Abstract:
A distributed sensing system is provided. The system may have a primary portion and a distributed sensing portion separated by an air gap. The primary portion and the distributed sensing portion may be inductively coupled by a transformer having a primary coil and a secondary coil. A controller may direct a power supply to drive the primary coil with a driving waveform. The controller may vary a frequency of the driving waveform to substantially equal a resonant frequency of the transformer. The controller may monitor the power transfer between the primary coil and the secondary coil and may vary the frequency of the driving waveform in response. In this manner, the amount of power transferred from the primary coil to the secondary coil may be optimized in response to the controller substantially matching the driving waveform to the resonant frequency of the transformer.
Abstract:
A connector assembly includes a first side connector and a second side connector. The first side connector includes a first protective housing, a first inductor including a first end face, and a first physical connector element. The second side connector includes a second protective housing, a second inductor including a second face, and a second physical connector element. The second physical connector element is engaged with the first physical connector element and physically connects the first side connector to the second side connector such that the first end face and the second end face are adjacent. The first inductor and the second inductor are axially spaced apart. The first inductor and the second inductor form an inductive telemetry connection between the first side connector and the second side connector.
Abstract:
A method of manufacturing a sealed circuit card assembly includes disposing a circuit card assembly within a volume defined by a housing and at least partially filling the volume with a curable liquid such that the curable liquid encapsulates at least a circuit card. The method may also include curing the curable liquid to form a potted circuit card assembly and, after at least partially filling the volume with the curable liquid and after curing the curable liquid, vacuum impregnating the potted circuit card assembly with a sealant to seal any exposed interfaces or cracks to form the sealed circuit card assembly. Accordingly, the sealed circuit card assembly may include a first cured material encapsulating the circuit card of the circuit card assembly and a second cured material disposed within, for example, a porosity of the first cured material.
Abstract:
What is described is a tire pressure sensor for use in a wheel of aircraft landing gear. The tire pressure sensor includes a position sensor configured to detect a movement of the wheel and generate a wheel movement signal based on the movement. The tire pressure sensor also includes a processor coupled to the position sensor. The processor is configured to receive the wheel movement signal, determine a wheel rotational speed of the wheel based on the wheel movement signal and generate a wheel rotational speed signal based on the wheel rotational speed.
Abstract:
A tire pressure sensor is provided. The tire pressure sensor comprises a sensor housing having a first engagement portion defining an opening. A pressure sensing element is within the sensor housing and is in fluid communication with the opening of the sensor housing. The tire pressure sensor is configured to engage and be in fluid communication with an over-inflation pressure relief valve. The over-inflation relief valve is engagable in a wheel of an aircraft wheel assembly. The tire pressure sensor is also disengageable from the over-inflation pressure relief valve. A tire pressure sensor assembly and an aircraft wheel system are also provided.
Abstract:
A handheld interrogation device includes a controller configured to generate a power signal. The controller is also configured to determine tire pressure data based on a signal received from a tire pressure sensor. The handheld interrogation device also includes a primary coil coupled to the handheld interrogation device and configured to transmit the power signal to a sensor coil of the tire pressure sensor and to receive a data signal from the sensor coil, via inductive coupling, in response to the primary coil being within a predetermined distance of the sensor coil.
Abstract:
A method of manufacturing a sealed circuit card assembly includes disposing a circuit card assembly within a volume defined by a housing and at least partially filling the volume with a curable liquid such that the curable liquid encapsulates at least a circuit card. The method may also include curing the curable liquid to form a potted circuit card assembly and, after at least partially filling the volume with the curable liquid and after curing the curable liquid, vacuum impregnating the potted circuit card assembly with a sealant to seal any exposed interfaces or cracks to form the sealed circuit card assembly. Accordingly, the sealed circuit card assembly may include a first cured material encapsulating the circuit card of the circuit card assembly and a second cured material disposed within, for example, a porosity of the first cured material.
Abstract:
A control unit supplies power and data through a rotary transformer to a sensor assembly disposed on a wheel. The data sent by the control unit to the sensor assembly is produced by modulation of the power signal using frequency shift key or amplitude shift key modulation. The sensor assembly converts the received power signal that power to operate the circuitry and sensor assembly, converts the FSK or ASK data signal, and sends sensor data back to the control unit through the rotary transformer by load modulation. The control unit demodulates the load modulated sensor data.
Abstract:
Distributing sensing systems that are capable of wirelessly communicating power and data over power lines are provided. The distributed sensing system may comprise a distributed sensing portion and a primary portion. The distributed sensing portion may include a sensor, an analog to digital converter (“ADC”) and a microcontroller. The sensor may be capable of monitoring a parameter. The sensor may be configured to output an analog reading. The ADC may be configured to convert the analog reading to a digital signal. The microcontroller may be configured to modulate a power signal to encode the digital signal in the power signal. The primary portion may be configured to wirelessly receive the power signal from the distributed sensing portion. The primary portion may include a signal demodulation module. The signal demodulation module may be configured to extract the digital signal from the power signal.
Abstract:
A tire pressure sensor is provided. The tire pressure sensor comprises a sensor housing having a first engagement portion defining an opening. A pressure sensing element is within the sensor housing and is in fluid communication with the opening of the sensor housing. The tire pressure sensor is configured to engage and be in fluid communication with an over-inflation pressure relief valve. The over-inflation relief valve is engagable in a wheel of an aircraft wheel assembly. The tire pressure sensor is also disengagable from the over-inflation pressure relief valve. A tire pressure sensor assembly and an aircraft wheel system are also provided.