公开(公告)号：US11384239B2

公开(公告)日：2022-07-12

申请号：US16861249

申请日：2020-04-29

Applicant: ELITE MATERIAL CO., LTD.

Inventor： Shu-Hao Chang

IPC: C08L71/12 ,  C08K3/36 ,  C08K3/38 ,  C08L71/00 ,  C08J5/24 ,  H05K1/03 ,  B32B27/28

Abstract: The present disclosure provides a resin composition which comprises: 90 parts by weight of vinyl-containing polyphenylene oxide resin; 35 to 70 parts by weight of chemically synthetic silica; and 10 to 30 parts by weight of spherical inorganic fillers, wherein the spherical inorganic fillers include spherical boron nitride, spherical hollow boron silicate or a combination thereof. The present disclosure also provides an article made from the resin composition, wherein the article includes a prepreg, a resin film, a laminate or a printed circuit board. The resin composition of the invention can make the article made therefrom achieve better peeling strength, dielectric constant, dissipation factor, no weave exposure produced and no stripes of branch-like pattern produced at the laminate edge.

公开(公告)号：US12122912B2

公开(公告)日：2024-10-22

申请号：US17557846

申请日：2021-12-21

Applicant: Elite Material Co., Ltd.

Inventor： Shu-Hao Chang

IPC: C08L71/12 ,  B32B5/02 ,  B32B5/26 ,  B32B15/04 ,  B32B15/20 ,  C08J5/24 ,  C08L79/08 ,  C09J7/30 ,  C09J171/12

CPC classification number: C08L71/12 ,  B32B5/02 ,  B32B5/26 ,  B32B15/043 ,  B32B15/20 ,  C08J5/244 ,  C08L79/085 ,  C09J7/30 ,  C09J171/12 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2307/206 ,  C08J2371/12 ,  C08J2479/08 ,  C09J2400/14 ,  C09J2400/163 ,  C09J2471/00 ,  C09J2479/08

Abstract: The present invention provides a resin composition comprising maleimide-containing pre-polymerized resin and article made therefrom. The resin composition comprises: 100 weight parts of vinyl-containing polyphenylene ether resin; 35 to 45 weight parts of bis(vinylphenyl)ethane; and 30 to 60 weight parts of maleimide-containing pre-polymerized resin; wherein the maleimide-containing pre-polymerized resin is obtained by pre-polymerization of aromatic maleimide resin and long chain maleimide resin. The articles made from the resin composition improve at least one characteristic of glass transition temperature variation, copper foil peeling strength, percentage of thermal expansion, coefficient of thermal expansion and surface appearance.

公开(公告)号：US11111383B2

公开(公告)日：2021-09-07

申请号：US16703172

申请日：2019-12-04

Applicant: Elite Material Co., Ltd.

Inventor： Shu-Hao Chang

IPC: C08L71/12 ,  C08F212/36 ,  C08L67/00 ,  C08L77/00 ,  C08L33/08 ,  C08L33/24 ,  C08K5/01 ,  C08J5/24 ,  C08L63/00

Abstract: A resin composition comprises: a vinyl-containing polyphenylene ether resin, a bis(vinylphenyl)ethane and a modification of divinylbenzene. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and achieves improvements in at least one of the properties including dielectric constant, dissipation factor, copper foil peeling strength, glass transition temperature, ratio of thermal expansion, thermal expansion coefficient, precipitation property of varnish, solder dipping thermal resistance, solder floating thermal resistance of multi-layer board, reflow thermal resistance of multi-layer board and T300 thermal resistance.

公开(公告)号：US10557033B2

公开(公告)日：2020-02-11

申请号：US15373915

申请日：2016-12-09

Applicant: Elite Material Co., Ltd.

Inventor： Shu-Hao Chang

IPC: C08L63/00 ,  C08G59/50 ,  C08J5/24 ,  D06M15/53 ,  D06M15/55 ,  D06M15/61 ,  D06M15/693

Abstract: The disclosure relates to a resin composition, comprising an epoxy resin, a high molecular weight polyetheramine and an amine-terminated acrylonitrile rubber. Various products can be made from the resin composition, such as prepregs, laminates, printed circuit boards or rigid-flex boards, in which one, multiple or all of the following properties can be met: low resin flow, low dust weight loss, high peel strength at room temperature and at high temperature, low moisture absorption rate, and better varnish stability.

公开(公告)号：US11643507B2

公开(公告)日：2023-05-09

申请号：US17093914

申请日：2020-11-10

Applicant: Elite Material Co., Ltd.

Inventor： Shu-Hao Chang

IPC: C08F12/34 ,  C08F2/40 ,  C08F236/06 ,  C08G81/02 ,  C08K5/00

CPC classification number: C08G81/022 ,  C08F2/40 ,  C08F12/34 ,  C08F236/06 ,  C08K5/0025 ,  C08K5/0066

Abstract: A prepolymerized resin prepared by subjecting a composition to a pre-reaction in the presence of a polymerization inhibitor. The composition at least includes bis(vinylphenyl)ethane and polybutadiene. The polybutadiene has a 1,2-vinyl content of 85% or above and a number average molecular weight of less than 3000, wherein the pre-reaction has a conversion rate of between 30% and 90%. During the pre-reaction, components in the composition are partially crosslinked to leave residual vinyl groups. The composition further includes vinyl-containing polyphenylene ether and has a number average molecular weight of between 4,000 and 12,000.

公开(公告)号：US10894865B2

公开(公告)日：2021-01-19

申请号：US15985445

申请日：2018-05-21

Applicant: Elite Material Co., Ltd.

Inventor： Shu-Hao Chang

IPC: C08F12/34 ,  C08F2/40 ,  C08F236/06 ,  C08G81/02 ,  C08K5/00

Abstract: A prepolymerized resin and a preparation method thereof are provided, the method comprising a step of pre-reacting bis(vinylphenyl)ethane and polybutadiene. Bis(vinylphenyl)ethane may include 1,2-bis(4-vinylphenyl)ethane, 1,2-(3-vinylphenyl-4-vinylphenyl)ethane, 1,2-bis(3-vinylphenyl) ethane or a combination thereof. Polybutadiene has a 1,2-vinyl content of 85% or above and a number average molecular weight of less than 3000. A resin composition comprising the prepolymerized resin and an article made from the resin composition are also provided.