-
公开(公告)号：US08066020B2
公开(公告)日：2011-11-29
申请号：US11588393
申请日：2006-10-27
IPC分类号： B08B3/00
CPC分类号： H01L21/67057 , B08B3/08 , B08B3/10
摘要： A substrate cleaning apparatus, comprises a process tank that holds a mixture containing a hydrogen peroxide solution and sulfuric acid and is used for cleaning a substrate immersed in said mixture; circulation piping that extends between a primary side of said process tank on which said mixture is injected into said process tank and a secondary side of said process tank on which said mixture is discharged from said process tank and has a pump for causing circulation of said mixture; a heater disposed in said circulation piping configured to heat said mixture to a predetermined temperature; a chemical injection pipe configured to inject a hydrogen peroxide solution into said circulation piping at a position between the primary side of said process tank and a secondary side, which is a downstream side, of said heater; and a filter disposed in said circulation piping configured to remove particles in said mixture.
摘要翻译： 一种基板清洗装置，包括保持含有过氧化氢溶液和硫酸的混合物的处理罐，用于清洗浸在所述混合物中的基板; 所述循环管道在所述处理罐的初级侧之间延伸，所述处理罐的所述混合物被注入到所述处理罐中，所述处理罐的二次侧在所述处理罐的二次侧上从所述处理罐排出所述混合物，并且具有用于使所述混合物循环的泵 ; 设置在所述循环管道中的加热器，被配置为将所述混合物加热至预定温度; 化学注入管，被配置为在所述处理罐的初级侧和位于所述加热器的下游侧的次级侧之间的位置处将过氧化氢溶液注入到所述循环管道中; 以及设置在所述循环管道中的过滤器，其构造成去除所述混合物中的颗粒。
-
2.发明申请Semiconductor manufacturing apparatus for use in process of cleaning semiconductor substrate and method of manufacturing semiconductor device using the same 审中-公开用于清洁半导体衬底的半导体制造装置及使用其的制造半导体器件的方法公开(公告)号：US20080006295A1
公开(公告)日：2008-01-10
申请号：US11542201
申请日：2006-10-04
CPC分类号： H01L21/31133 , G03F7/423
摘要： A processing tank stores heated sulfuric acid, and a semiconductor substrate having resist formed thereon and to be processed is immersed in the heated sulfuric acid. A first introduction unit introduces ozone gas into the sulfuric acid stored in the processing tank. A second introduction unit introduces hydrogen peroxide into the solution containing sulfuric acid and ozone at least before the processing of the semiconductor substrate is completed.
摘要翻译： 处理槽储存加热的硫酸，并将其上形成有待加工的抗蚀剂的半导体衬底浸入加热的硫酸中。 第一引入单元将臭氧气体引入储存在处理槽中的硫酸中。 至少在半导体基板的加工完成之前，第二引入单元将含有硫酸和臭氧的溶液引入到过氧化氢中。
-
公开(公告)号：US20120031441A1
公开(公告)日：2012-02-09
申请号：US13277251
申请日：2011-10-20
IPC分类号： B08B3/00
CPC分类号： H01L21/67057 , B08B3/08 , B08B3/10
摘要： A substrate cleaning apparatus, comprises a process tank that holds a mixture containing a hydrogen peroxide solution and sulfuric acid and is used for cleaning a substrate immersed in said mixture; circulation piping that extends between a primary side of said process tank on which said mixture is injected into said process tank and a secondary side of said process tank on which said mixture is discharged from said process tank and has a pump for causing circulation of said mixture; a heater disposed in said circulation piping configured to heat said mixture to a predetermined temperature; a chemical injection pipe configured to inject a hydrogen peroxide solution into said circulation piping at a position between the primary side of said process tank and a secondary side, which is a downstream side, of said heater; and a filter disposed in said circulation piping configured to remove particles in said mixture.
