公开(公告)号：US20080003882A1

公开(公告)日：2008-01-03

申请号：US11846725

申请日：2007-08-29

申请人： Jim Ni ,  Abraham Ma ,  Paul Hsueh ,  Ming-Shiang Shen

发明人： Jim Ni ,  Abraham Ma ,  Paul Hsueh ,  Ming-Shiang Shen

IPC分类号： H01R13/66

CPC分类号： G06K19/07743 ,  A45C2011/188 ,  G06F12/1416 ,  G06F21/32 ,  G06F21/78 ,  G06K9/00087 ,  G06K19/07 ,  G06K19/07354 ,  G06K19/077 ,  G06K19/07732 ,  G07C9/00087 ,  H05K1/117 ,  H05K1/118 ,  H05K1/189 ,  H05K3/284 ,  H05K3/4691 ,  H05K2201/091 ,  H05K2201/10159 ,  H05K2203/1527

摘要： A flash-memory device has a printed-circuit board assembly (PCBA) with a PCB with a flash-memory chip and a controller chip. The controller chip includes an external Secure-Digital (SD) interface, and a processing unit to read blocks of data from the flash-memory chip. The PCBA is encased inside an upper case and a lower case, with SD contact pads on the PCB that fit through contact openings in the upper case. Dividers between openings in the upper case that expose the SD contact pads also support the PCB at a slanted angle to the centerline of the device. The PCB slants upward at the far end to allow more thickness for the chips mounted to the bottom surface of the PCB. A user-slidable switch may be slanted to compensate for the PCB slant. The PCB may have a flex section to facilitate the slant without a slanted switch.

摘要翻译： 闪存设备具有印刷电路板组件（PCBA），PCB组件具有闪存芯片和控制器芯片。 控制器芯片包括一个外部安全数字（SD）接口，以及一个处理单元，用于从闪存芯片中读取数据块。 PCBA被封装在上壳体和下壳体内，PCB上的SD接触垫通过上壳体中的接触开口配合。 暴露SD接触垫的上壳体中的开口之间的分隔线也以与设备中心线倾斜的角度支撑PCB。 PCB在远端向上倾斜，以便为安装在PCB底部表面的芯片提供更大的厚度。 用户可滑动的开关可以倾斜以补偿PCB倾斜。 PCB可以具有弯曲部分以便于倾斜而没有倾斜的开关。

公开(公告)号：US20070130414A1

公开(公告)日：2007-06-07

申请号：US11309844

申请日：2006-10-11

申请人： Jim Ni ,  Abraham Ma ,  Paul Hsueh ,  Ming-Shiang Shen

发明人： Jim Ni ,  Abraham Ma ,  Paul Hsueh ,  Ming-Shiang Shen

IPC分类号： G06F12/00

CPC分类号： G06K19/077 ,  G06F12/1416 ,  G06F21/32 ,  G06F21/78 ,  G06K9/00087 ,  G06K19/07 ,  G06K19/07354 ,  G06K19/07732 ,  G07C9/00087 ,  Y02D10/13

摘要： A flash-memory device has a printed-circuit board assembly (PCBA) with a PCB with a flash-memory chip and a controller chip. The controller chip includes an input/output interface circuit to an external computer over a Secure-Digital (SD) interface, and a processing unit to read blocks of data from the flash-memory chip. The PCBA is encased inside an upper case and a lower case, with SD contact pads on the PCB that fit through contact openings in the upper case. Supporting end ribs under each of the SD contact pads and middle ribs support the PCB at a slanted angle to the centerline of the device. The PCB slants upward at the far end to allow more thickness for the chips mounted to the bottom surface of the PCB, and slants downward at the insertion end to position the SD contact pads near the centerline.

摘要翻译： 闪存设备具有印刷电路板组件（PCBA），PCB组件具有闪存芯片和控制器芯片。 控制器芯片包括通过安全数字（SD）接口连接到外部计算机的输入/输出接口电路，以及从闪速存储器芯片读取数据块的处理单元。 PCBA被封装在上壳体和下壳体内，PCB上的SD接触垫通过上壳体中的接触开口配合。 在每个SD接触垫和中肋下的支撑端肋以与设备中心线倾斜的角度支撑PCB。 PCB在远端向上倾斜，以允许安装在PCB底部表面的芯片的厚度更大，并且在插入端向下倾斜以将SD接触垫定位在中心线附近。

