公开(公告)号：US10784612B2

公开(公告)日：2020-09-22

申请号：US16234861

申请日：2018-12-28

Applicant: Delta Electronics, Inc.

Inventor： Shouyu Hong ,  Qingdong Chen ,  Ganyu Zhou ,  Pengkai Ji ,  Yiqing Ye ,  Zhenqing Zhao

IPC: H01R13/22 ,  H01R12/71 ,  H01R43/16 ,  H01R13/405

Abstract: The present disclosure provides a connector which is a combination of at least one power pin, one plastic member, and one signal pin, wherein the power pin includes a columnar metal block, each plastic member is connected to the columnar metal block at side surface, each signal pin is attached to a side surface of the plastic member, and extends to two bottom surfaces of the plastic member to form contact surfaces with predetermined areas on the two bottom surfaces; wherein, the contact surface on first bottom surface of the plastic member is flush with first bottom surface of the metal block, and the contact surface on second bottom surface of the plastic member is flush with second bottom surface of the metal block.

公开(公告)号：US20190013736A1

公开(公告)日：2019-01-10

申请号：US16130850

申请日：2018-09-13

Applicant: Delta Electronics, Inc.

Inventor： Shouyu Hong ,  Qingdong Chen ,  Kai Lu ,  Pengkai Ji ,  Xiaoni Xin ,  Min Zhou ,  Yu Zhang ,  Jianhong Zeng

IPC: H02M3/158 ,  G06F1/32 ,  H01F27/28

Abstract: A power module and a manufacturing method thereof are disclosed. The power module includes a magnetic component, a bare power chip and a conductive set. The magnetic component includes a first surface and a second surface opposite to each other. The bare power chip is disposed on the magnetic component and includes a third surface and a fourth surface opposite to each other. The conductive set is disposed on the magnetic component and electrically connected with the magnetic component and the bare power chip. The third or fourth surface of the bare power chip is at least partially attached on the first or second surface of the magnetic component, and at least partially included in a projected envelopment of the corresponding first or second surface of the magnetic component, so as to facilitate the magnetic component to support the bare power chip.

公开(公告)号：US10062499B2

公开(公告)日：2018-08-28

申请号：US15784864

申请日：2017-10-16

Applicant: DELTA ELECTRONICS, INC.

Inventor： Pengkai Ji ,  Jinping Zhou ,  Shouyu Hong ,  Tao Wang ,  Jianhong Zeng ,  Zhangnan Xin

IPC: H01F27/29 ,  H05K1/18 ,  H05K1/11 ,  H01F27/24 ,  H01L27/02

CPC classification number: H01F27/29 ,  H01F27/24 ,  H01F27/2847 ,  H01F27/306 ,  H01L27/02 ,  H05K1/111 ,  H05K1/115 ,  H05K1/181 ,  H05K1/185 ,  H05K2201/1003

Abstract: A power module including a power device and a magnetic component is provided. The magnetic component is stacked with the power device and a vertical projection of the magnetic component is at least partially overlapping with the power device. The magnetic component includes a magnetic core and a winding set. The magnetic core includes a first surface, a second surface and at least one window. The window is located between the first surface and the second surface, and includes a passing-through axis vertical to a surface of the power device, where at least one leading pin or pad is disposed on the surface of the power device. The winding set includes at least one winding portion. The winding portion passes through the window and electrically connected to the power device. Each winding set and the magnetic core are configured to form an inductor, and the winding set is preformed.

公开(公告)号：US20220149738A1

公开(公告)日：2022-05-12

申请号：US17584926

申请日：2022-01-26

Applicant: Delta Electronics, Inc.

Inventor： Shouyu Hong ,  Qingdong Chen ,  Kai Lu ,  Pengkai Ji ,  Xiaoni Xin ,  Min Zhou ,  Yu Zhang ,  Jianhong Zeng

IPC: H02M3/158 ,  G06F1/3234 ,  H01F27/28 ,  H01L25/00 ,  G06F1/16 ,  H01F41/12

Abstract: A power module and a manufacturing method thereof are disclosed. The power module includes a magnetic component, a bare power chip and a conductive set. The magnetic component includes a first surface and a second surface opposite to each other. The bare power chip is disposed on the magnetic component and includes a third surface and a fourth surface opposite to each other. The conductive set is disposed on the magnetic component and electrically connected with the magnetic component and the bare power chip. The third or fourth surface of the bare power chip is at least partially attached on the first or second surface of the magnetic component, and at least partially included in a projected envelopment of the corresponding first or second surface of the magnetic component, so as to facilitate the magnetic component to support the bare power chip.

公开(公告)号：US20250088110A1

公开(公告)日：2025-03-13

申请号：US18961423

申请日：2024-11-26

Applicant: Delta Electronics, Inc.

Inventor： Shouyu Hong ,  Qingdong Chen ,  Kai Lu ,  Pengkai Ji ,  Xiaoni Xin ,  Min Zhou ,  Yu Zhang ,  Jianhong Zeng

IPC: H02M3/158 ,  G06F1/16 ,  G06F1/3234 ,  H01F27/28 ,  H01F41/12 ,  H01L25/00 ,  H02M3/155

Abstract: A power module and a manufacturing method thereof are disclosed. The power module includes a magnetic component, a bare power chip and a conductive set. The magnetic component includes a first surface and a second surface opposite to each other. The bare power chip is disposed on the magnetic component and includes a third surface and a fourth surface opposite to each other. The conductive set is disposed on the magnetic component and electrically connected with the magnetic component and the bare power chip. The third or fourth surface of the bare power chip is at least partially attached on the first or second surface of the magnetic component, and at least partially included in a projected envelopment of the corresponding first or second surface of the magnetic component, so as to facilitate the magnetic component to support the bare power chip.

