摘要:
A pen-type computer peripheral device includes an elongated housing containing a PCBA having a plug connector and a fingerprint sensor mounted thereon. The PCBA is secured to a positioning member that is actuated by way of a press-push button that is exposed through a slot defined in a wall of the housing. By pressing and pushing (sliding) the press-push button along the slot, the fingerprint sensor and the plug connector are moved between a retracted position, in which the fingerprint sensor is positioned inside of the housing and the plug connector is covered by a portion of the housing wall, and a deployed position in which the fingerprint sensor is exposed through the slot and the plug connector extends through a front housing opening such that both the fingerprint sensor and the plug connector are exposed outside of the housing.
摘要:
A flash-memory drive replaces a hard-disk drive using an integrated device electronics (IDE) interface. The flash drive has a printed-circuit board assembly (PCBA) with a circuit board with flash-memory chips and a controller chip. The controller chip includes an input/output interface circuit to an external computer over the IDE interface, and a processing unit to read blocks of data from the flash-memory chips. The PCBA is encased inside an upper case and a lower case, with an IDE connector that fits through and opening between the cases. The cases can be assembled with the PCBA by a snap-together, ultrasonic-press, screw-fastener, or thermal-bond adhesive method. Center lines formed on the inside of the cases fit between rows of flash-memory chips to improve case rigidity. The connector has two rows of pins that straddle the center line of the circuit board for a balanced design.
摘要:
An MMC/SD core unit includes a PCBA in which all passive components and unpackaged IC chips are attached to a single side of a PCB opposite to the metal contacts. The IC chips include, for example, a controller chip and a flash memory chip, or a single-chip (combined controller/flash memory) chip. Multiple flash IC chips are optionally stacked to increase storage capacity. The IC chip(s) are attached to the PCB by wire bonding or other chip-on-board (COB) technique. The passive components are attached by conventional surface mount technology (SMT) techniques. A molded housing is then formed over the IC chips and passive components such that the device has a uniform thickness. The MMC/SD core unit is then inserted or otherwise mounted in an eternal casing to provide a finished MMC/SD device.
摘要:
A Universal-Serial-Bus (USB) device has a USB plug with reduced wobble. A USB metal wrap around the perimeter of the USB plug is attached to a housing by overmolding. A plug supporter is inserted into the front of the USB metal wrap, and has locking tabs that snap over the inside wall of the housing. Side tabs on the plug supporter fit into side slots on the USB metal wrap to secure the plug supporter inside the USB metal wrap. A circuit board with a USB flash controller has USB metal contacts on an extension end that is inserted through the housing and into the USB metal wrap. The extension end fits underneath top tabs on the plug supporter, preventing the extension end with the USB metal contacts from upward wobble when the USB plug is inserted into a USB socket.
摘要:
A case-grounded flash-memory drive has a printed-circuit board assembly (PCBA) with flash-memory chips and a controller chip. The PCBA is encased inside an upper case and a lower case, with a Serial AT-Attachment (SATA) connector that fits through and opening between the cases. The cases can be assembled with the PCBA by a snap-together, ultrasonic-press, screw-fastener, or thermal-bond adhesive method. Dual-axis case-grounding pins draw any electro-static-discharges (ESD) current off the upper case along a primary axis and onto a PCBA ground through a secondary axis washer that is screwed into the PCBA. The primary axis body of the dual-axis case-grounding pins fits around a PCBA notch while the secondary axis passes through a metalized alignment hole for grounding. When the SATA connector is inserted into a host, the host ground sinks ESD currents collected by the dual-axis case-grounding pins.
摘要:
A low-profile Universal-Serial-Bus (USB) device includes a PCBA in which all passive components and unpackaged IC chips are attached to a single side of a PCB opposite to the metal contacts. The IC chips include, for example, a USB controller chip and a flash memory chip, or a single-chip (combined USB controller/flash memory) chip. Multiple flash IC chips are optionally stacked to increase storage capacity. The IC chip(s) are attached to the PCB by wire bonding or other chip-on-board (COB) technique. The passive components are attached by conventional surface mount technology (SMT) techniques. A molded housing is then formed over the IC chips and passive components such that the device has a uniform thickness. The low-profile USB device is optionally used as a modular insert that is mounted onto a metal case to provide a USB assembly having a plug shell similar to a standard USB male connector.
摘要:
In an electronic data storage device accessed by a host computer motherboard, a fingerprint sensor scans a fingerprint of a user of the electronic data storage device and generates fingerprint scan data. A processing unit activates an input/output interface circuit to store a data file and fingerprint reference data obtained by scanning a fingerprint of a person authorized to access the data file in a memory device having non-volatile memory, where the processing unit transmits the data file to the host computer motherboard upon verifying that the user of the electronic data storage device is authorized to access the data file stored in the memory device as a result of comparison between the fingerprint scan data from the fingerprint sensor and the fingerprint reference data. Other methods and apparatuses are also described.
摘要:
A flash-memory device has a printed-circuit board assembly (PCBA) with a PCB with a flash-memory chip and a controller chip. The controller chip includes an external Secure-Digital (SD) interface, and a processing unit to read blocks of data from the flash-memory chip. The PCBA is encased inside an upper case and a lower case, with SD contact pads on the PCB that fit through contact openings in the upper case. Dividers between openings in the upper case that expose the SD contact pads also support the PCB at a slanted angle to the centerline of the device. The PCB slants upward at the far end to allow more thickness for the chips mounted to the bottom surface of the PCB, and slants downward at the insertion end to position the SD contact pads near the centerline. A metal switch-bar or an over-molded controller die may be substituted.
摘要:
A flash-memory device has a printed-circuit board assembly (PCBA) with a PCB with a flash-memory chip and a controller chip. The controller chip includes an external Secure-Digital (SD) interface, and a processing unit to read blocks of data from the flash-memory chip. The PCBA is encased inside an upper case and a lower case, with SD contact pads on the PCB that fit through contact openings in the upper case. Dividers between openings in the upper case that expose the SD contact pads also support the PCB at a slanted angle to the centerline of the device. The PCB slants upward at the far end to allow more thickness for the chips mounted to the bottom surface of the PCB. A user-slidable switch may be slanted to compensate for the PCB slant. The PCB may have a flex section to facilitate the slant without a slanted switch.
摘要:
A flash-memory device has a printed-circuit board assembly (PCBA) with a PCB with a flash-memory chip and a controller chip. The controller chip includes an input/output interface circuit to an external computer over a Secure-Digital (SD) interface, and a processing unit to read blocks of data from the flash-memory chip. The PCBA is encased inside an upper case and a lower case, with SD contact pads on the PCB that fit through contact openings in the upper case. Supporting end ribs under each of the SD contact pads and middle ribs support the PCB at a slanted angle to the centerline of the device. The PCB slants upward at the far end to allow more thickness for the chips mounted to the bottom surface of the PCB, and slants downward at the insertion end to position the SD contact pads near the centerline.