公开(公告)号：US08226852B2

公开(公告)日：2012-07-24

申请号：US12914042

申请日：2010-10-28

申请人： Hai Sung Lee ,  Jong Myeon Lee ,  Ho Sung Choo ,  Myung Whun Chang ,  Youn Gon Park

发明人： Hai Sung Lee ,  Jong Myeon Lee ,  Ho Sung Choo ,  Myung Whun Chang ,  Youn Gon Park

IPC分类号： C09K11/02 ,  C09K11/08

CPC分类号： C09K11/7749 ,  C09K11/025 ,  H01L33/502 ,  H01L2933/0041

摘要： The invention relates to a method of forming a phosphor film and a method of manufacturing an LED package incorporating the same. The method of forming a phosphor film includes mixing phosphor and light-transmitting beads in an aqueous solvent such that the nano-sized light-transmitting beads having a first charge are adsorbed onto surfaces of phosphor particles having a second charge. The method also includes coating a phosphor mixture obtained from the mixing step on an area where the phosphor film is to be formed, and drying the coated phosphor mixture to form the phosphor film. The invention further provides a method of manufacturing an LED package incorporating the method of forming the phosphor film.

摘要翻译： 本发明涉及一种形成荧光膜的方法及其制造方法。 形成荧光体膜的方法包括在水性溶剂中混合荧光体和透光珠，使得具有第一电荷的纳米尺寸的透光珠吸附在具有第二电荷的荧光体颗粒的表面上。 该方法还包括将从混合步骤获得的荧光体混合物涂覆在要形成荧光膜的区域上，并干燥涂覆的荧光体混合物以形成荧光膜。 本发明还提供一种制造包含形成荧光膜的方法的LED封装的方法。

公开(公告)号：US20070194691A1

公开(公告)日：2007-08-23

申请号：US11708466

申请日：2007-02-21

申请人： Ho Sung Choo ,  Youn Gon Park ,  Hai Sung Lee ,  Myung Whun Chang ,  Jong Myeon Lee

发明人： Ho Sung Choo ,  Youn Gon Park ,  Hai Sung Lee ,  Myung Whun Chang ,  Jong Myeon Lee

IPC分类号： H01J1/62

CPC分类号： C09K11/02 ,  C09K11/08 ,  H01L33/505 ,  H01L33/54 ,  H01L2224/48091 ,  H01L2224/8592 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

摘要： In a light emitting diode package, a package substrate includes a mounting area, an electrode and a light emitting diode chip disposed on the mounting area. A phosphor film encapsulates the light emitting diode chip in an upward convex configuration. A resin encapsulant encapsulates the phosphor film in an upward convex configuration. The light emitting diode package prevents light loss which arises from increased light scattering due to dense phosphors, thereby achieving excellent light extraction efficiency. Also, a phosphor film is formed by dispensing, thereby leading to no breaking of an upper wire even in a face-up chip.

摘要翻译： 在发光二极管封装中，封装基板包括设置在安装区域上的安装区域，电极和发光二极管芯片。 荧光体膜将发光二极管芯片封装成向上凸起的构造。 树脂密封剂将磷光体膜以向上凸起的形式封装。 发光二极管封装防止由于致密荧光体引起的光散射引起的光损失，从而获得优异的光提取效率。 此外，通过分配形成荧光膜，从而即使在面朝上的芯片中也不会导致上部线断裂。

公开(公告)号：US08557617B2

公开(公告)日：2013-10-15

申请号：US11709130

申请日：2007-02-22

申请人： Youn Gon Park ,  Jong Myeon Lee ,  Hai Sung Lee ,  Myung Whun Chang ,  Ho Sung Choo

发明人： Youn Gon Park ,  Jong Myeon Lee ,  Hai Sung Lee ,  Myung Whun Chang ,  Ho Sung Choo

IPC分类号： H01L21/00

CPC分类号： H01L33/54 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014

摘要： A method of manufacturing a light emitting diode package. A cup-shaped package structure with a recess formed therein and an electrode structure formed on a bottom of the recess is prepared. A light emitting diode chip is mounted on a bottom of the recess with a terminal of the chip electrically connected to the electrode structure. A liquid-state transparent resin is injected in the recess and before the liquid-state transparent resin is completely cured, a stamp with a micro rough pattern engraved thereon is applied on an upper surface of the resin. The liquid-state transparent resin is cured with the stamp applied thereon to form a resin encapsulant and the stamp is removed from the resin encapsulant.