公开(公告)号：US10886200B2

公开(公告)日：2021-01-05

申请号：US16258747

申请日：2019-01-28

Applicant: Delta Electronics,Inc.

Inventor： Shouyu Hong ,  Haibin Xu ,  Wei Cheng ,  Tao Wang ,  Zhenqing Zhao

IPC: H01L23/48 ,  H01L23/495 ,  H01L21/48 ,  H01L25/07 ,  H01L25/00 ,  H01L25/18

Abstract: The present disclosure relates to a power module and a manufacturing method thereof. The power module includes: a group of switch elements, a molding part and a connector. The group of switch elements includes at least one pair of switch elements. The molding part molds the group of switch elements. The connector includes a signal terminal and a power terminal respectively electrically connected to the signal end and power end of the group of switch elements, and both fanned out from the molding part. The power terminal includes a positive power terminal, a negative power terminal and an output power terminal. The positive power terminal and the negative power terminal are respectively a first metal layer and a second metal layer which are at least partially stacked, and an insulating layer is disposed between the first metal layer and the second metal layer.

公开(公告)号：US10297523B2

公开(公告)日：2019-05-21

申请号：US14959635

申请日：2015-12-04

Applicant: DELTA ELECTRONICS, INC.

Inventor： Shouyu Hong ,  Yanlin Chen ,  Zhenqing Zhao

IPC: H05K7/20 ,  H01L23/00 ,  H01L25/07 ,  H01L23/367 ,  H01L23/373 ,  H01L23/433 ,  H01L23/495

Abstract: A power module and a method for manufacturing the same are provided. The power module comprises: a substrate, at least one power device, and an organic heat dissipating structure. The substrate has an upper surface and a lower surface. The organic heat dissipating structure comprises a plurality of organic heat dissipating protrusions and it is located on the upper surface side or the lower surface side of the substrate and configured to transfer heat generated by the power device outwardly.

公开(公告)号：US10136545B2

公开(公告)日：2018-11-20

申请号：US15486591

申请日：2017-04-13

Applicant: DELTA ELECTRONICS, INC.

Inventor： Tao Wang ,  Kai Lu ,  Zhenqing Zhao ,  Shouyu Hong ,  Wei Cheng

IPC: H05K7/14 ,  H05K1/18 ,  H05K5/03 ,  H01L23/04 ,  H01L25/07

Abstract: The present invention provides a power module including a substrate and a modular housing structure. The substrate includes an electronic element disposed thereon. The modular housing structure is disposed on the substrate and located around the electronic element. The modular housing structure includes a plurality of sidewalls configured to connect with each other detachably. Each sidewall includes two connecting elements disposed on two opposite ends thereof respectively. The two connecting elements of any one of the sidewalls are connected to two corresponding connecting elements of two adjacent sidewalls respectively. Consequently, the numbers and connections of the sidewalls are adjustable and varied according to the size of the substrate so as to avoid the waste of space and enhance the power density.

公开(公告)号：US10249550B2

公开(公告)日：2019-04-02

申请号：US15720062

申请日：2017-09-29

Applicant: Delta Electronics, Inc.

Inventor： Pengkai Ji ,  Shouyu Hong ,  Zhenqing Zhao ,  Jianhong Zeng

IPC: H05K1/18 ,  H01L23/31 ,  H01L23/492 ,  H01L21/56 ,  H05K1/02 ,  H05K1/11 ,  H05K3/30 ,  H05K3/40

Abstract: The present invention provides a power module and a manufacturing method thereof. The power module includes a carrier board and a lead component stacked relative to the carrier board. The lead component includes an initial plane, plural first pins and plural second pin. The initial plane includes a vertical projection overlapping with the carrier board. The first pins are electrically connected to the carrier board and vertical to the initial plane. The second pins are electrically connected to the carrier board and vertical to the initial plane. An isolation gap is disposed in the initial plane and located between the first pins and the second pins. The initial plane is separated into a first plane and a second plane by the isolation gap, so as to electrically isolate the first pins and the second pins from each other.

公开(公告)号：US10104813B2

公开(公告)日：2018-10-16

申请号：US15165273

申请日：2016-05-26

Applicant: DELTA ELECTRONICS, INC.

Inventor： Wei Cheng ,  Shouyu Hong ,  Zhenqing Zhao ,  Tao Wang

IPC: H05K7/20 ,  H01L23/373 ,  H01L23/40 ,  H01L23/498 ,  H05K1/02 ,  H01L23/053 ,  H01L23/473 ,  H01L23/24

Abstract: A power circuit module is provided. The encapsulated power circuit module comprises: a pressure plate comprising a protrusion body; a frame; and a substrate bearing a power circuit, the power circuit comprising at least a power switching device; the frame is provided between the substrate and the pressure plate, the frame supports the pressure plate, and a substantially closed space is formed by the substrate, the pressure plate and the frame; and when an external force is applied on the pressure plate, the protrusion body press against the substrate and is in insulation contact with the substrate, and the external force is transmitted evenly on the substrate.