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    COMPUTER-IMPLEMENTED METHODS FOR INSPECTING AND/OR CLASSIFYING A WAFER
    1.
    发明申请
    COMPUTER-IMPLEMENTED METHODS FOR INSPECTING AND/OR CLASSIFYING A WAFER 有权
    用于检查和/或分类WAFER的计算机实现方法

    公开(公告)号：US20100060888A1

    公开(公告)日：2010-03-11

    申请号：US12179260

    申请日：2008-07-24

    申请人： Juergen Reich ,  Louis Vintro ,  Prasanna Dighe ,  Andrew Steinbach ,  Daniel Kavaldjiev ,  Stephen Biellak

    发明人： Juergen Reich ,  Louis Vintro ,  Prasanna Dighe ,  Andrew Steinbach ,  Daniel Kavaldjiev ,  Stephen Biellak

    IPC分类号： G01N21/88 ,  B07C5/02

    CPC分类号： H01L22/12 ,  G01N21/9501 ,  H01L2924/0002 ,  H01L2924/00

    摘要： Computer-implemented methods for inspecting and/or classifying a wafer are provided. One computer-implemented includes detecting defects on a wafer using one or more defect detection parameters, which are determined based on a non-spatially localized characteristic of the wafer that is determined using output responsive to light scattered from the wafer generated by an inspection system. Another computer-implemented method includes classifying a wafer based on a combination of a non-spatially localized characteristic of the wafer determined using output responsive to light scattered from the wafer generated by an inspection system and a spatially localized characteristic of the wafer determined using the output.

    摘要翻译： 提供了用于检查和/或分类晶片的计算机实现的方法。 一种计算机实现的包括使用一个或多个缺陷检测参数来检测晶片上的缺陷，所述缺陷检测参数是基于使用响应于由检查系统产生的晶片散射的光的输出而确定的晶片的非空间局部特征确定的。 另一种计算机实现的方法包括基于使用响应于由检查系统产生的晶片散射的光的输出确定的晶片的非空间局部化特性和使用输出确定的晶片的空间局部化特性的组合来分类晶片 。

    Computer-implemented methods for inspecting and/or classifying a wafer
    2.
    发明授权
    Computer-implemented methods for inspecting and/or classifying a wafer 有权
    用于检查和/或分类晶片的计算机实现的方法

    公开(公告)号：US08269960B2

    公开(公告)日：2012-09-18

    申请号：US12179260

    申请日：2008-07-24

    申请人： Juergen Reich ,  Louis Vintro ,  Prasanna Dighe ,  Andrew Steinbach ,  Daniel Kavaldjiev ,  Stephen Biellak

    发明人： Juergen Reich ,  Louis Vintro ,  Prasanna Dighe ,  Andrew Steinbach ,  Daniel Kavaldjiev ,  Stephen Biellak

    IPC分类号： G01N21/00

    CPC分类号： H01L22/12 ,  G01N21/9501 ,  H01L2924/0002 ,  H01L2924/00

    摘要： Computer-implemented methods for inspecting and/or classifying a wafer are provided. One computer-implemented includes detecting defects on a wafer using one or more defect detection parameters, which are determined based on a non-spatially localized characteristic of the wafer that is determined using output responsive to light scattered from the wafer generated by an inspection system. Another computer-implemented method includes classifying a wafer based on a combination of a non-spatially localized characteristic of the wafer determined using output responsive to light scattered from the wafer generated by an inspection system and a spatially localized characteristic of the wafer determined using the output.

    摘要翻译： 提供了用于检查和/或分类晶片的计算机实现的方法。 一种计算机实现的包括使用一个或多个缺陷检测参数来检测晶片上的缺陷，所述缺陷检测参数是基于使用响应于由检查系统产生的晶片散射的光的输出而确定的晶片的非空间局部特征确定的。 另一种计算机实现的方法包括基于使用响应于由检查系统产生的晶片散射的光的输出确定的晶片的非空间局部化特性和使用输出确定的晶片的空间局部化特性的组合来分类晶片 。

    Methods and systems for detecting pinholes in a film formed on a wafer or for monitoring a thermal process tool
    3.
    发明授权
    Methods and systems for detecting pinholes in a film formed on a wafer or for monitoring a thermal process tool 有权
    用于检测在晶片上形成的膜中的针孔或用于监测热处理工具的方法和系统

