公开(公告)号：US4865873A

公开(公告)日：1989-09-12

申请号：US129854

申请日：1987-12-07

申请人： Herbert S. Cole, Jr. ,  Lionel M. Levinson ,  Yung S. Liu ,  Theresa A. Sitnik

发明人： Herbert S. Cole, Jr. ,  Lionel M. Levinson ,  Yung S. Liu ,  Theresa A. Sitnik

IPC分类号： C23C18/16 ,  H05K3/00 ,  H05K3/18

CPC分类号： H05K3/184 ,  C23C18/1605 ,  C23C18/1608 ,  C23C18/1831 ,  C23C18/1879 ,  C23C18/206 ,  C23C18/30 ,  C23C18/31 ,  H05K2203/0565 ,  H05K2203/0577 ,  H05K2203/107 ,  H05K2203/1415 ,  H05K3/0017 ,  Y10S430/165

摘要： A metal is electrolessly plated on a substrate which is first coated with at least one ablatively-removable layer that is selectively irradiated with laser radiation to obtain a pattern for the deposition of metal on the substrate. The electroless plating solution applied to the substrate after the irradiated substrate is coated with a catalyst also serves to remove the unirradiated portion of the ablatively-removable layer. The method is particularly suited for plating fine lines of metal, especially on non-planar surfaces.

摘要翻译： 将金属无电镀在基材上，该基材首先涂覆有至少一个可剥离层，其被选择性地用激光辐射照射以获得用于在基材上沉积金属的图案。 在经过照射的基板涂覆有催化剂之后施加到基板上的化学镀溶液也用于去除可消泡层的未照射部分。 该方法特别适用于镀金属细线，尤其适用于非平面表面。

公开(公告)号：US5300812A

公开(公告)日：1994-04-05

申请号：US987849

申请日：1992-12-09

申请人： John H. Lupinski ,  Theresa A. Sitnik ,  Thomas B. Gorczyca ,  Steven T. Rice ,  Herbert S. Cole

发明人： John H. Lupinski ,  Theresa A. Sitnik ,  Thomas B. Gorczyca ,  Steven T. Rice ,  Herbert S. Cole

IPC分类号： C08K5/00 ,  C09J179/08 ,  H01L21/48 ,  H01L21/52 ,  H01L21/58 ,  H01L23/10 ,  H01L23/16

CPC分类号： C08K5/0016 ,  C09J179/08 ,  H01L21/481 ,  H01L23/10 ,  H01L24/24 ,  H01L24/75 ,  H01L24/82 ,  H01L24/83 ,  H01L2224/24227 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/75315 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/0132 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165

摘要： A plasticized polyetherimide, such as a blend of polyetherimide and a pentaerythritol tetrabenzoate ester, has been found useful as a low temperature laminating adhesive for making high density interconnect circuit arrays.

摘要翻译： 已经发现增塑聚醚酰亚胺，例如聚醚酰亚胺和季戊四醇四苯甲酸酯的共混物可用作制备高密度互连电路阵列的低温层压粘合剂。

公开(公告)号：US5091466A

公开(公告)日：1992-02-25

申请号：US513393

申请日：1990-04-23

申请人： Siegfried Aftergut ,  Theresa A. Sitnik

发明人： Siegfried Aftergut ,  Theresa A. Sitnik

IPC分类号： C08L79/08 ,  G03F7/038 ,  H05K1/03 ,  H05K3/28

CPC分类号： H05K3/285 ,  C08L79/08 ,  G03F7/0387 ,  H05K1/0346 ,  Y10T428/1352 ,  Y10T428/31721

摘要： A polyhydrazine is used to insolubilize a soluble polyimide. Soluble polyimide films on printed circuit boards can be insolubilized in this manner.

摘要翻译： 多肼用于使可溶性聚酰亚胺不溶化。 印刷电路板上的可溶性聚酰亚胺膜可以以这种方式不溶解。

公开(公告)号：US5008049A

公开(公告)日：1991-04-16

申请号：US410398

申请日：1989-09-21

申请人： James W. Rose ,  Theresa A. Sitnik

发明人： James W. Rose ,  Theresa A. Sitnik

IPC分类号： B29C65/14 ,  B29C65/16 ,  B29C67/00 ,  G02F1/1341

CPC分类号： B29C65/4845 ,  B29C65/1435 ,  B29C65/1483 ,  B29C65/542 ,  B29C67/004 ,  G02F1/1341 ,  B29C65/1406 ,  B29C65/1606 ,  B29C65/1635 ,  B29C65/1683

摘要： A device containing a fluid material is sealed by sealant material placed essentially completely around the periphery of the device to join spaced apart first and second members of the device; and aperture is formed through the seal and the device interior is evacuated. Then fluid material is introduced into the device interior through the aperture and only a limited region of the device, confined substantially to the aperture is exposed to electromagnetic radiation from a laser or the like, to hermetically close the aperture when a photoreactive adhesive is injected into the aperture to cause the adhesive to solidify when contacted by the electromagnetic radiation. In an alternate embodiment, the aperture is filled with a plug of thermoplastic material, which is then selectively heat treated by a laser or the like to cause the plug to bind to the aperture boundary and hermetically enclose the fluid material.

摘要翻译： 包含流体材料的装置由基本上完全围绕装置的周边放置的密封剂材料密封，以连接装置的间隔开的第一和第二构件; 并且通过密封件形成孔，并且将装置内部抽真空。 然后，流体材料通过孔被引入装置内部，并且仅当基本上限定在孔的受限区域暴露于来自激光器等的电磁辐射时，当将光反应粘合剂注入时气密地关闭孔 当电磁辐射接触时导致粘合剂固化的孔。 在替代实施例中，孔用一个热塑性材料塞填充，然后用激光等进行选择性热处理，以使塞子与孔口边界结合并气密地封闭流体材料。