-
公开(公告)号:US20250071936A1
公开(公告)日:2025-02-27
申请号:US18454755
申请日:2023-08-23
Applicant: HRL LABORATORIES, LLC
Inventor: John H. Martin , David A. Smith , Christopher Roper
IPC: H05K7/20
Abstract: A microchannel cooling block includes: a base plate; a microchannel array including a plurality of thermally conductive plates connected to and extending from a surface of the base plate, the thermally conductive plates being aligned so that a highest or second highest thermally conductive axis thereof extends away from the surface of the base plate, adjacent ones of the thermally conductive plates being spaced apart from each other to form a plurality of microchannels between the thermally conductive plates, one of the microchannels being between each adjacent two of the thermally conductive plates; and a manifold connected to the thermally conductive plates, an interior of the manifold being in fluid communication with the microchannels in the microchannel array.
-
公开(公告)号:US11869679B2
公开(公告)日:2024-01-09
申请号:US17576897
申请日:2022-01-14
Applicant: HRL Laboratories, LLC
Inventor: Travis Autry , Ian Counts , Jennifer Ellis , Danny Kim , Christopher Roper
Abstract: In some variations, an interferometric frequency-reference apparatus comprises: an atom source configured to supply neutral atoms to be ionized; an ionizer configured to excite the neutral atoms to form ionized atoms; an ion collimator configured to form a collimated beam of the ionized atoms; probe lasers; and a Doppler laser configured to determine a ground-state population of the ionized atoms, wherein the atom source, the ionizer, and the ion collimator are disposed within a vacuum chamber. Other variations provide a method of creating a stable frequency reference, comprising: forming ionized atoms from an atomic vapor; forming a collimated beam of ionized atoms; illuminating ionized atoms with first and second probe lasers; adjusting the frequencies of the first probe and second probe lasers using Ramsey spectroscopy to an S→D transition of ionized atoms; and determining a ground-state population of the ionized atoms with another laser.
-
公开(公告)号:US12009568B1
公开(公告)日:2024-06-11
申请号:US17031254
申请日:2020-09-24
Applicant: HRL LABORATORIES, LLC
Inventor: Ryan Quarfoth , Walter Wall , Shanying Cui , Christopher Roper , Jonathan Lynch
CPC classification number: H01Q1/02 , B64G1/58 , G01S13/9094 , H01Q1/002 , H01Q21/064 , H01Q1/286
Abstract: A thermal protection system includes: an outer skin; a thermally insulating material under the outer skin; and a high temperature radio frequency (RF) aperture. The RF aperture includes a plurality of waveguides separated from each other and extending through the outer skin and the thermally insulating material.
-
公开(公告)号:US11929186B2
公开(公告)日:2024-03-12
申请号:US18120787
申请日:2023-03-13
Applicant: HRL Laboratories, LLC
Inventor: Travis Autry , Ian Counts , Jennifer Ellis , Danny Kim , Christopher Roper
Abstract: In some variations, an interferometric frequency-reference apparatus comprises: an atom source configured to supply neutral atoms; a collimator configured to form a collimated beam of the neutral atoms; one or more probe lasers; and a Doppler laser configured to determine a ground-state population of the neutral atoms. Other variations provide a method of creating a stable frequency reference, comprising: forming a collimated beam of neutral atoms; illuminating the neutral atoms with first and second probe lasers; adjusting the frequencies of the first probe laser and second probe laser using Ramsey spectroscopy to an S→D transition of the neutral atoms; and determining a ground-state population of the neutral atoms with another laser. The interferometric frequency-reference apparatus may provide an optical frequency reference or a microwave frequency reference.
-
公开(公告)号:US11862653B2
公开(公告)日:2024-01-02
申请号:US17111108
申请日:2020-12-03
Applicant: HRL LABORATORIES, LLC
Inventor: Mark O'Masta , Jacob Hundley , Eric Clough , Christopher Roper , Geoffrey McKnight
IPC: H01L27/146
CPC classification number: H01L27/14632 , H01L27/1462 , H01L27/14687
Abstract: An imaging sensor package includes: an imaging sensor; and an architected substrate coupled to a bottom surface of the imaging sensor. The architected substrate has local stiffness variations along an in-plane direction of the architected substrate, and the imaging sensor and the architected substrate are curved.