公开(公告)号：US20080003883A1

公开(公告)日：2008-01-03

申请号：US11846733

申请日：2007-08-29

申请人： Jim Ni ,  Abraham Ma ,  Paul Hsueh ,  Ming-Shiang Shen

发明人： Jim Ni ,  Abraham Ma ,  Paul Hsueh ,  Ming-Shiang Shen

IPC分类号： H01R13/66

CPC分类号： G06K19/07743 ,  A45C2011/188 ,  G06F12/1416 ,  G06F21/32 ,  G06F21/78 ,  G06K9/00087 ,  G06K19/07 ,  G06K19/07354 ,  G06K19/077 ,  G06K19/07732 ,  G07C9/00087 ,  H05K1/117 ,  H05K1/118 ,  H05K1/189 ,  H05K3/284 ,  H05K3/4691 ,  H05K2201/091 ,  H05K2201/10159 ,  H05K2203/1527

摘要： A flash-memory device has a printed-circuit board assembly (PCBA) with a PCB with a flash-memory chip and a controller chip. The controller chip includes an external Secure-Digital (SD) interface, and a processing unit to read blocks of data from the flash-memory chip. The PCBA is encased inside an upper case and a lower case, with SD contact pads on the PCB that fit through contact openings in the upper case. Dividers between openings in the upper case that expose the SD contact pads also support the PCB at a slanted angle to the centerline of the device. The PCB slants upward at the far end to allow more thickness for the chips mounted to the bottom surface of the PCB, and slants downward at the insertion end to position the SD contact pads near the centerline. A metal switch-bar or an over-molded controller die may be substituted.

摘要翻译： 闪存设备具有印刷电路板组件（PCBA），PCB组件具有闪存芯片和控制器芯片。 控制器芯片包括一个外部安全数字（SD）接口，以及一个处理单元，用于从闪存芯片中读取数据块。 PCBA被封装在上壳体和下壳体内，PCB上的SD接触垫通过上壳体中的接触开口配合。 暴露SD接触垫的上壳体中的开口之间的分隔线也以与设备中心线倾斜的角度支撑PCB。 PCB在远端向上倾斜以允许安装到PCB的底表面的芯片具有更大的厚度，并且在插入端向下倾斜以将SD接触垫定位在中心线附近。 金属开关杆或过模制的控制器管芯可以被替代。

公开(公告)号：US20080006927A1

公开(公告)日：2008-01-10

申请号：US11831888

申请日：2007-07-31

申请人： Siew Hiew ,  Jim Ni ,  Paul Hsueh ,  Charles Lee ,  Ming-Shiang Shen

发明人： Siew Hiew ,  Jim Ni ,  Paul Hsueh ,  Charles Lee ,  Ming-Shiang Shen

IPC分类号： H01L23/488 ,  H01L21/52

CPC分类号： H05K3/284 ,  H01L23/544 ,  H01L24/48 ,  H01L24/97 ,  H01L2223/54406 ,  H01L2223/54433 ,  H01L2223/54486 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K1/117 ,  H05K2201/09936 ,  H05K2201/10159 ,  Y10T29/49126 ,  H01L2224/85 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An MMC/SD core unit includes a PCBA in which all passive components and unpackaged IC chips are attached to a single side of a PCB opposite to the metal contacts. The IC chips include, for example, a controller chip and a flash memory chip, or a single-chip (combined controller/flash memory) chip. Multiple flash IC chips are optionally stacked to increase storage capacity. The IC chip(s) are attached to the PCB by wire bonding or other chip-on-board (COB) technique. The passive components are attached by conventional surface mount technology (SMT) techniques. A molded housing is then formed over the IC chips and passive components such that the device has a uniform thickness. The MMC/SD core unit is then inserted or otherwise mounted in an eternal casing to provide a finished MMC/SD device.