摘要翻译： 一种制造发光二极管封装的方法。 制备其中形成有凹部的杯形封装结构和形成在凹部的底部上的电极结构。 发光二极管芯片安装在凹部的底部，其中芯片的端子电连接到电极结构。 将液态透明树脂注入到凹部中，并且在液态透明树脂完全固化之前，将刻有其上的微粗糙图案的印模涂布在树脂的上表面上。 液态透明树脂用施加在其上的印模固化以形成树脂密封剂，并且从树脂密封剂中除去印模。

公开(公告)号：US07842333B2

公开(公告)日：2010-11-30

申请号：US11524952

申请日：2006-09-22

申请人： Hai Sung Lee ,  Jong Myeon Lee ,  Ho Sung Choo ,  Myung Whun Chang ,  Youn Gon Park

发明人： Hai Sung Lee ,  Jong Myeon Lee ,  Ho Sung Choo ,  Myung Whun Chang ,  Youn Gon Park

IPC分类号： B05D5/06 ,  B05D1/12 ,  B05D7/00

CPC分类号： C09K11/7749 ,  C09K11/025 ,  H01L33/502 ,  H01L2933/0041

摘要： The invention relates to a method of forming a phosphor film and a method of manufacturing an LED package incorporating the same. The method of forming a phosphor film includes mixing phosphor and light-transmitting beads in an aqueous solvent such that the nano-sized light-transmitting beads having a first charge are adsorbed onto surfaces of phosphor particles having a second charge. The method also includes coating a phosphor mixture obtained from the mixing step on an area where the phosphor film is to be formed, and drying the coated phosphor mixture to form the phosphor film. The invention further provides a method of manufacturing an LED package incorporating the method of forming the phosphor film.

摘要翻译： 本发明涉及一种形成荧光膜的方法及其制造方法。 形成荧光体膜的方法包括在水性溶剂中混合荧光体和透光珠，使得具有第一电荷的纳米尺寸的透光珠吸附在具有第二电荷的荧光体颗粒的表面上。 该方法还包括将从混合步骤获得的荧光体混合物涂覆在要形成荧光膜的区域上，并干燥涂覆的荧光体混合物以形成荧光膜。 本发明还提供一种制造包含形成荧光膜的方法的LED封装的方法。

公开(公告)号：US20110043100A1

公开(公告)日：2011-02-24

申请号：US12914042

申请日：2010-10-28

申请人： Hai Sung LEE ,  Jong Myeon Lee ,  Ho Sung Choo ,  Myung Whun Chang ,  Youn Gon Park

发明人： Hai Sung LEE ,  Jong Myeon Lee ,  Ho Sung Choo ,  Myung Whun Chang ,  Youn Gon Park

IPC分类号： H01J1/63 ,  C09K11/06 ,  B82Y30/00

CPC分类号： C09K11/7749 ,  C09K11/025 ,  H01L33/502 ,  H01L2933/0041

摘要： The invention relates to a method of forming a phosphor film and a method of manufacturing an LED package incorporating the same. The method of forming a phosphor film includes mixing phosphor and light-transmitting beads in an aqueous solvent such that the nano-sized light-transmitting beads having a first charge are adsorbed onto surfaces of phosphor particles having a second charge. The method also includes coating a phosphor mixture obtained from the mixing step on an area where the phosphor film is to be formed, and drying the coated phosphor mixture to form the phosphor film. The invention further provides a method of manufacturing an LED package incorporating the method of forming the phosphor film.

摘要翻译： 本发明涉及一种形成荧光膜的方法及其制造方法。 形成荧光体膜的方法包括在水性溶剂中混合荧光体和透光珠，使得具有第一电荷的纳米尺寸的透光珠吸附在具有第二电荷的荧光体颗粒的表面上。 该方法还包括将从混合步骤获得的荧光体混合物涂覆在要形成荧光膜的区域上，并干燥涂覆的荧光体混合物以形成荧光膜。 本发明还提供一种制造包含形成荧光膜的方法的LED封装的方法。

公开(公告)号：US20070196939A1

公开(公告)日：2007-08-23

申请号：US11709130

申请日：2007-02-22

申请人： Youn Gon Park ,  Jong Myeon Lee ,  Hai Sung Lee ,  Myung Whun Chang ,  Ho Sung Choo