    公开(公告)号：US07528944B2

    公开(公告)日：2009-05-05

    申请号：US11751970

    申请日：2007-05-22

    申请人： David Chen ,  Andrew Steinbach ,  Daniel Kavaldjiev ,  Alexander Belyaev ,  Juergen Reich

    发明人： David Chen ,  Andrew Steinbach ,  Daniel Kavaldjiev ,  Alexander Belyaev ,  Juergen Reich

    IPC分类号： G01N21/00

    CPC分类号： G01N21/894 ,  G01N21/47 ,  G01N21/55 ,  G01N21/9501 ,  G01N21/956 ,  G01N2021/4735 ,  G01N2021/8822 ,  G03F7/7065

    摘要： Methods and systems for detecting pinholes in a film formed on a wafer or for monitoring a thermal process tool are provided. One method for detecting pinholes in a film formed on a wafer includes generating output responsive to light from the wafer using an inspection system. The output includes first output corresponding to defects on the wafer and second output that does not correspond to the defects. This method also includes detecting the pinholes in the film formed on the wafer using the second output. One method for monitoring a thermal process tool includes generating output responsive to light from a wafer using an inspection system. The output includes the first and second output described above. The wafer was processed by the thermal process tool prior to generating the output. The method also includes monitoring the thermal process tool using the second output.

    摘要翻译： 提供了用于检测在晶片上形成的膜中的针孔或用于监测热处理工具的方法和系统。 用于检测形成在晶片上的膜中的针孔的一种方法包括使用检查系统响应于来自晶片的光而产生输出。 输出包括对应于晶片上的缺陷的第一输出和不对应于缺陷的第二输出。 该方法还包括使用第二输出来检测在晶片上形成的膜中的针孔。 用于监测热处理工具的一种方法包括响应来自使用检查系统的晶片的光产生输出。 输出包括上述第一和第二输出。 在生成输出之前，通过热处理工具处理晶片。 该方法还包括使用第二输出来监测热处理工具。

    METHODS AND SYSTEMS FOR DETECTING PINHOLES IN A FILM FORMED ON A WAFER OR FOR MONITORING A THERMAL PROCESS TOOL
    4.
    发明申请
    METHODS AND SYSTEMS FOR DETECTING PINHOLES IN A FILM FORMED ON A WAFER OR FOR MONITORING A THERMAL PROCESS TOOL 有权
    用于检测形成在膜上的薄膜或用于监测热过程工具的方法和系统

    公开(公告)号：US20080018887A1

    公开(公告)日：2008-01-24

    申请号：US11751970

    申请日：2007-05-22

    申请人： David Chen ,  Andrew Steinbach ,  Daniel Kavaldjiev ,  Alexander Belyaev ,  Juergen Reich

    发明人： David Chen ,  Andrew Steinbach ,  Daniel Kavaldjiev ,  Alexander Belyaev ,  Juergen Reich

    IPC分类号： G01N21/00

    CPC分类号： G01N21/894 ,  G01N21/47 ,  G01N21/55 ,  G01N21/9501 ,  G01N21/956 ,  G01N2021/4735 ,  G01N2021/8822 ,  G03F7/7065

    摘要： Methods and systems for detecting pinholes in a film formed on a wafer or for monitoring a thermal process tool are provided. One method for detecting pinholes in a film formed on a wafer includes generating output responsive to light from the wafer using an inspection system. The output includes first output corresponding to defects on the wafer and second output that does not correspond to the defects. This method also includes detecting the pinholes in the film formed on the wafer using the second output. One method for monitoring a thermal process tool includes generating output responsive to light from a wafer using an inspection system. The output includes the first and second output described above. The wafer was processed by the thermal process tool prior to generating the output. The method also includes monitoring the thermal process tool using the second output.