摘要翻译： MMC / SD核心单元包括PCBA，其中所有无源组件和未封装的IC芯片附接到与金属触点相对的PCB的单侧。 IC芯片例如包括控制器芯片和闪存芯片，或单芯片（组合的控制器/闪存）芯片。 可选择堆叠多个闪存IC芯片以增加存储容量。 IC芯片通过引线接合或其他芯片上（COB）芯片技术连接到PCB。 无源元件通过传统的表面贴装技术（SMT）技术连接起来。 然后在IC芯片和无源部件上形成模制外壳，使得该装置具有均匀的厚度。 然后将MMC / SD核心单元插入或以其他方式安装在永久壳体中以提供完成的MMC / SD设备。

公开(公告)号：US07855099B2

公开(公告)日：2010-12-21

申请号：US12423657

申请日：2009-04-14

申请人： Jim Chin-Nan Ni ,  Abraham C. Ma ,  Paul Hsueh ,  Ming-Shiang Shen

发明人： Jim Chin-Nan Ni ,  Abraham C. Ma ,  Paul Hsueh ,  Ming-Shiang Shen

IPC分类号： H01L21/50 ,  H01L21/48 ,  H01L21/44 ,  H01L23/02 ,  H01L23/498

CPC分类号： G06K19/077 ,  G06F12/1416 ,  G06F21/32 ,  G06F21/78 ,  G06K9/00087 ,  G06K19/07 ,  G06K19/07354 ,  G06K19/07732 ,  G07C9/00087 ,  Y02D10/13

摘要： A flash-memory device has a printed-circuit board assembly (PCBA) with a PCB with a flash-memory chip and a controller chip. The controller chip includes an input/output interface circuit to an external computer over a Secure-Digital (SD) interface, and a processing unit to read blocks of data from the flash-memory chip. The PCBA is encased inside an upper case and a lower case, with SD contact pads on the PCB that fit through contact openings in the upper case. Supporting end ribs under each of the SD contact pads and middle ribs support the PCB at a slanted angle to the centerline of the device. The PCB slants upward at the far end to allow more thickness for the chips mounted to the bottom surface of the PCB, and slants downward at the insertion end to position the SD contact pads near the centerline.

摘要翻译： 闪存设备具有印刷电路板组件（PCBA），PCB组件具有闪存芯片和控制器芯片。 控制器芯片包括通过安全数字（SD）接口到外部计算机的输入/输出接口电路，以及从闪存芯片读取数据块的处理单元。 PCBA被封装在上壳体和下壳体内，PCB上的SD接触垫通过上壳体中的接触开口配合。 在每个SD接触垫和中肋下的支撑端肋以与设备中心线倾斜的角度支撑PCB。 PCB在远端向上倾斜，以允许安装在PCB底部表面的芯片的厚度更大，并且在插入端向下倾斜以将SD接触垫定位在中心线附近。

公开(公告)号：US07420803B2

公开(公告)日：2008-09-02

申请号：US11682261

申请日：2007-03-05

申请人： Paul Hsueh ,  Jin Kyu Kim ,  Nan Nan ,  David Nguyen ,  Ming-Shiang Shen

发明人： Paul Hsueh ,  Jin Kyu Kim ,  Nan Nan ,  David Nguyen ,  Ming-Shiang Shen

IPC分类号： G06F1/16

CPC分类号： H01R13/629 ,  G06F12/1416 ,  G06F21/32 ,  G06F21/78 ,  G06K9/00087 ,  G06K19/07 ,  G06K19/07354 ,  G07C9/00087

摘要： A universal serial bus (USB) flash drive pen device for deploying and retracting a USB plug connector having a pusher assembly including a USB flash drive and a USB plug connector, in accordance with an embodiment of the present invention. The USB flash drive pen device further includes a housing assembly at least partially enclosing said pusher assembly for deploying said USB plug connector, said USB flash drive being coupled to said USB plug connector, said pusher assembly retracting said USB plug connector into said housing assembly, said USB flash drive pen device for deploying said USB plug connector to couple said USB flash drive to a USB port.

摘要翻译： 根据本发明的实施例的通用串行总线（USB）闪存驱动笔装置，用于部署和缩回具有包括USB闪存驱动器和USB插头连接器的推动器组件的USB插头连接器。 所述USB闪存驱动器笔装置还包括至少部分地封闭所述推动器组件以用于展开所述USB插头连接器的壳体组件，所述USB闪存驱动器耦合到所述USB插头连接器，所述推动器组件将所述USB插头连接器缩回到所述壳体组件中， 所述USB闪存笔设备用于部署所述USB插头连接器以将所述USB闪存驱动器耦合到USB端口。