发明人： Youn Gon Park ,  Jong Myeon Lee ,  Hai Sung Lee ,  Myung Whun Chang ,  Ho Sung Choo

IPC分类号： H01L21/00

CPC分类号： H01L33/54 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014

摘要： A method of manufacturing a light emitting diode package. A cup-shaped package structure with a recess formed therein and an electrode structure formed on a bottom of the recess is prepared. A light emitting diode chip is mounted on a bottom of the recess with a terminal of the chip electrically connected to the electrode structure. A liquid-state transparent resin is injected in the recess and before the liquid-state transparent resin is completely cured, a stamp with a micro rough pattern engraved thereon is applied on an upper surface of the resin. The liquid-state transparent resin is cured with the stamp applied thereon to form a resin encapsulant and the stamp is removed from the resin encapsulant.

摘要翻译： 一种制造发光二极管封装的方法。 制备其中形成有凹部的杯形封装结构和形成在凹部的底部上的电极结构。 发光二极管芯片安装在凹部的底部，其中芯片的端子电连接到电极结构。 将液态透明树脂注入到凹部中，并且在液态透明树脂完全固化之前，将刻有其上的微粗糙图案的印模涂布在树脂的上表面上。 液态透明树脂用施加在其上的印模固化以形成树脂密封剂，并且从树脂密封剂中除去印模。

公开(公告)号：US20070148332A1

公开(公告)日：2007-06-28

申请号：US11524952

申请日：2006-09-22

申请人： Hai Sung Lee ,  Jong Myeon Lee ,  Ho Sung Choo ,  Myung Whun Chang ,  Youn Gon Park

发明人： Hai Sung Lee ,  Jong Myeon Lee ,  Ho Sung Choo ,  Myung Whun Chang ,  Youn Gon Park

IPC分类号： B05D1/12 ,  B05D7/00 ,  B05D5/12

CPC分类号： C09K11/7749 ,  C09K11/025 ,  H01L33/502 ,  H01L2933/0041

摘要： The invention relates to a method of forming a phosphor film and a method of manufacturing an LED package incorporating the same. The method of forming a phosphor film includes mixing phosphor and light-transmitting beads in an aqueous solvent such that the nano-sized light-transmitting beads having a first charge are adsorbed onto surfaces of phosphor particles having a second charge. The method also includes coating a phosphor mixture obtained from the mixing step on an area where the phosphor film is to be formed, and drying the coated phosphor mixture to form the phosphor film. The invention further provides a method of manufacturing an LED package incorporating the method of forming the phosphor film.

摘要翻译： 本发明涉及一种形成荧光膜的方法及其制造方法。 形成荧光体膜的方法包括在水性溶剂中混合荧光体和透光珠，使得具有第一电荷的纳米尺寸的透光珠吸附在具有第二电荷的荧光体颗粒的表面上。 该方法还包括将从混合步骤获得的荧光体混合物涂覆在要形成荧光膜的区域上，并干燥涂覆的荧光体混合物以形成荧光膜。 本发明还提供一种制造包含形成荧光膜的方法的LED封装的方法。

公开(公告)号：US20070194341A1

公开(公告)日：2007-08-23

申请号：US11709135

申请日：2007-02-22

申请人： Myung Whun Chang ,  Jong Myeon Lee ,  Ho Sung Choo ,  Young Gon Park ,  Hai Sung Lee

发明人： Myung Whun Chang ,  Jong Myeon Lee ,  Ho Sung Choo ,  Young Gon Park ,  Hai Sung Lee

IPC分类号： H01L33/00

CPC分类号： H01L33/56 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2933/0091 ,  H01L2924/00014

摘要： A light emitting diode package. A package substrate has first and second electrode structures and a light emitting diode is mounted on the package substrate and electrically connected to the first and second electrode structures. A resin encapsulant is made of a transparent resin to seal the light emitting diode. A plurality of transparent spherical particles having a refractive index higher than the transparent resin are dispersed in the resin encapsulant.

