公开(公告)号：US5007576A

公开(公告)日：1991-04-16

申请号：US456446

申请日：1989-12-26

申请人： Helen Congleton ,  Carol L. Slaton ,  Angelo Koudounaris ,  Gerald B. Smith ,  Vicente Soto

发明人： Helen Congleton ,  Carol L. Slaton ,  Angelo Koudounaris ,  Gerald B. Smith ,  Vicente Soto

IPC分类号： H01L21/60 ,  H01L21/00 ,  H01L21/66

CPC分类号： H01L21/67138 ,  H01L24/48 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/0401 ,  H01L2224/13144 ,  H01L2224/45014 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/49175 ,  H01L2224/78313 ,  H01L2224/78314 ,  H01L2224/78315 ,  H01L2224/85181 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L24/45 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/14 ,  Y10T29/49149 ,  Y10T29/49151

摘要： An electrical circuit component is temporarily fixed to a temporary substrate. Electrical contacts on the component are interconnected with corresponding contacts on the test substrate by lead wires or ribbons using a bonding wedge that forms the lead wires into a gull-wing shape with central portions thereof formed adjacent to edge portions of the component. The component is subjected to a test procedure while fixed to the temporary substrate via signals applied to the contacts thereof. The lead wires are then severed near their connection to the temporary substrate, and the component with the remaining lead wire portions attached is removed from the test substrate. The lead wires are sufficiently stiff and/or are adhered to the edge portions of the component with an adhesive so as retain their shapes after removal of the component from the temporary substrate. The component is then adhered to a permanent device substrate, and the ends of the lead wires are bonded to corresponding contacts on the device substrate.

摘要翻译： 电路部件暂时固定在临时基板上。 部件上的电触点与测试基板上的相应触点相互连接，该导线或带使用一种将导线形成为鸥翼形状的接合楔，其中心部分邻近部件的边缘部分形成。 在通过施加到其触点的信号固定到临时基板的同时对该部件进行测试。 然后在其与临时基板的连接附近切断引线，并且将附着有剩余引线部分的部件从测试基板上移除。 导线足够坚硬和/或用粘合剂粘附到部件的边缘部分，以便在从临时基板移除部件之后保持其形状。 然后将该部件粘附到永久性装置基板上，并且引线的端部结合到装置基板上的相应触点。

公开(公告)号：US5153981A

公开(公告)日：1992-10-13

申请号：US718139

申请日：1991-06-20

申请人： Vicente Soto

发明人： Vicente Soto

IPC分类号： H01L21/00 ,  H05K13/04

CPC分类号： H01L21/67144 ,  H01L24/78 ,  H01L24/85 ,  H05K13/0465 ,  H01L2224/45014 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/48472 ,  H01L2224/78 ,  H01L2224/78313 ,  H01L2224/85 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/14 ,  Y10T29/49144 ,  Y10T29/53004 ,  Y10T29/53183

摘要： Lead wires (4) extending out from an electrical circuit device (2) are shaped for engagement to a substrate (38,40) upon which the device (2) is placed by engaging the lead wires (4) at a location laterally spaced from the device (2), exerting a force on the lead wire (4) at the engagement location to bend it down to the substrate (38,40), and then applying an inward force on the bent lead wire (4) towards the device (2) to further bend the wire to the desired shape. The lead wire (4) is engaged by a forming tool (21,27,33) having a universal head that applies the inward force either by biting into the lead wire (4) with a sharp edge (26), or by moving a bearing wall (36) against the end of the wire (4). When the forming tool (21,27,33) is operated by a programmable wire bonding system, the wire forming operation can be integrated with the bonding operation by using the same forming tool (21,27,33 ) to perform both functions. A single tool can be used to accommodate many different types of circuit packages and lead wire configurations.