-
公开(公告)号:US20210313374A1
公开(公告)日:2021-10-07
申请号:US17111108
申请日:2020-12-03
Applicant: HRL LABORATORIES, LLC
Inventor: Mark O'Masta , Jacob Hundley , Eric Clough , Christopher Roper , Geoffrey McKnight
IPC: H01L27/146
Abstract: An imaging sensor package includes: an imaging sensor; and an architected substrate coupled to a bottom surface of the imaging sensor. The architected substrate has local stiffness variations along an in-plane direction of the architected substrate, and the imaging sensor and the architected substrate are curved.
-
公开(公告)号:US20210116188A1
公开(公告)日:2021-04-22
申请号:US16930203
申请日:2020-07-15
Applicant: HRL LABORATORIES, LLC
Inventor: Christopher Roper , John Martin , Randall Schubert
IPC: F28F9/02
Abstract: A hierarchical heat exchanger manifold includes: first and second fluid passages respectively open to an inlet and an outlet in a first level of the heat exchanger manifold; a plurality of first and second fluid passages in a second level of the heat exchanger manifold; and a plurality of first and second fluid passages in a third level of the heat exchanger manifold. A number of the first fluid passages in the third level is greater than a number of the first fluid passages in the second level. Each of the first fluid passages in the second level is in fluid communication with the inlet and at least one of the first fluid passages in the third level, and each of the second fluid passages in the second level is in fluid communication with the outlet and at least one of the second fluid passages in the third level.
-
公开(公告)号:US12199357B1
公开(公告)日:2025-01-14
申请号:US17887725
申请日:2022-08-15
Applicant: HRL LABORATORIES, LLC
Inventor: Ryan Quarfoth , Christopher Roper , Jacob Hundley
Abstract: An apparatus and related method are disclosed for compensation of an antenna and/or an antenna array located at a surface that experiences environmental conditions. The apparatus can include: an embedded compensation and/or calibration structure configured to be interrogated by an electromagnetic wave, to dynamically compensate for surface erosion, thermal expansion, and/or dielectric constant changes of a surface scattering antenna; and a processor configured to: receive measurements of the compensation and/or calibration structure to determine beam pointing for dynamically varying surface conditions and perform sensing and/or seeking observation.
-
9.
公开(公告)号:US12103074B1
公开(公告)日:2024-10-01
申请号:US17702789
申请日:2022-03-24
Applicant: HRL Laboratories, LLC
Inventor: John H. Martin , Brennan Yahata , Darby Laplant , Christopher Roper
IPC: B33Y80/00 , B22F10/20 , B28B1/00 , B29C64/141 , B33Y10/00
CPC classification number: B22F10/20 , B28B1/001 , B29C64/141 , B33Y10/00 , B33Y80/00
Abstract: Some variations provide an additively manufactured article comprising a first region and a second region, wherein the first region is a solid region or a porous region, wherein the second region has a pore size larger than the first-region pore size, and wherein the first-region average permeability is lower than the second-region average permeability. Some variations provide a co-sintering method of making an architected material with regions having different permeabilities, in which different additive-manufacturing process parameters are applied to distinct regions of the structure. Other variations provide a wall-pinning method of making an architected material with regions having different permeabilities, in which additive-manufacturing process parameters are selected to sinter pinned feedstock powder between solid walls. Engineered structures with controlled permeability, integrated manifolds, and arbitrary geometries are disclosed, without the requirement of complex manufacturing. Many uses are described for the disclosed additively manufactured articles.
-
公开(公告)号:US20230253431A1
公开(公告)日:2023-08-10
申请号:US18299550
申请日:2023-04-12
Applicant: HRL LABORATORIES, LLC
Inventor: Mark O'Masta , Jacob Hundley , Jensen Severance , Brian Hempe , Christopher Roper
IPC: H01L27/146
CPC classification number: H01L27/14632 , H01L27/14687
Abstract: An imaging sensor package including: an imaging sensor; and a patterned substrate coupled to a surface of the imaging sensor. The imaging sensor and the patterned substrate being curved. The patterned substrate having a petal-shaped patterned area having a first thickness and a base substrate having a second thickness, the first thickness being greater than the second thickness.
-
-
-
-
-
-
-
-
-