公开(公告)号：US20080145968A1

公开(公告)日：2008-06-19

申请号：US11966871

申请日：2007-12-28

申请人： Siew S. Hiew ,  Nan Nan ,  Paul Hsueh ,  Abraham C. Ma ,  Ming-Shiang Shen

发明人： Siew S. Hiew ,  Nan Nan ,  Paul Hsueh ,  Abraham C. Ma ,  Ming-Shiang Shen

IPC分类号： H05K3/00 ,  H01L21/00

CPC分类号： H05K3/0052 ,  H01L21/561 ,  H01L23/5388 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041 ,  H05K1/117 ,  H05K3/284 ,  H05K2201/09063 ,  H05K2201/0909 ,  Y10T29/49002 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49137 ,  Y10T29/49146 ,  Y10T29/49789 ,  H01L2224/85 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method for fabricating MicroSD devices includes forming a PCB panel having multiple PCBs arranged in parallel rows, with each PCB connected to its neighboring PCBs in each row by relatively narrow connecting bridge pieces, and separated from PCBs of adjacent rows by elongated stamped out blank slots. Passive components are attached by conventional surface mount technology (SMT) techniques. IC chips, including a MicroSD controller chip and a flash memory chip, are attached to the PCB by wire bonding or other chip-on-board (COB) technique. A molded housing is then formed over the IC chips and passive components using a mold that prevents formation of plastic on the upper surface of each PCB. The connecting bridge pieces are then cut using a used to connect each PCB to a PCB panel are then cut using a rotary saw. A front edge chamfer process is then performed.

摘要翻译： 一种用于制造MicroSD器件的方法包括形成具有以平行排布置的多个PCB的PCB面板，每个PCB通过相对较窄的连接桥接件连接到每一行中的相邻PCB，并且通过细长冲裁的空白狭槽与相邻行的PCB分离 。 无源元件通过常规表面贴装技术（SMT）技术连接。 包括MicroSD控制器芯片和闪存芯片在内的IC芯片通过引线接合或其他芯片上的（COB）芯片技术连接到PCB。 然后使用防止在每个PCB的上表面上形成塑料的模具在IC芯片和无源部件上形成模制外壳。 然后使用用于将每个PCB连接到PCB面板的连接桥件进行切割，然后使用旋转锯切割。 然后执行前沿倒角处理。

公开(公告)号：US08141240B2

公开(公告)日：2012-03-27

申请号：US11966871

申请日：2007-12-28

申请人： Siew S. Hiew ,  Nan Nan ,  Paul Hsueh ,  Abraham C. Ma ,  Ming-Shiang Shen

发明人： Siew S. Hiew ,  Nan Nan ,  Paul Hsueh ,  Abraham C. Ma ,  Ming-Shiang Shen

IPC分类号： H05K3/30 ,  H05K3/00 ,  H01L23/00

CPC分类号： H05K3/0052 ,  H01L21/561 ,  H01L23/5388 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041 ,  H05K1/117 ,  H05K3/284 ,  H05K2201/09063 ,  H05K2201/0909 ,  Y10T29/49002 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49137 ,  Y10T29/49146 ,  Y10T29/49789 ,  H01L2224/85 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method for fabricating MicroSD devices includes forming a PCB panel having multiple PCBs arranged in parallel rows, with each PCB connected to its neighboring PCBs in each row by relatively narrow connecting bridge pieces, and separated from PCBs of adjacent rows by elongated stamped out blank slots. Passive components are attached by conventional surface mount technology (SMT) techniques. IC chips, including a MicroSD controller chip and a flash memory chip, are attached to the PCB by wire bonding or other chip-on-board (COB) technique. A molded housing is then formed over the IC chips and passive components using a mold that prevents formation of plastic on the upper surface of each PCB. The connecting bridge pieces are then cut using using a rotary saw. A front edge chamfer process is then performed.

摘要翻译： 一种用于制造MicroSD器件的方法包括形成具有以平行排布置的多个PCB的PCB面板，每个PCB通过相对较窄的连接桥接件连接到每一行中的相邻PCB，并且通过细长冲裁的空白狭槽与相邻行的PCB分离 。 无源元件通过常规表面贴装技术（SMT）技术连接。 包括MicroSD控制器芯片和闪存芯片在内的IC芯片通过引线接合或其他芯片上的（COB）芯片技术连接到PCB。 然后使用防止在每个PCB的上表面上形成塑料的模具在IC芯片和无源部件上形成模制外壳。 然后使用旋转锯切割连接的桥接件。 然后执行前沿倒角处理。