摘要翻译： 从电路装置（2）伸出的引线（4）被成形为与基板（38,40）相接合，基板（38,40）通过将引线（4）与横向间隔开的位置 所述装置（2）在所述接合位置处在所述引线（4）上施加力以将其向下弯曲到所述基板（38,40），然后朝向所述装置向所述弯曲的引线（4）施加向内的力 （2）进一步将电线弯曲成所需的形状。 引线（4）由具有万向头的成形工具（21,23,33）接合，所述通用头部通过用锋利的边缘（26）咬入引线（4）来施加向内的力，或者通过移动 承载壁（36）抵靠线（4）的端部。 当成形工具（21,23,33）由可编程线接合系统操作时，可以通过使用相同的成形工具（21,23,33）来实现两种功能，从而将成形操作与结合操作集成在一起。 可以使用单个工具来适应许多不同类型的电路封装和引线配置。

公开(公告)号：US5414919A

公开(公告)日：1995-05-16

申请号：US278592

申请日：1994-07-21

申请人： Vicente Soto

发明人： Vicente Soto

IPC分类号： H01L21/60 ,  H05K13/04 ,  B23P23/04

CPC分类号： H05K13/0486 ,  H01L24/98 ,  H01L24/84 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  Y10T225/371 ,  Y10T29/49144 ,  Y10T29/49822 ,  Y10T29/51

摘要： Lead wires extending out from an electrical circuit device are removed from respective bonding pads to which they are bonded by a lateral shearing action. Shearing can be accomplished either unidirectionally, or with a bidirectional reciprocating movement. A shearing tool is provided with a single shearing projection for a unidirectional shearing, or with a pair of spaced shearing projections for bidirectional shearing. A vertical alignment is established between the tool and a first lead to be sheared, and this initial alignment is also used for shearing the other leads of the device. With the actual bond between a lead and its bonding pad occupying only a minor portion of the available surface area, a subsequent lead from a replacement device is bonded to the same bonding pad as the first lead by forming a new bond at a different site along the pad.

摘要翻译： 从电路装置延伸的引线从通过侧向剪切动作结合到其的相应的焊盘上去除。 剪切可以单向完成，也可以双向往复运动。 剪切工具设置有用于单向剪切的单个剪切突起，或者具有用于双向剪切的一对间隔剪切突起。 在工具和要被剪切的第一引线之间建立垂直对准，并且该初始对准也用于剪切设备的其它引线。 由于引线和其焊接区之间的实际结合仅占用可用表面积的较小部分，所以来自替换装置的随后的引线通过在不同部位沿着不同的部位形成新的键而与第一引线相连接 垫

公开(公告)号：US5513429A

公开(公告)日：1996-05-07

申请号：US386719

申请日：1995-02-08

申请人： Vicente Soto

发明人： Vicente Soto

IPC分类号： H01L21/60 ,  H05K13/04 ,  H05K3/34

CPC分类号： H05K13/0486 ,  H01L24/98 ,  H01L24/84 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  Y10T225/371 ,  Y10T29/49144 ,  Y10T29/49822 ,  Y10T29/51

摘要： Lead wires extending out from an electrical circuit device are removed from respective bonding pads to which they are bonded by a lateral shearing action. Shearing can be accomplished either unidirectionally, or with a bidirectional reciprocating movement. A shearing tool is provided with a single shearing projection for a unidirectional shearing, or with a pair of spaced shearing projections for bidirectional shearing. A vertical alignment is established between the tool and a first lead to be sheared, and this initial alignment is also used for shearing the other leads of the device. With the actual bond between a lead and its bonding pad occupying only a minor portion of the available surface area, a subsequent lead from a replacement device is bonded to the same bonding pad as the first lead by forming a new bond at a different site along the pad.

摘要翻译： 从电路装置延伸的引线从通过侧向剪切动作结合到其的相应的焊盘上去除。 剪切可以单向完成，也可以双向往复运动。 剪切工具设置有用于单向剪切的单个剪切突起，或者具有用于双向剪切的一对间隔剪切突起。 在工具和要被剪切的第一引线之间建立垂直对准，并且该初始对准也用于剪切设备的其它引线。 由于引线和其焊接区之间的实际结合仅占用可用表面积的较小部分，所以来自替换装置的随后的引线通过在不同部位沿着不同的部位形成新的键而与第一引线相连接 垫