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1.发明公开公开(公告)号：US20240094463A1
公开(公告)日：2024-03-21
申请号：US18465791
申请日：2023-09-12
Inventor： Dae Seon KIM , Jong Jin LEE
CPC classification number: G02B6/12019 , G02B6/122 , G02B7/004 , H01S3/0315
Abstract: The present disclosure is to provide a shape of a surface mount type optical module to be mounted on a surface of a system board or package submount, and is to provide a compact and lightweight optical module attachment/detachment apparatus that performs the mounting (attachment) and separation of the optical module in a confined space by automatically performing optical module loading/unloading, optical module alignment, and laser soldering to facilitate attachment and detachment of the optical module. The attachment/detachment apparatus includes a body frame; a fixing part for fixing the body frame to the board; a gripper for gripping the optical module; an aligning part for aligning the position of the optical module with respect to the board; and a laser part which irradiates a laser for non-contact bonding between the optical module and the board.
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公开(公告)号：US20230069724A1
公开(公告)日：2023-03-02
申请号：US17862930
申请日：2022-07-12
Inventor： Won Bae KWON , Jong Jin LEE , Eun Kyu KANG , Soo Yong JUNG , Hae Chung KANG , Sang Jin KWON , Dae Seon KIM
Abstract: An optical receiver sub-assembly is provided, which includes a substrate, an optical waveguide device mounted on the substrate to transfer ray incident from a ray source, and a photodetector mounted on the substrate and disposed under a vertical cross-sectional surface of the optical waveguide device, wherein the ray is sequentially reflected and refracted by an upper slope surface and a lower slope surface provided in the vertical cross-sectional surface and is vertically incident on an active area of the photodetector.
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公开(公告)号：US20230067645A1
公开(公告)日：2023-03-02
申请号：US17851148
申请日：2022-06-28
Inventor： Hae Chung KANG , Eun Kyu KANG , Jong Jin LEE , Sang Jin KWON , Won Bae KWON , Dae Seon KIM , Dae Woong MOON , Soo Yong JUNG , Gye Sul CHO
Abstract: A highly integrated multi-channel optical module is provided. The optical module includes an optical source device mounted on a substrate by an optical source mount unit, a waveguide mounted on the substrate by a waveguide mount unit, a lens mount unit disposed between the optical source device and the waveguide and mounted on the substrate, and a lens unit fixed to the lens mount unit by an adhesive cured by ultraviolet (UV) parallel light, wherein a light path of the UV parallel light is formed in the lens mount unit by a reflector attached on a side surface of the lens mount unit, and the UV parallel light moves along the light path and cures the adhesive coated on an upper portion of the lens mount unit facing a lower end portion of the lens unit.
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公开(公告)号：US20200076511A1
公开(公告)日：2020-03-05
申请号：US16547999
申请日：2019-08-22
Inventor： Kwon Seob LIM , Hyun Seo KANG , Dae Seon KIM , Sang Jin KWON
IPC: H04B10/532 , H04J14/06 , H04B10/61 , H04B10/25 , H04B10/564
Abstract: A transmitting apparatus includes an optical modulator configured to modulate input light from a light source into a light signal including a carrier signal and a sideband signal based on a radio frequency (RF) signal, having polarization characteristics crossing each other, an optical power splitter configured to split the light signal into a plurality of light signals, a plurality of light phase shifters configured to respectively shift phases of the plurality of light signals, a plurality of polarization controllers configured to perform control so that a carrier signal and a sideband signal included in each of the phase-shifted plurality of light signals have the same polarization characteristic, and a plurality of photodetectors configured to convert the plurality of light signals, having polarization characteristics controlled by the plurality of polarization controllers, into a plurality of electrical signals and to transfer the electrical signals to a plurality of antenna elements.
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公开(公告)号：US20170242208A1
公开(公告)日：2017-08-24
申请号：US15210476
申请日：2016-07-14
Inventor： Jong Jin LEE , Kwon-Seob LIM , Dae Seon KIM , Sun-Goo LEE
IPC: G02B6/42
CPC classification number: G02B6/4244 , G02B6/4204 , G02B6/4239 , G02B6/424 , G02B6/4245 , G02B6/425
Abstract: There is provided an optical module. The optical module includes a light source, a wave guide to which beam output from the light source is input, a lens system configured to optically combining the light source and the wave guide, a first lens mount positioned between the light source and the lens system in an optical axis of the light source, a first adhesive configured to fix the lens system to the first lens mount, a second lens mount positioned between the wave guide and the lens system in the optical axis of the light source, and a second adhesive configured to fix the lens system to the second lens mount. Therefore, it is possible to precisely align light, to manufacture the optical module with small expenses, and to simplify processes and equipment.