公开(公告)号：US07535088B2

公开(公告)日：2009-05-19

申请号：US11309844

申请日：2006-10-11

申请人： Jim Chin-Nan Ni ,  Abraham C. Ma ,  Paul Hsueh ,  Ming-Shiang Shen

发明人： Jim Chin-Nan Ni ,  Abraham C. Ma ,  Paul Hsueh ,  Ming-Shiang Shen

IPC分类号： H01L23/02 ,  H01L23/34 ,  H01L29/68

CPC分类号： G06K19/077 ,  G06F12/1416 ,  G06F21/32 ,  G06F21/78 ,  G06K9/00087 ,  G06K19/07 ,  G06K19/07354 ,  G06K19/07732 ,  G07C9/00087 ,  Y02D10/13

摘要： A flash-memory device has a printed-circuit board assembly (PCBA) with a PCB with a flash-memory chip and a controller chip. The controller chip includes an input/output interface circuit to an external computer over a Secure-Digital (SD) interface, and a processing unit to read blocks of data from the flash-memory chip. The PCBA is encased inside an upper case and a lower case, with SD contact pads on the PCB that fit through contact openings in the upper case. Supporting end ribs under each of the SD contact pads and middle ribs support the PCB at a slanted angle to the centerline of the device. The PCB slants upward at the far end to allow more thickness for the chips mounted to the bottom surface of the PCB, and slants downward at the insertion end to position the SD contact pads near the centerline.

摘要翻译： 闪存设备具有印刷电路板组件（PCBA），PCB组件具有闪存芯片和控制器芯片。 控制器芯片包括通过安全数字（SD）接口到外部计算机的输入/输出接口电路，以及从闪存芯片读取数据块的处理单元。 PCBA被封装在上壳体和下壳体内，PCB上的SD接触垫通过上壳体中的接触开口配合。 在每个SD接触垫和中肋下的支撑端肋以与设备中心线倾斜的角度支撑PCB。 PCB在远端向上倾斜，以允许安装在PCB底部表面的芯片的厚度更大，并且在插入端向下倾斜以将SD接触垫定位在中心线附近。

公开(公告)号：US07476105B2

公开(公告)日：2009-01-13

申请号：US11846725

申请日：2007-08-29

申请人： Jim Chin-Nan Ni ,  Abraham C. Ma ,  Paul Hsueh ,  Ming-Shiang Shen

发明人： Jim Chin-Nan Ni ,  Abraham C. Ma ,  Paul Hsueh ,  Ming-Shiang Shen

IPC分类号： H01R12/00

CPC分类号： G06K19/07743 ,  A45C2011/188 ,  G06F12/1416 ,  G06F21/32 ,  G06F21/78 ,  G06K9/00087 ,  G06K19/07 ,  G06K19/07354 ,  G06K19/077 ,  G06K19/07732 ,  G07C9/00087 ,  H05K1/117 ,  H05K1/118 ,  H05K1/189 ,  H05K3/284 ,  H05K3/4691 ,  H05K2201/091 ,  H05K2201/10159 ,  H05K2203/1527

摘要： A flash-memory device has a printed-circuit board assembly (PCBA) with a PCB with a flash-memory chip and a controller chip. The controller chip includes an external Secure-Digital (SD) interface, and a processing unit to read blocks of data from the flash-memory chip. The PCBA is encased inside an upper case and a lower case, with SD contact pads on the PCB that fit through contact openings in the upper case. Dividers between openings in the upper case that expose the SD contact pads also support the PCB at a slanted angle to the centerline of the device. The PCB slants upward at the far end to allow more thickness for the chips mounted to the bottom surface of the PCB. A user-slidable switch may be slanted to compensate for the PCB slant. The PCB may have a flex section to facilitate the slant without a slanted switch.

摘要翻译： 闪存设备具有印刷电路板组件（PCBA），PCB组件具有闪存芯片和控制器芯片。 控制器芯片包括一个外部安全数字（SD）接口，以及一个处理单元，用于从闪存芯片中读取数据块。 PCBA被封装在上壳体和下壳体内，PCB上的SD接触垫通过上壳体中的接触开口配合。 暴露SD接触垫的上壳体中的开口之间的分隔线也以与设备中心线倾斜的角度支撑PCB。 PCB在远端向上倾斜，以便为安装在PCB底部表面的芯片提供更大的厚度。 用户可滑动的开关可以倾斜以补偿PCB倾斜。 PCB可以具有弯曲部分以便于倾斜而没有倾斜的开关。