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    Wedge bump bonding apparatus and method
    4.
    发明授权
    Wedge bump bonding apparatus and method 失效
    楔形焊接装置及方法

    公开(公告)号：US5364004A

    公开(公告)日：1994-11-15

    申请号：US60085

    申请日：1993-05-10

    申请人： R. Paul Davidson

    发明人： R. Paul Davidson

    IPC分类号： H01L21/607

    CPC分类号： H01L24/11 ,  H01L2224/0401 ,  H01L2224/1134 ,  H01L2224/45014 ,  H01L2224/45144 ,  H01L2224/78313 ,  H01L2224/78314 ,  H01L2224/78318 ,  H01L2224/85 ,  H01L24/12 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01079 ,  H01L2924/14

    摘要： An apparatus for applying interconnect bumps to an integrated circuit comprising a wedge bonder assembly (10) including a bonding tool (14) adapted to be selectively moved relative to the integrated circuit (42) and to transmit ultrasonic force to bond wire or ribbon (62) located between the bonding tool (14) and the integrated circuit (42) to the integrated circuit and form an interconnect bump (63), the bonding tool (14) defining a passage (44) through which wire or ribbon (50) is passed to be brought into contact with the integrated circuit (42) and an edge (38) positioned and adapted to weaken wire or ribbon (50) as the bonding tool (14) is moved to the point at which the bonding tool (14) is closest to the integrated circuit (42), the wedge bonder assembly being adapted to move the bonding tool (14) so as to separate the interconnect bump (63) from the wire or ribbon (50) proximal of the bump.

    摘要翻译： 一种用于将互连凸块应用于集成电路的装置，包括楔形接合器组件（10），该楔形接合器组件包括适于相对于集成电路（42）选择性地移动的接合工具（14），并且将超声波传递到接合线或带（62 ）位于所述接合工具（14）和所述集成电路（42）之间并且形成互连凸块（63），所述接合工具（14）限定通道（44），所述线或带（50） 通过以与所述集成电路（42）接触并且当所述接合工具（14）移动到所述接合工具（14）的位置时，定位并适于削弱电线或带状物（50）的边缘（38） 最接近集成电路（42），所述楔形接合器组件适于移动所述接合工具（14），以将所述互连凸起（63）与所述凸块近侧的所述线或带（50）分离。