Fuel cell cathode catalyst
    1.
    发明申请
    Fuel cell cathode catalyst 有权
    燃料电池阴极催化剂

    公开(公告)号:US20050069755A1

    公开(公告)日:2005-03-31

    申请号:US10674594

    申请日:2003-09-29

    摘要: A fuel cell cathode catalyst is provided which comprises nanostructured elements comprising microstructured support whiskers bearing nanoscopic catalyst particles. The nanoscopic catalyst particles are made by the alternating application of first and second layers, the first layer comprising platinum and the second layer being an alloy or intimate mixture of iron and a second metal selected from the group consisting of Group VIb metals, Group VIIb metals and Group VIIIb metals other than platinum and iron, where the atomic ratio of iron to the second metal in the second layer is between 0 and 10, where the planar equivalent thickness ratio of the first layer to the second layer is between 0.3 and 5, and wherein the average bilayer planar equivalent thickness of the first and second layers is less than 100 Å. A method of making such nanoscopic catalyst particles comprising the alternate steps of vacuum deposition of platinum and vacuum deposition of an alloy or intimate mixture of iron and a second metal is also provided.

    摘要翻译: 提供了一种燃料电池阴极催化剂,其包括纳米结构元件,其包含具有纳米级催化剂颗粒的微结构化支撑晶须。 纳米级催化剂颗粒通过交替施加第一和第二层制成,第一层包含铂,第二层是铁和选自第VIb族金属,第VIIb族金属的第二金属的合金或紧密混合物 和除了铂和铁之外的第VIIIb族金属,其中第二层中铁与第二金属的原子比在0和10之间,其中第一层与第二层的平面当量厚度比在0.3和5之间, 并且其中所述第一和第二层的平均双层平面等效厚度小于100。 还提供了制造这种纳米级催化剂颗粒的方法,其包括铂的真空沉积的交替步骤和真空沉积合金或铁和第二金属的紧密混合物。

    Form-in-place fastening for fuel cell assemblies
    2.
    发明申请
    Form-in-place fastening for fuel cell assemblies 有权
    用于燃料电池组件的现场固定

    公开(公告)号:US20060142039A1

    公开(公告)日:2006-06-29

    申请号:US11025267

    申请日:2004-12-29

    IPC分类号: H04Q7/20

    摘要: A fuel cell sub-assembly includes first and second flow field plates each comprising several fastener apertures defined at a number of fastening locations. A membrane electrode assembly is situated between the first and second flow field plates and includes several fastener apertures defined at a number of fastening locations, the respective fastener apertures aligned to define fastening holes. A form-in-place fastener formed of an elastomeric material is disposed in each of the fastening holes. The elastomeric material facilitates volumetric displacement of the form-in-place fasteners in response to placing the fuel cell sub-assembly in compression.

    摘要翻译: 燃料电池子组件包括第一和第二流场板,每个流场板包括在多个紧固位置处限定的多个紧固件孔。 膜电极组件位于第一和第二流场板之间,并且包括限定在多个紧固位置处的几个紧固件孔,相应的紧固件孔对齐以限定紧固孔。 由弹性体材料形成的就地固定紧固件设置在每个紧固孔中。 响应于将燃料电池子组件置于压缩状态,弹性体材料有助于就地固定紧固件的体积位移。

    Methods and systems for detecting pinholes in a film formed on a wafer or for monitoring a thermal process tool
    3.
    发明授权
    Methods and systems for detecting pinholes in a film formed on a wafer or for monitoring a thermal process tool 有权
    用于检测在晶片上形成的膜中的针孔或用于监测热处理工具的方法和系统

    公开(公告)号:US07528944B2

    公开(公告)日:2009-05-05

    申请号:US11751970

    申请日:2007-05-22

    IPC分类号: G01N21/00

    摘要: Methods and systems for detecting pinholes in a film formed on a wafer or for monitoring a thermal process tool are provided. One method for detecting pinholes in a film formed on a wafer includes generating output responsive to light from the wafer using an inspection system. The output includes first output corresponding to defects on the wafer and second output that does not correspond to the defects. This method also includes detecting the pinholes in the film formed on the wafer using the second output. One method for monitoring a thermal process tool includes generating output responsive to light from a wafer using an inspection system. The output includes the first and second output described above. The wafer was processed by the thermal process tool prior to generating the output. The method also includes monitoring the thermal process tool using the second output.

    摘要翻译: 提供了用于检测在晶片上形成的膜中的针孔或用于监测热处理工具的方法和系统。 用于检测形成在晶片上的膜中的针孔的一种方法包括使用检查系统响应于来自晶片的光而产生输出。 输出包括对应于晶片上的缺陷的第一输出和不对应于缺陷的第二输出。 该方法还包括使用第二输出来检测在晶片上形成的膜中的针孔。 用于监测热处理工具的一种方法包括响应来自使用检查系统的晶片的光产生输出。 输出包括上述第一和第二输出。 在生成输出之前,通过热处理工具处理晶片。 该方法还包括使用第二输出来监测热处理工具。

    Computer-implemented methods for inspecting and/or classifying a wafer
    4.
    发明授权
    Computer-implemented methods for inspecting and/or classifying a wafer 有权
    用于检查和/或分类晶片的计算机实现的方法

    公开(公告)号:US08269960B2

    公开(公告)日:2012-09-18

    申请号:US12179260

    申请日:2008-07-24

    IPC分类号: G01N21/00

    摘要: Computer-implemented methods for inspecting and/or classifying a wafer are provided. One computer-implemented includes detecting defects on a wafer using one or more defect detection parameters, which are determined based on a non-spatially localized characteristic of the wafer that is determined using output responsive to light scattered from the wafer generated by an inspection system. Another computer-implemented method includes classifying a wafer based on a combination of a non-spatially localized characteristic of the wafer determined using output responsive to light scattered from the wafer generated by an inspection system and a spatially localized characteristic of the wafer determined using the output.

