公开(公告)号：US09608577B2

公开(公告)日：2017-03-28

申请号：US14033960

申请日：2013-09-23

Applicant: DSP Group, Ltd.

Inventor： Alexander Mostov ,  Sergey Anderson ,  Udi Suissa ,  Ilya Sima ,  Avi Bauer

IPC: H03F1/56 ,  H01F38/14 ,  H03F3/213 ,  H03F3/195 ,  H02M3/156 ,  H02M3/04 ,  H01F27/28 ,  H01F27/29 ,  H01F38/00 ,  H03F3/19 ,  H03F3/21 ,  H03F3/68 ,  H03F3/193 ,  H04B1/44 ,  H01F19/04 ,  H03F1/02 ,  H03F3/45 ,  H01L23/522 ,  H01L23/64 ,  H01L23/66 ,  H02M1/00

CPC classification number: H03F1/565 ,  H01F19/04 ,  H01F27/2804 ,  H01F27/29 ,  H01F38/00 ,  H01F38/14 ,  H01L23/5227 ,  H01L23/645 ,  H01L23/66 ,  H01L2223/6655 ,  H01L2223/6672 ,  H01L2924/0002 ,  H02M3/04 ,  H02M3/1563 ,  H02M2001/0012 ,  H03F1/0227 ,  H03F1/0261 ,  H03F3/19 ,  H03F3/193 ,  H03F3/195 ,  H03F3/21 ,  H03F3/211 ,  H03F3/213 ,  H03F3/45179 ,  H03F3/68 ,  H03F2200/102 ,  H03F2200/105 ,  H03F2200/387 ,  H03F2200/451 ,  H03F2200/534 ,  H03F2200/537 ,  H03F2200/541 ,  H04B1/44 ,  Y02D70/00 ,  H01L2924/00

Abstract: A novel and useful radio frequency (RF) front end module (FEM) circuit that provides high linearity and power efficiency and meets the requirements of modern wireless communication standards such as 802.11 WLAN, 3G and 4G cellular standards, Bluetooth, ZigBee, etc. The configuration of the FEM circuit permits the use of common, relatively low cost semiconductor fabrication techniques such as standard CMOS processes. The FEM circuit includes a power amplifier made up of one or more sub-amplifiers having high and low power circuits and whose outputs are combined to yield the total desired power gain. An integrated multi-tap transformer having primary and secondary windings arranged in a novel configuration provide efficient power combining and transfer to the antenna of the power generated by the individual sub-amplifiers.

公开(公告)号：US09667206B2

公开(公告)日：2017-05-30

申请号：US14602330

申请日：2015-01-22

Applicant: DSP Group LTD.

Inventor： Sergey Anderson ,  Alexander Mostov ,  Eli Schwartz ,  Ron Pongratz ,  Ilya Sima

IPC: H03F1/00 ,  H03F3/213 ,  H03F3/195 ,  H03F3/21 ,  H03F1/02 ,  B82Y10/00 ,  B82Y40/00

CPC classification number: H03F3/213 ,  B82Y10/00 ,  B82Y40/00 ,  H03F1/0216 ,  H03F3/195 ,  H03F3/211 ,  H03F3/245 ,  H03F2200/451 ,  H03F2200/504 ,  H03F2203/21106 ,  Y02D70/00

Abstract: A novel and useful radio frequency (RF) front end module (FEM) circuit that provides high linearity and power efficiency and meets the requirements of modern wireless communication standards such as 802.11 WLAN, 3G and 4G cellular standards, Bluetooth, ZigBee, etc. The configuration of the FEM circuit permits the use of common, relatively low cost semiconductor fabrication techniques such as standard CMOS processes. The FEM circuit includes a power amplifier made up of one or more sub-amplifiers having high and low power circuits and whose outputs are combined to yield the total desired power gain. An integrated multi-tap transformer having primary and secondary windings arranged in a novel configuration provide efficient power combining and transfer to the antenna of the power generated by the individual sub-amplifiers.

公开(公告)号：US20150070097A1

公开(公告)日：2015-03-12

申请号：US14540687

申请日：2014-11-13

Applicant: DSP Group, Ltd.

Inventor： Abraham Bauer ,  Eli Schwartz ,  Ilya Sima ,  Lior Blanka ,  Sergey Anderson ,  Ron Pongratz ,  Alex Mostov

IPC: H03F3/21 ,  H04B1/04 ,  H04W88/06 ,  H03F1/02 ,  H03F3/193

CPC classification number: H03F3/211 ,  H03F1/02 ,  H03F1/0227 ,  H03F1/0261 ,  H03F3/19 ,  H03F3/193 ,  H03F3/21 ,  H03F3/24 ,  H03F3/45179 ,  H03F2200/102 ,  H03F2200/105 ,  H03F2200/451 ,  H03F2200/534 ,  H03F2200/537 ,  H03F2200/541 ,  H04B1/04 ,  H04B2001/045 ,  H04W88/06

Abstract: A novel and useful configurable radio frequency (RF) power amplifier (PA) and related front end module (FEM) circuit that enables manipulation of the operating point of the power amplifier resulting in configurability, multimode and multiband operating capability. The configurable PA also provides high linearity and power efficiency and meets the requirements of modern wireless communication standards such as 802.11 WLAN, 3G and 4G cellular standards, Bluetooth, ZigBee, etc. The configurable power amplifier is made up of one or more configurable sub-amplifiers having each constructed to have several orders of freedom (i.e. biasing points). Each sub-amplifier and its combiner path include active and passive elements. Manipulating one or more biasing points of each sub-amplifier, and therefore of the aggregate power amplifier as well, achieves multimode and multiband operation. Biasing points include, for example, the gain and saturation point, frequency response, linearity level and EVM. An integrated multi-tap transformer having primary and secondary windings arranged in a novel configuration provides efficient power combining and transfer to the antenna of the power generated by the individual sub-amplifiers.

