摘要:
A fuel cell cathode catalyst is provided which comprises nanostructured elements comprising microstructured support whiskers bearing nanoscopic catalyst particles. The nanoscopic catalyst particles are made by the alternating application of first and second layers, the first layer comprising platinum and the second layer being an alloy or intimate mixture of iron and a second metal selected from the group consisting of Group VIb metals, Group VIIb metals and Group VIIIb metals other than platinum and iron, where the atomic ratio of iron to the second metal in the second layer is between 0 and 10, where the planar equivalent thickness ratio of the first layer to the second layer is between 0.3 and 5, and wherein the average bilayer planar equivalent thickness of the first and second layers is less than 100 Å. A method of making such nanoscopic catalyst particles comprising the alternate steps of vacuum deposition of platinum and vacuum deposition of an alloy or intimate mixture of iron and a second metal is also provided.
摘要:
A fuel cell sub-assembly includes first and second flow field plates each comprising several fastener apertures defined at a number of fastening locations. A membrane electrode assembly is situated between the first and second flow field plates and includes several fastener apertures defined at a number of fastening locations, the respective fastener apertures aligned to define fastening holes. A form-in-place fastener formed of an elastomeric material is disposed in each of the fastening holes. The elastomeric material facilitates volumetric displacement of the form-in-place fasteners in response to placing the fuel cell sub-assembly in compression.
摘要:
Methods and systems for detecting pinholes in a film formed on a wafer or for monitoring a thermal process tool are provided. One method for detecting pinholes in a film formed on a wafer includes generating output responsive to light from the wafer using an inspection system. The output includes first output corresponding to defects on the wafer and second output that does not correspond to the defects. This method also includes detecting the pinholes in the film formed on the wafer using the second output. One method for monitoring a thermal process tool includes generating output responsive to light from a wafer using an inspection system. The output includes the first and second output described above. The wafer was processed by the thermal process tool prior to generating the output. The method also includes monitoring the thermal process tool using the second output.
摘要:
Computer-implemented methods for inspecting and/or classifying a wafer are provided. One computer-implemented includes detecting defects on a wafer using one or more defect detection parameters, which are determined based on a non-spatially localized characteristic of the wafer that is determined using output responsive to light scattered from the wafer generated by an inspection system. Another computer-implemented method includes classifying a wafer based on a combination of a non-spatially localized characteristic of the wafer determined using output responsive to light scattered from the wafer generated by an inspection system and a spatially localized characteristic of the wafer determined using the output.
摘要:
A technique includes pulse width modulating a beam of a light to establish a pixel intensity. The technique includes controlling a light source to modulate an illumination of the beam to create different tonal resolution ranges for the pixel intensity.
摘要:
Computer-implemented methods for inspecting and/or classifying a wafer are provided. One computer-implemented includes detecting defects on a wafer using one or more defect detection parameters, which are determined based on a non-spatially localized characteristic of the wafer that is determined using output responsive to light scattered from the wafer generated by an inspection system. Another computer-implemented method includes classifying a wafer based on a combination of a non-spatially localized characteristic of the wafer determined using output responsive to light scattered from the wafer generated by an inspection system and a spatially localized characteristic of the wafer determined using the output.
摘要:
Methods and systems for detecting pinholes in a film formed on a wafer or for monitoring a thermal process tool are provided. One method for detecting pinholes in a film formed on a wafer includes generating output responsive to light from the wafer using an inspection system. The output includes first output corresponding to defects on the wafer and second output that does not correspond to the defects. This method also includes detecting the pinholes in the film formed on the wafer using the second output. One method for monitoring a thermal process tool includes generating output responsive to light from a wafer using an inspection system. The output includes the first and second output described above. The wafer was processed by the thermal process tool prior to generating the output. The method also includes monitoring the thermal process tool using the second output.
摘要:
A technique includes pulse width modulating an illuminating beam of a light to establish a pixel intensity and modulating the illuminating beam to create different tonal resolution ranges for the pixel intensity.