    摘要翻译： 提供了用于检测在晶片上形成的膜中的针孔或用于监测热处理工具的方法和系统。 用于检测形成在晶片上的膜中的针孔的一种方法包括使用检查系统响应来自晶片的光产生输出。 输出包括对应于晶片上的缺陷的第一输出和不对应于缺陷的第二输出。 该方法还包括使用第二输出来检测在晶片上形成的膜中的针孔。 用于监测热处理工具的一种方法包括响应来自使用检查系统的晶片的光产生输出。 输出包括上述第一和第二输出。 在生成输出之前，通过热处理工具处理晶片。 该方法还包括使用第二输出来监测热处理工具。

    Segmented polarizer for optimizing performance of a surface inspection system
    9.
    发明授权
    Segmented polarizer for optimizing performance of a surface inspection system 有权
    分段偏振器，用于优化表面检测系统的性能

    公开(公告)号：US08169613B1

    公开(公告)日：2012-05-01

    申请号：US12618620

    申请日：2009-11-13

    申请人： Stephen Biellak ,  Daniel Kavaldjiev

    发明人： Stephen Biellak ,  Daniel Kavaldjiev

    IPC分类号： G01J4/00

    CPC分类号： G01J1/0422 ,  G01J1/0429 ,  G01N21/8806 ,  G01N21/9501 ,  G02B5/3025 ,  G02B5/3075

    摘要： A polarizing device may be used with sample inspection system having one or more collection systems that receive scattered radiation from a region on a sample surface and direct it to a detector. The polarizing device disposed between the collection system(s) and the detector. The polarizing device may include a plurality of polarizing sections. The sections may be characterized by different polarization characteristics. The polarizing device is configured to transmit scattered radiation from defects to the detector and to block noise from background sources that do not share characteristics with scattered radiation from the defects from reaching the detector while, maximizing a capture rate for the defects the detector at a less than optimal signal-to-noise ratio.

    摘要翻译： 可以使用具有一个或多个收集系统的样本检查系统的偏振装置，其接收来自样品表面上的区域的散射辐射并将其引导到检测器。 设置在收集系统和检测器之间的偏振装置。 偏振装置可以包括多个偏振部分。 这些部分可以具有不同的偏振特性。 偏振装置被配置为将来自缺陷的散射辐射传输到检测器并且阻止来自背景源的噪声，其不与来自缺陷的散射辐射共享特征以到达检测器，同时使检测器的缺陷的捕获率最小化 比最佳信噪比。

    Wafer inspection
    10.
    发明授权
    Wafer inspection 有权
    晶圆检查

    公开(公告)号：US09279774B2

    公开(公告)日：2016-03-08

    申请号：US13544954

    申请日：2012-07-09

    申请人： Anatoly Romanovsky ,  Ivan Maleev ,  Daniel Kavaldjiev ,  Yury Yuditsky ,  Dirk Woll ,  Stephen Biellak ,  Mehdi Vaez-Iravani ,  Guoheng Zhao

    发明人： Anatoly Romanovsky ,  Ivan Maleev ,  Daniel Kavaldjiev ,  Yury Yuditsky ,  Dirk Woll ,  Stephen Biellak ,  Mehdi Vaez-Iravani ,  Guoheng Zhao

    IPC分类号： G01N21/00 ,  G01N21/95 ,  G01N21/47 ,  G01N21/956

    CPC分类号： G01N21/9501 ,  G01N21/47 ,  G01N21/8806 ,  G01N21/8851 ,  G01N21/956

    摘要： Systems configured to inspect a wafer are provided. One system includes an illumination subsystem configured to simultaneously form multiple illumination areas on the wafer with substantially no illumination flux between each of the areas. The system also includes a scanning subsystem configured to scan the multiple illumination areas across the wafer. In addition, the system includes a collection subsystem configured to simultaneously and separately image light scattered from each of the areas onto two or more sensors. Characteristics of the two or more sensors are selected such that the scattered light is not imaged into gaps between the two or more sensors. The two or more sensors generate output responsive to the scattered light. The system further includes a computer subsystem configured to detect defects on the wafer using the output of the two or more sensors.

    摘要翻译： 提供了配置用于检查晶片的系统。 一个系统包括照明子系统，该照明子系统配置成在晶片上同时形成多个照明区域，其中每个区域之间基本上没有照明通量。 该系统还包括扫描子系统，被配置为扫描晶片上的多个照明区域。 另外，该系统包括一个收集子系统，该收集子系统配置成同时并分别将从每个区域散射的光分别映射到两个或更多个传感器上。 选择两个或更多个传感器的特征，使得散射光不被成像到两个或更多个传感器之间的间隙中。 两个或多个传感器响应散射光产生输出。 该系统还包括被配置为使用两个或更多个传感器的输出来检测晶片上的缺陷的计算机子系统。