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Patent Agency Ranking
公开(公告)号：US20220094138A1
公开(公告)日：2022-03-24
申请号：US17479496
申请日：2021-09-20
Inventor： Eun Kyu KANG , Jong Jin LEE , Dae Seon KIM , Eun Kyoung JEON , Sang Jin KWON , Won Bae KWON , Kwon Seob LIM , Soo Yong JUNG
IPC: H01S5/024 , G02B27/28 , H01S5/02257 , H01S5/02253 , H01S5/02255 , H04J14/02 , H04B10/40
Abstract: A structure and a manufacturing method of an optical transmission module, in which output light of each of a first optical transmission unit and a second optical transmission unit is combined into one and transmitted through an optical fiber. In order to manufacture the optical transmission module, the first optical transmission unit and the second optical transmission unit are separately manufactured using a wafer-level packaging process and then are stacked. As a result, emission of generated heat is divided into a first heat sink installed in the first optical transmission unit and a second heat sink installed in the second optical transmission unit so that better heat dissipation efficiency is achieved than a conventional optical transmission module. In addition, a mounting area may also be reduced to ½ of the conventional module.
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公开(公告)号：US20210125975A1
公开(公告)日：2021-04-29
申请号：US17081536
申请日：2020-10-27
Inventor： Eun Kyu KANG , Jong Jin LEE , Sang Jin KWON , Won Bae KWON , Dae Seon KIM , Soo Yong JUNG
Abstract: Provided is a cooled optical transmission module device including a silicon wafer having a plurality of platform mounting grooves, each of which serves as a space for mounting in which an optical transmission platform therein, a thermoelectric cooler bonded to the platform mounting groove to transfer heat to outside, the optical transmission platform provided on the thermoelectric cooler and configured to output an optical signal by generating and reflecting the optical signal, a dielectric sub-mount bonded to the platform mounting groove of the silicon wafer and electrically connected to the mounted optical transmission platform, and a cover configured to cover the platform mounting groove of the silicon wafer and seal the platform mounting groove while providing an electric path.
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公开(公告)号：US20180302636A1
公开(公告)日：2018-10-18
申请号：US15882352
申请日：2018-01-29
Inventor： Hong Yeon YU , Dae Seon KIM , Kwon-Seob LIM , Eun Kyoung JEON , Jong Jin LEE
Abstract: A method of mixing video bitstreams and an apparatus performing the method are disclosed. The method includes generating a mixed scalable video coding (SVC) bitstream by mixing a plurality of SVC bitstreams for each layer based on a screen configuration of a user device, extracting a single SVC bitstream corresponding to a single layer from the mixed SVC bitstream based on a reception environment of the user device, and transmitting the single SVC bitstream to the user device.
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公开(公告)号：US20230061382A1
公开(公告)日：2023-03-02
申请号：US17879008
申请日：2022-08-02
Inventor： Eun Kyu KANG , Jong Jin LEE , Dae Seon KIM , Sang Jin KWON , Won Bae KWON , Soo Yong JUNG , Hae Chung KANG , Dae Woong MOON , Gye Sul CHO
IPC: G02B6/42
Abstract: A multi-channel optical sub-assembly includes a printed circuit board with a signal processor mounted thereon, a package window mounted on the printed circuit board, the package window including a transparent material, a package mounted on the package window, and an optical device accommodated into an inner space of the package and configured to convert an electrical signal, input from the signal processor, into an optical signal, wherein the electrical signal sequentially passes through a window through electrode buried in the package window and a package through electrode buried in the package and is input to the optical device.
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公开(公告)号：US20210153354A1
公开(公告)日：2021-05-20
申请号：US17068600
申请日：2020-10-12
Inventor： Dae Seon KIM , Jong Jin LEE
IPC: H05K1/18 , H01L23/498
Abstract: Provided is an interposer using an inclined electrode and a manufacturing method thereof. The interposer may include a first plate having at least one inclined surface formed between a first layer in which an upper portion is located and a second layer in which a lower portion is located, a second plate having an upper portion formed along the first layer and a lower portion formed to extend along the upper portion of the first plate, at least one inclined surface, and the second layer, and at least one electrode formed along the upper portion of the first plate, at least one inclined surface, and the lower portion of the second plate. In the at least one electrode, a portion formed along the upper portion of the first plate and a portion formed along the lower portion of the second plate may be exposed.
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