    摘要翻译: 提供了用于检查和/或分类晶片的计算机实现的方法。 一种计算机实现的包括使用一个或多个缺陷检测参数来检测晶片上的缺陷,所述缺陷检测参数是基于使用响应于由检查系统产生的晶片散射的光的输出而确定的晶片的非空间局部特征确定的。 另一种计算机实现的方法包括基于使用响应于由检查系统产生的晶片散射的光的输出确定的晶片的非空间局部化特性和使用输出确定的晶片的空间局部化特性的组合来分类晶片 。

    Illumination modulation technique
    5.
    发明申请
    Illumination modulation technique 审中-公开
    照明调制技术

    公开(公告)号:US20060132471A1

    公开(公告)日:2006-06-22

    申请号:US11014929

    申请日:2004-12-17

    IPC分类号: G09G5/00

    摘要: A technique includes pulse width modulating a beam of a light to establish a pixel intensity. The technique includes controlling a light source to modulate an illumination of the beam to create different tonal resolution ranges for the pixel intensity.

    摘要翻译: 一种技术包括脉冲宽度调制光束以建立像素强度。 该技术包括控制光源以调制光束的照明,以为像素强度创建不同的色调分辨率范围。

    COMPUTER-IMPLEMENTED METHODS FOR INSPECTING AND/OR CLASSIFYING A WAFER
    6.
    发明申请
    COMPUTER-IMPLEMENTED METHODS FOR INSPECTING AND/OR CLASSIFYING A WAFER 有权
    用于检查和/或分类WAFER的计算机实现方法

    公开(公告)号:US20100060888A1

    公开(公告)日:2010-03-11

    申请号:US12179260

    申请日:2008-07-24

    IPC分类号: G01N21/88 B07C5/02

    摘要: Computer-implemented methods for inspecting and/or classifying a wafer are provided. One computer-implemented includes detecting defects on a wafer using one or more defect detection parameters, which are determined based on a non-spatially localized characteristic of the wafer that is determined using output responsive to light scattered from the wafer generated by an inspection system. Another computer-implemented method includes classifying a wafer based on a combination of a non-spatially localized characteristic of the wafer determined using output responsive to light scattered from the wafer generated by an inspection system and a spatially localized characteristic of the wafer determined using the output.

    摘要翻译: 提供了用于检查和/或分类晶片的计算机实现的方法。 一种计算机实现的包括使用一个或多个缺陷检测参数来检测晶片上的缺陷,所述缺陷检测参数是基于使用响应于由检查系统产生的晶片散射的光的输出而确定的晶片的非空间局部特征确定的。 另一种计算机实现的方法包括基于使用响应于由检查系统产生的晶片散射的光的输出确定的晶片的非空间局部化特性和使用输出确定的晶片的空间局部化特性的组合来分类晶片 。

    METHODS AND SYSTEMS FOR DETECTING PINHOLES IN A FILM FORMED ON A WAFER OR FOR MONITORING A THERMAL PROCESS TOOL
    7.
    发明申请
    METHODS AND SYSTEMS FOR DETECTING PINHOLES IN A FILM FORMED ON A WAFER OR FOR MONITORING A THERMAL PROCESS TOOL 有权
    用于检测形成在膜上的薄膜或用于监测热过程工具的方法和系统

    公开(公告)号:US20080018887A1

    公开(公告)日:2008-01-24

    申请号:US11751970

    申请日:2007-05-22

    IPC分类号: G01N21/00

    摘要: Methods and systems for detecting pinholes in a film formed on a wafer or for monitoring a thermal process tool are provided. One method for detecting pinholes in a film formed on a wafer includes generating output responsive to light from the wafer using an inspection system. The output includes first output corresponding to defects on the wafer and second output that does not correspond to the defects. This method also includes detecting the pinholes in the film formed on the wafer using the second output. One method for monitoring a thermal process tool includes generating output responsive to light from a wafer using an inspection system. The output includes the first and second output described above. The wafer was processed by the thermal process tool prior to generating the output. The method also includes monitoring the thermal process tool using the second output.

    摘要翻译: 提供了用于检测在晶片上形成的膜中的针孔或用于监测热处理工具的方法和系统。 用于检测形成在晶片上的膜中的针孔的一种方法包括使用检查系统响应来自晶片的光产生输出。 输出包括对应于晶片上的缺陷的第一输出和不对应于缺陷的第二输出。 该方法还包括使用第二输出来检测在晶片上形成的膜中的针孔。 用于监测热处理工具的一种方法包括响应来自使用检查系统的晶片的光产生输出。 输出包括上述第一和第二输出。 在生成输出之前,通过热处理工具处理晶片。 该方法还包括使用第二输出来监测热处理工具。