公开(公告)号：US10142729B2

公开(公告)日：2018-11-27

申请号：US15312633

申请日：2014-05-20

Applicant: EPCOS AG

Inventor： Jan Tue Ravnkilde ,  Christian Siegel ,  Matthias Jungkunz ,  Gino Rocca ,  Ivan Riis Nielsen ,  Anton Leidl ,  Pirmin Hermann Otto Rombach

IPC: H04R3/00 ,  H04R3/04 ,  H03G3/30 ,  H04R19/04

Abstract: A microphone and a method for operating a Microphone are disclosed. In an embodiment the microphone includes a transducer and a mode controller. The microphone has a normal operating mode (MO) and a collapse mode (M1). The mode controller switches to the collapse mode (M1) when an output signal of the transducer reaches or exceeds a predefined threshold value and switches to the normal operating mode (MO) when the output signal reaches or falls below a predefined further threshold value (S1).

公开(公告)号：US09278854B2

公开(公告)日：2016-03-08

申请号：US14378363

申请日：2013-02-08

Applicant: Epcos AG

Inventor： Wolfgang Pahl ,  Anton Leidl ,  Jürgen Portmann ,  Robert Eichinger ,  Christian Siegel ,  Karl Nicolaus ,  Thomas Wassner ,  Thomas Sedlmeier

IPC: B81C1/00 ,  B81C99/00 ,  H01L21/66 ,  H04R31/00

CPC classification number: B81C1/00333 ,  B81C99/0045 ,  H01L22/12 ,  H01L2224/16225 ,  H01L2924/1461 ,  H04R31/006 ,  H01L2924/00

Abstract: The present invention relates to a method for producing a sensor (SEN), comprising the steps of arranging a sensor element (SE) on a carrier (TR), arranging a cover (AF) on the sensor element (SE), wherein the sensor element (SE) is enclosed between the cover (AF) and the carrier (TR), adhesively bonding a carrier film (TF) onto the cover (AF), and producing an opening (SO) in the carrier film (TF) and the cover (AF), wherein the openings (SO) in the carrier film (TF) and the cover (AF) at least partly overlap.

Abstract translation: 传感器（SEN）的制造方法技术领域本发明涉及传感器（SEN）的制造方法，其特征在于，包括以下步骤：在传感器元件（SE）上配置传感器元件（SE） 元件（SE）被封闭在盖（AF）和载体（TR）之间，将载体膜（TF）粘合到盖（AF）上，并在载体膜（TF）中产生开口（SO） 盖（AF），其中载体膜（TF）和盖（AF）中的开口（SO）至少部分重叠。

公开(公告)号：US20150326979A1

公开(公告)日：2015-11-12

申请号：US14653820

申请日：2012-12-18

Applicant: EPCOS AG

Inventor： Jan Tue Ravnkilde ,  Marcel Giesen ,  Kurt Rasmussen ,  Morten Ginnerup ,  Pirmin Hermann Otto Rombach ,  Wolfgang Pahl ,  Anton Leidl ,  Armin Schober ,  Jürgen Portmann

IPC: H04R19/04 ,  H04R1/04 ,  H04R31/00 ,  H04R19/00

CPC classification number: H04R19/005 ,  B81B7/0016 ,  B81B2207/115 ,  H04R1/04 ,  H04R19/04 ,  H04R31/00 ,  H04R31/006 ,  H04R2201/003

Abstract: A top-port MEMS-microphone has an upper side and a bottom side. The microphone includes a MEMS chip with a monolithically connected protection element at the upper side, a backplate, and a membrane. The microphone also includes a sound inlet at the upper side and a mechanical or electrical connection at the bottom side.

Abstract translation: 顶端MEMS麦克风具有上侧和底侧。 麦克风包括在上侧具有单片连接的保护元件的MEMS芯片，背板和膜。 麦克风还包括在上侧的声音入口和在底侧的机械或电气连接。

公开(公告)号：US20150056725A1

公开(公告)日：2015-02-26

申请号：US14378363

申请日：2013-02-08

Applicant: Epcos AG

Inventor： Wolfgang Pahl ,  Anton Leidl ,  Jürgen Portmann ,  Robert Eichinger ,  Christian Siegel ,  Karl Nicolaus ,  Thomas Wassner ,  Thomas Sedlmeier

IPC: B81C1/00 ,  H01L21/66 ,  H04R31/00

CPC classification number: B81C1/00333 ,  B81C99/0045 ,  H01L22/12 ,  H01L2224/16225 ,  H01L2924/1461 ,  H04R31/006 ,  H01L2924/00

Abstract: The present invention relates to a method for producing a sensor (SEN), comprising the steps of arranging a sensor element (SE) on a carrier (TR), arranging a cover (AF) on the sensor element (SE), wherein the sensor element (SE) is enclosed between the cover (AF) and the carrier (TR), adhesively bonding a carrier film (TF) onto the cover (AF), and producing an opening (SO) in the carrier film (TF) and the cover (AF), wherein the openings (SO) in the carrier film (TF) and the cover (AF) at least partly overlap.

Abstract translation: 传感器（SEN）的制造方法技术领域本发明涉及传感器（SEN）的制造方法，其特征在于，包括以下步骤：在传感器元件（SE）上配置传感器元件（SE） 元件（SE）被封闭在盖（AF）和载体（TR）之间，将载体膜（TF）粘合到盖（AF）上，并在载体膜（TF）中产生开口（SO） 盖（AF），其中载体膜（TF）和盖（AF）中的开口（SO）至少部分重叠。

公开(公告)号：US10136226B2

公开(公告)日：2018-11-20

申请号：US14653820

申请日：2012-12-18

Applicant: EPCOS AG

Inventor： Jan Tue Ravnkilde ,  Marcel Giesen ,  Kurt Rasmussen ,  Morten Ginnerup ,  Pirmin Hermann Otto Rombach ,  Wolfgang Pahl ,  Anton Leidl ,  Armin Schober ,  Jürgen Portmann

IPC: H04R19/00 ,  H04R1/04 ,  H04R31/00 ,  H04R19/04 ,  B81B7/00

Abstract: A top-port MEMS-microphone has an upper side and a bottom side. The microphone includes a MEMS chip with a monolithically connected protection element at the upper side, a backplate, and a membrane. The microphone also includes a sound inlet at the upper side and a mechanical or electrical connection at the bottom side.

公开(公告)号：US20170150253A1

公开(公告)日：2017-05-25

申请号：US15312633

申请日：2014-05-20

Applicant: EPCOS AG

Inventor： Jan Tue Ravnkilde ,  Christian Siegel ,  Matthias Jungkunz ,  Gino Rocca ,  Ivan Riis Nielsen ,  Anton Leidl ,  Pirmin Hermann Otto Rombach

IPC: H04R3/00 ,  H03G3/30 ,  H04R3/04

CPC classification number: H04R3/002 ,  H03G3/301 ,  H04R3/007 ,  H04R3/04 ,  H04R19/04 ,  H04R2201/003

Abstract: A microphone and a method for operating a Microphone are disclosed. In an embodiment the microphone includes a transducer and a mode controller. The microphone has a normal operating mode (MO) and a collapse mode (M1). The mode controller switches to the collapse mode (M1) when an output signal of the transducer reaches or exceeds a predefined threshold value and switches to the normal operating mode (MO) when the output signal reaches or falls below a predefined further threshold value (S1).