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    OPTICAL MODULE
    1.
    发明申请
    OPTICAL MODULE 有权

    公开(公告)号：US20210364697A1

    公开(公告)日：2021-11-25

    申请号：US17393957

    申请日：2021-08-04

    Applicant: FURUKAWA ELECTRIC CO., LTD.

    Inventor： Yusuke INABA ,  Junichi HASEGAWA ,  Maiko ARIGA ,  Kazuki YAMAOKA

    IPC: G02B6/12

    Abstract: An optical module includes: a substrate and a waveguide element having a mount face opposed to the substrate, the waveguide element having an interference waveguide portion having an optical interference function. Further, the mount face includes a projection region to which the interference waveguide portion is projected on the mount face and a non-projection region, and the waveguide element is joined to the substrate with a joint material in the non-projection region.

    OPTICAL MODULE AND THERMOELECTRIC MODULE
    2.
    发明申请
    OPTICAL MODULE AND THERMOELECTRIC MODULE 有权

    公开(公告)号：US20210367399A1

    公开(公告)日：2021-11-25

    申请号：US17393918

    申请日：2021-08-04

    Applicant: FURUKAWA ELECTRIC CO., LTD.

    Inventor： Yusuke INABA ,  Maiko ARIGA ,  Kazuki YAMAOKA

    IPC: H01S5/024

    Abstract: An optical module includes: an optical element; and a thermoelectric module on which the optical element is mounted. Further, the thermoelectric module includes a first substrate, a second substrate disposed to face the first substrate, and a plurality of thermoelectric elements provided between the first substrate and the second substrate, and a pattern made of a material different from a material of the first substrate is formed on a surface of the first substrate opposite to a back surface of the first substrate facing the second substrate, and the optical element is mounted on the surface of the first substrate in association with the pattern.

    OPTICAL MODULE
    3.
    发明申请
    OPTICAL MODULE 有权

    公开(公告)号：US20210364713A1

    公开(公告)日：2021-11-25

    申请号：US17391589

    申请日：2021-08-02

    Applicant: FURUKAWA ELECTRIC CO., LTD.

    Inventor： Maiko ARIGA ,  Yusuke INABA ,  Kazuki YAMAOKA ,  Junichi HASEGAWA

    IPC: G02B6/42

    Abstract: An optical module includes: a base having a predetermined product of a coefficient of linear expansion and a Young's modulus; a planar lightwave circuit element mounted on the base; and a warpage suppression component, which is mounted on a surface of the planar lightwave circuit element, the surface being on a side opposite to a side where the planar lightwave circuit element is mounted on the base, having a product of a coefficient of linear expansion and a Young's modulus that reduces warpage of the planar lightwave circuit element in accordance with warpage of the base depending on temperature change.

    OPTICAL DEVICE AND METHOD FOR MANUFACTURING OPTICAL DEVICE
    4.
    发明申请
    OPTICAL DEVICE AND METHOD FOR MANUFACTURING OPTICAL DEVICE 有权

    公开(公告)号：US20220317392A1

    公开(公告)日：2022-10-06

    申请号：US17808007

    申请日：2022-06-21

    Applicant: FURUKAWA ELECTRIC CO., LTD.

    Inventor： Atsushi IZAWA ,  Jun MIYOKAWA ,  Maiko ARIGA ,  Kazuya NAGASHIMA ,  Yozo ISHIKAWA ,  Taketsugu SAWAMURA

    IPC: G02B6/42 ,  G02B6/46 ,  G02B6/028

    Abstract: An optical device includes: a case; a sleeve attached to the case, the sleeve including a first through-hole penetrating between an inside and an outside of the case, and an inclined surface inclined with respect to a penetrating direction of the first through-hole, the inclined surface having an opening of the first through-hole; a first optical fiber including a core wire including a core and a clad, and a sheath configured to surround the core wire, wherein an exposed portion of the core wire not surrounded by the sheath passes through the first through-hole; and a first joining material interposed and sealed between an outer peripheral surface of the exposed portion and an inner peripheral surface of the first through-hole in the first through-hole.

    SEMICONDUCTOR LASER MODULE
    8.
    发明申请
    SEMICONDUCTOR LASER MODULE 审中-公开

    公开(公告)号：US20190296524A1

    公开(公告)日：2019-09-26

    申请号：US16437465

    申请日：2019-06-11

    Applicant: FURUKAWA ELECTRIC CO., LTD.

    Inventor： Maiko ARIGA ,  Yusuke INABA ,  Kazuki YAMAOKA

    IPC: H01S5/50 ,  H01S5/026 ,  G02B27/30 ,  G02B27/09 ,  H01S5/00 ,  G02B27/10

    Abstract: A disclosed semiconductor laser module includes a semiconductor laser device; a semiconductor optical amplifier configured to receive laser light emitted from the semiconductor laser device and amplify the laser light that has been received; and a first light receiving device that measures an intensity of a part of the laser light emitted from the semiconductor laser device, for monitoring a wavelength of the laser light, wherein the semiconductor optical amplifier is located rearward in relation to a light receiving surface of the first light receiving device along a propagation direction of the laser light emitted from the semiconductor device.

    LASER MODULE
    9.
    发明申请
    LASER MODULE 审中-公开

    公开(公告)号：US20180342850A1

    公开(公告)日：2018-11-29

    申请号：US16053850

    申请日：2018-08-03

    Applicant: FURUKAWA ELECTRIC CO., LTD.

    Inventor： Maiko ARIGA ,  Yusuke INABA ,  Kazuaki KIYOTA ,  Toshihito SUZUKI

    IPC: H01S5/026 ,  H01S5/024 ,  H01S5/125 ,  H01S5/02 ,  H01S5/14 ,  H01S5/10

    Abstract: A laser module that can suppress influence due to a reflected light between chips is provided. A laser module 100 according to one embodiment of the present invention includes: a laser element 110 provided on a first substrate and having a laser oscillation unit that generates a laser light and a first optical waveguide that guides the laser light; and an optical amplifier 120 provided on a second substrate and having a second waveguide that guides the laser light. The first optical waveguide is nonparallel relative to an end face of the first substrate and connected thereto, the second optical waveguide is nonparallel relative to an end face of the second substrate and connected thereto, and the first substrate and the second substrate are arranged such that the laser light output from the first optical waveguide is optically coupled to the second optical waveguide.

    OPTICAL MODULE
    10.
    发明公开
    OPTICAL MODULE 审中-公开

    公开(公告)号：US20240340085A1

    公开(公告)日：2024-10-10

    申请号：US18744779

    申请日：2024-06-17

    Applicant: FURUKAWA ELECTRIC CO., LTD.

    Inventor： Kazuya NAGASHIMA ,  Masaki KOTOKU ,  Tatsuro KUROBE ,  Kazuaki KIYOTA ,  Maiko ARIGA ,  Atsushi IZAWA ,  Yozo ISHIKAWA

    IPC: H04B10/40 ,  G02B6/42

    CPC classification number: H04B10/40 ,  G02B6/4246

    Abstract: An optical module includes: a modulator containing an InP-based semiconductor material, the modulator including a modulation signal providing unit configured to modulate input light; and an optical integrated circuit optically coupled to the modulator, the optical integrated circuit integrating a plurality of waveguides and a plurality of optical elements including a silicon-based semiconductor material. The optical integrated circuit is configured to output light passed through any one of the waveguides or any one of the optical elements to the modulator, receive modulation light generated by the modulator that modulates the light, and output the modulation light passed through any one of other waveguides or any one of other optical elements.

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