摘要翻译： 发光二极管封装。 封装衬底具有第一和第二电极结构，并且发光二极管安装在封装衬底上并电连接到第一和第二电极结构。 树脂密封剂由透明树脂制成以密封发光二极管。 折射率高于透明树脂的多个透明球形颗粒分散在树脂密封剂中。

公开(公告)号：US20090214881A1

公开(公告)日：2009-08-27

申请号：US12388849

申请日：2009-02-19

申请人： Myung Whun Chang ,  Jong Myeon Lee ,  Soo Hyun Lyoo ,  Ho Sung Choo

发明人： Myung Whun Chang ,  Jong Myeon Lee ,  Soo Hyun Lyoo ,  Ho Sung Choo

IPC分类号： B32B18/00 ,  C03B29/00

CPC分类号： C04B37/005 ,  C04B2237/062 ,  C04B2237/10 ,  C04B2237/341 ,  C04B2237/62 ,  C04B2237/74 ,  H05K1/0306 ,  H05K1/162 ,  H05K3/4611 ,  H05K3/4629 ,  H05K3/4688

摘要： There is provided a low temperature co-fired ceramic substrate having a diffusion barrier layer to prevent diffusion occurring in a heterojunction during firing and a method of manufacturing the same. A low temperature co-fired ceramic substrate according to an aspect of the invention may include: a first ceramic layer formed of a material having a first dielectric constant; a second ceramic layer formed of a material having a second dielectric constant lower than the first dielectric constant; and a diffusion barrier layer interposed between the first ceramic layer and the second ceramic layer and formed of the first ceramic layer material, the second ceramic layer material, and a barium (Ba) compound, wherein inter-diffusion between the first ceramic layer material and the second ceramic layer material is prevented by using the diffusion barrier layer.

摘要翻译： 提供了具有扩散阻挡层的低温共烧陶瓷基板及其制造方法，以防止在烧成期间发生异质结的扩散。 根据本发明的一个方面的低温共烧陶瓷衬底可以包括：由具有第一介电常数的材料形成的第一陶瓷层; 由具有低于第一介电常数的第二介电常数的材料形成的第二陶瓷层; 以及介于所述第一陶瓷层和所述第二陶瓷层之间并且由所述第一陶瓷层材料，所述第二陶瓷层材料和钡（Ba）化合物形成的扩散阻挡层，其中所述第一陶瓷层材料和 通过使用扩散阻挡层来防止第二陶瓷层材料。

公开(公告)号：US08093172B2

公开(公告)日：2012-01-10

申请号：US12271386

申请日：2008-11-14

申请人： Ho Sung Choo ,  Jong Myeon Lee ,  Eun Tae Park ,  Myung Whun Chang ,  Soo Hyun Lyoo ,  Beom Joon Cho

发明人： Ho Sung Choo ,  Jong Myeon Lee ,  Eun Tae Park ,  Myung Whun Chang ,  Soo Hyun Lyoo ,  Beom Joon Cho

IPC分类号： C04B35/468

CPC分类号： H01G4/1227 ,  C03C3/064 ,  C03C8/02 ,  C04B35/4682 ,  C04B2235/3215 ,  C04B2235/3232 ,  C04B2235/3298 ,  C04B2235/3409 ,  C04B2235/3418 ,  C04B2235/36 ,  C04B2235/5445 ,  H01G4/129 ,  H05K1/0306 ,  H05K1/162 ,  H05K3/4611 ,  H05K3/4629 ,  H05K3/4688

摘要： Provided are a glass composition, a dielectric composition and a multi-layer ceramic capacitor embedded low temperature co-fired ceramic substrate using the same. The multi-layer ceramic capacitor embedded low temperature co-fired ceramic substrate is sinterable at a low temperature while showing a high dielectric constant. The glass composition includes a composition component expressed by a composition formula of aBi2O3-bB2O3-cSiO2-dBaO-eTiO2, where a+b+c+d+e=100, and a, b, c, d, and e are 40≦a≦89, 10≦b≦50, 1≦c≦20, 0≦d≦10, and 0≦e≦10, respectively.

摘要翻译： 提供一种玻璃组合物，电介质组合物和使用其的多层陶瓷电容器嵌入式低温共烧陶瓷基板。 多层陶瓷电容器嵌入式低温共烧陶瓷基板在低温下可烧结，同时显示高介电常数。 该玻璃组合物包含由Bi 2 O 3 -bB 2 O 3 -cSiO 2 -dBaO-eTiO 2的组成式表示的组成成分，其中a + b + c + d + e = 100，a，b，c，d和e为40＆ a＆nlE; 89，10＆nlE; b＆nlE; 50,1＆nlE; c＆nlE; 20,0＆nlE; d＆nlE; 10和0＆nlE; e＆nlE; 10。