日：2014-12-04

申请号：US14288684

申请日：2014-05-28

Applicant: DENSO CORPORATION

Inventor： Hiroyoshi YAMAMOTO ,  Yoshimitsu INOUE ,  Takashi KAWASHIMA

IPC: H01M10/63

CPC classification number: H01M10/613 ,  H01M2/206 ,  H01M10/482 ,  H01M10/486 ,  H01M10/625 ,  H01M10/63 ,  H01M10/647 ,  H01M10/655 ,  H01M10/6553 ,  H01M10/6563 ,  H01M2220/20

Abstract: The battery pack includes battery cells, bus bars provided for electrical connection among the battery cells, a fluid device that passes a heat transfer medium for exchanging beat with the bus bars or the battery cells, and a control device that obtains data on the bus bars or the battery cells and controls the fluid device based on the obtained data.

Abstract translation: 电池组包括电池单元，用于电池单元之间的电连接的汇流条，通过用于与汇流条或电池单元交换搏动的传热介质的流体装置，以及获取母线上的数据的控制装置 或电池单元，并且基于获得的数据来控制流体装置。

公开(公告)号：US20230034353A1

公开(公告)日：2023-02-02

申请号：US17964163

申请日：2022-10-12

Applicant: DENSO CORPORATION

Inventor： Tatsuki NISHIMATA ,  Takashi KAWASHIMA ,  Hajime OYANAGI

IPC: H01H45/12 ,  B60R16/02 ,  H01H45/14 ,  H02J1/00 ,  H05K7/20

Abstract: A power distribution device has a resin part covering a portion of a power line and a portion of a signal line and having a switch adjacent to one surface of the resin part, and a cooling part disposed adjacent to a back surface of the resin part opposite to the one surface. The power line and the signal line each have, inside the resin part, a laid-out portion extending in a planar direction orthogonal to an arrangement direction in which the one surface and the back surface are arranged, and a led-out portion extending from the laid-out portion toward the one surface. The laid-out portion of the power line and the laid-out portion of the signal line are located in a projection area of the cooling unit projected in the arrangement direction, and are separated from each other and arranged in the arrangement direction.

公开(公告)号：US20180070480A1

公开(公告)日：2018-03-08

申请号：US15695825

申请日：2017-09-05

Applicant: DENSO CORPORATION ,  TOKIN CORPORATION

Inventor： Naoki HIRASAWA ,  Ryota TANABE ,  Takashi KAWASHIMA ,  Takashi YANBE ,  Masahiro KONDOU

IPC: H05K7/20

CPC classification number: H05K7/20927 ,  B60L15/007 ,  B60L2210/10 ,  B60L2270/142 ,  B60L2270/145 ,  H01L23/473 ,  H05K7/20263 ,  H05K7/20854

Abstract: A power conversion apparatus includes: a semiconductor module, an electronic component, a plurality of cooling pipes and a casing that accommodates the semiconductor module, the electronic component and the cooling pipes. An abutting surface is provided at a part of the casing, in which the electronic component comes into contact with the abutting surface. A pressurizing member pressurizes the semiconductor module in a first direction extending from the semiconductor module to the electronic component. The electronic component includes a part body and a wing portion and the wing portion protrudes from the part body at least either one side of both sides thereof with respect to a second direction perpendicular to the first direction, and comes into contact with the abutting surface from a semiconductor module side with respect to the first direction.

公开(公告)号：US20250095938A1

公开(公告)日：2025-03-20

申请号：US18965411

申请日：2024-12-02

Applicant: DENSO CORPORATION ,  DENSO ELECTRONICS CORPORATION

Inventor： Ryota KUNIYOSHI ,  Tomohiro YASUDA ,  Shingo KURITA ,  Takashi KAWASHIMA ,  Hiroshi NAGURA

IPC: H01H50/18 ,  H01H50/02 ,  H01H50/36

Abstract: An electromagnetic relay includes a sealed housing, a fixed contact, a movable element having a movable contact, a shaft, a movable core, a fixed core, a return spring, an electromagnetic coil and a sleeve. The shaft is slidably inserted in a through-hole formed in the fixed core. The sleeve has a support part supporting the movable core so as to define a position of the movable core relative to the fixed core when no magnetic attraction acts therebetween. At a front end of the sleeve, there is formed a position adjustment part for adjusting a positional relationship between the fixed core and the support part during the direct or indirect fixing of the sleeve to the fixed core.

公开(公告)号：US20230347746A1

公开(公告)日：2023-11-02

申请号：US18350254

申请日：2023-07-11

Applicant: DENSO CORPORATION

Inventor： Koichi UMEDA ,  Tatsuki NISHIMATA ,  Takashi KAWASHIMA

IPC: B60L3/04 ,  H01H50/12 ,  B60L50/60 ,  H02J7/00 ,  H05K7/20

CPC classification number: B60L3/04 ,  H01H50/12 ,  B60L50/60 ,  H02J7/0042 ,  H05K7/20272 ,  B60L2210/10

Abstract: A power distribution device comprises a system main relay, i.e., SMR, a pre-charge circuit and a control board. The SMR selects between on and off of a current between a power conversion device and a battery. The pre-charge circuit includes a charge resistor and a charge switch which are provided to charge the smoothing capacitor with power supplied from the battery. The control board enables a current smaller than a current flowing through the SMR. The SMR and the control board are arranged in the x-direction via the pre-charge circuit.

公开(公告)号：US20170141082A1

公开(公告)日：2017-05-18

申请号：US15353009

申请日：2016-11-16

Applicant: DENSO CORPORATION

Inventor： Naoki HIRASAWA ,  Ryota TANABE ,  Hiromi ICHIJO ,  Takashi KAWASHIMA

IPC: H01L25/065 ,  H01L23/053 ,  B60L11/18 ,  H02M7/00 ,  H05K7/20 ,  H01L23/473 ,  H01L23/32

CPC classification number: H01L25/0657 ,  B60L11/1874 ,  H01L23/053 ,  H01L23/32 ,  H01L23/473 ,  H01L2225/06555 ,  H01L2225/06582 ,  H01L2225/06589 ,  H02M7/003 ,  H02M2001/327 ,  H05K7/20927

Abstract: An electric power converter includes a semiconductor module, an electronic component, a plurality of cooling tubes, a case, a main pressure member for pressing a stacked semiconductor section in a stacking direction, and a sub-pressure member for pressing a stacked component section in the stacking direction. The stacked semiconductor section and the stacked component section are stacked in line. A pressing force of the main pressure member is greater than a pressure pressing force of the sub-pressure member. The main pressure member is disposed at an end portion of the stacked component section far from the stacked semiconductor section. A supporting portion that supports the stacked semiconductor section from the stacked component section side is disposed in the case so as to prevent the pressing force of the main pressure member from acting on the stacked component section.