Abstract translation: 一种新颖有用的可配置射频（RF）功率放大器（PA）和相关的前端模块（FEM）电路，可以对功率放大器的工作点进行操作，从而实现可配置性，多模和多频带操作能力。 可配置PA还提供高线性度和功率效率，并满足现代无线通信标准（如802.11 WLAN，3G和4G蜂窝标准，蓝牙，ZigBee等）的要求。可配置功率放大器由一个或多个可配置子系统组成， 每个放大器被构造成具有几个自由度（即偏置点）。 每个子放大器及其组合器路径包括有源和无源元件。 操纵每个子放大器的一个或多个偏置点，并因此操纵集成功率放大器，实现多模和多频带操作。 偏移点包括例如增益和饱和点，频率响应，线性度和EVM。 具有以新颖配置布置的初级和次级绕组的集成多抽头变压器提供了由各个子放大器产生的功率的有效功率组合和传输到天线。

公开(公告)号：US20170070199A1

公开(公告)日：2017-03-09

申请号：US15268598

申请日：2016-09-18

Applicant: DSP Group LTD.

Inventor： Sergey Anderson ,  Ron Pongratz ,  Eli Schwartz ,  Ilya Sima

IPC: H03F3/213 ,  H04B1/04 ,  H03F1/02 ,  H03F3/195 ,  H03F3/21

CPC classification number: H03F3/213 ,  B82Y10/00 ,  B82Y40/00 ,  H03F1/02 ,  H03F1/0216 ,  H03F1/0227 ,  H03F1/0261 ,  H03F3/195 ,  H03F3/211 ,  H03F3/24 ,  H03F3/245 ,  H03F3/265 ,  H03F2200/102 ,  H03F2200/18 ,  H03F2200/294 ,  H03F2200/432 ,  H03F2200/451 ,  H03F2200/504 ,  H03F2200/534 ,  H03F2200/537 ,  H03F2200/541 ,  H03F2203/21106 ,  H03F2203/21142 ,  H04B1/0475 ,  H04B1/44 ,  H04B2001/045

Abstract: An integrated circuit that includes a die with an active radio frequency (RF) unit embedded thereon; a first port for receiving an output signal from the active RF unit; a harmonic filter that comprises a first harmonic filter inductor; and a first RF inductive load that is electrically coupled to the first port and is magnetically coupled to the first harmonic filter inductor.

公开(公告)号：US20150194942A1

公开(公告)日：2015-07-09

申请号：US14602330

申请日：2015-01-22

Applicant: DSP Group LTD.

Inventor： Sergey Anderson ,  Alexander Mostov ,  Eli Schwartz ,  Ron Pongratz ,  Ilya Sima

IPC: H03F3/213 ,  H03F3/21 ,  H03F1/02 ,  H03F3/195

CPC classification number: H03F3/213 ,  B82Y10/00 ,  B82Y40/00 ,  H03F1/0216 ,  H03F3/195 ,  H03F3/211 ,  H03F3/245 ,  H03F2200/451 ,  H03F2200/504 ,  H03F2203/21106 ,  Y02D70/00

Abstract: A novel and useful radio frequency (RF) front end module (FEM) circuit that provides high linearity and power efficiency and meets the requirements of modern wireless communication standards such as 802.11 WLAN, 3G and 4G cellular standards, Bluetooth, ZigBee, etc. The configuration of the FEM circuit permits the use of common, relatively low cost semiconductor fabrication techniques such as standard CMOS processes. The FEM circuit includes a power amplifier made up of one or more sub-amplifiers having high and low power circuits and whose outputs are combined to yield the total desired power gain. An integrated multi-tap transformer having primary and secondary windings arranged in a novel configuration provide efficient power combining and transfer to the antenna of the power generated by the individual sub-amplifiers.

Abstract translation: 一种新颖有用的射频（RF）前端模块（FEM）电路，提供高线性度和功率效率，并满足现代无线通信标准（如802.11 WLAN，3G和4G蜂窝标准，蓝牙，ZigBee等）的要求。 有限元电路的配置允许使用常见的，相对低成本的半导体制造技术，例如标准CMOS工艺。 FEM电路包括由具有高功率电路和低功率电路的一个或多个子放大器组成的功率放大器，并且其输出被组合以产生总的期望功率增益。 具有以新颖配置布置的初级和次级绕组的集成多抽头变压器提供了由各个子放大器产生的功率的有效功率组合和传输到天线。