摘要翻译： 一种基板清洗装置，包括保持含有过氧化氢溶液和硫酸的混合物的处理罐，用于清洗浸在所述混合物中的基板; 所述循环管道在所述处理罐的初级侧之间延伸，所述处理罐的所述混合物被注入到所述处理罐中，所述处理罐的二次侧在所述处理罐的二次侧上从所述处理罐排出所述混合物，并且具有用于使所述混合物循环的泵 ; 设置在所述循环管道中的加热器，被配置为将所述混合物加热至预定温度; 化学注入管，被配置为在所述处理罐的初级侧和位于所述加热器的下游侧的次级侧之间的位置处将过氧化氢溶液注入到所述循环管道中; 以及设置在所述循环管道中的过滤器，其构造成去除所述混合物中的颗粒。
-
公开(公告)号：US20070095363A1
公开(公告)日：2007-05-03
申请号：US11588393
申请日：2006-10-27
CPC分类号： H01L21/67057 , B08B3/08 , B08B3/10
摘要： A substrate cleaning apparatus, comprises a process tank that holds a mixture containing a hydrogen peroxide solution and sulfuric acid and is used for cleaning a substrate immersed in said mixture; circulation piping that extends between a primary side of said process tank on which said mixture is injected into said process tank and a secondary side of said process tank on which said mixture is discharged from said process tank and has a pump for causing circulation of said mixture; a heater disposed in said circulation piping configured to heat said mixture to a predetermined temperature; a chemical injection pipe configured to inject a hydrogen peroxide solution into said circulation piping at a position between the primary side of said process tank and a secondary side, which is a downstream side, of said heater; and a filter disposed in said circulation piping configured to remove particles in said mixture.
摘要翻译： 一种基板清洗装置，包括保持含有过氧化氢溶液和硫酸的混合物的处理罐，用于清洗浸在所述混合物中的基板; 所述循环管道在所述处理罐的初级侧之间延伸，所述处理罐的所述混合物被注入到所述处理罐中，所述处理罐的二次侧在所述处理罐的二次侧上从所述处理罐排出所述混合物，并且具有用于使所述混合物循环的泵 ; 设置在所述循环管道中的加热器，被配置为将所述混合物加热至预定温度; 化学注入管，被配置为在所述处理罐的初级侧和位于所述加热器的下游侧的次级侧之间的位置处将过氧化氢溶液注入到所述循环管道中; 以及设置在所述循环管道中的过滤器，其构造成去除所述混合物中的颗粒。
-
5.发明申请SEMICONDUCTOR SUBSTRATE CLEANING METHOD USING BUBBLE/CHEMICAL MIXED CLEANING LIQUID 审中-公开使用泡沫/化学混合清洗液的半导体基板清洗方法公开(公告)号：US20110088731A1
公开(公告)日：2011-04-21
申请号：US12978933
申请日：2010-12-27
申请人： Hiroshi TOMITA , Hiroyasu Iimori , Hiroaki Yamada , Minako Inukai
发明人： Hiroshi TOMITA , Hiroyasu Iimori , Hiroaki Yamada , Minako Inukai
CPC分类号： H01L21/02057 , B08B3/10 , B08B3/12 , C11D3/0052 , C11D11/0047 , H01L21/02052 , H01L21/67057
摘要： A method has been disclosed which cleans a semiconductor substrate using a cleaning liquid produced by mixing bubbles of a gas into an acid solution in which the gas has been dissolved to the saturated concentration and which brings the zeta potentials of the semiconductor substrate and adsorbed particles into the negative region by the introduction of an interfacial active agent. Alternatively, a semiconductor substrate is cleaned using a cleaning liquid produced by mixing bubbles of a gas into an alkaline solution in which the gas has been dissolved to the saturated concentration and whose pH is 9 or more.
摘要翻译： 已经公开了一种方法，其使用通过将气体的气泡混合到其中已经溶解气体的酸溶液达到饱和浓度并且将半导体衬底和吸附的颗粒的ζ电位引入的清洗液清洗半导体衬底 通过引入界面活性剂的负面区域。 或者，使用将气体的气泡混合到其中溶解有气体至饱和浓度并且pH为9以上的碱性溶液中制备的清洗液来清洗半导体衬底。
-
公开(公告)号：US20080064212A1
公开(公告)日：2008-03-13
申请号：US11892634
申请日：2007-08-24
申请人： Yoshihiro Ogawa , Masahiro Kiyotoshi , Katsuhiko Tachibana , Hiroyasu Iimori , Hiroaki Yamada , Kaori Umezawa , Hiroshi Tomita , Atsuko Kawasaki
发明人： Yoshihiro Ogawa , Masahiro Kiyotoshi , Katsuhiko Tachibana , Hiroyasu Iimori , Hiroaki Yamada , Kaori Umezawa , Hiroshi Tomita , Atsuko Kawasaki
IPC分类号： H01L21/311 , H01L21/31
CPC分类号： H01L21/3125 , C23C18/122 , C23C18/1287 , H01L21/02164 , H01L21/02222 , H01L21/02282 , H01L21/02337 , H01L21/02343 , H01L21/316 , H01L21/3165 , H01L21/67086
摘要： A method of manufacturing a semiconductor device, has applying perhydro polysilazane to a substrate; and immersing at least the surface of said substrate to which perhydro polysilazane is applied in a mixture containing water heated to 120 degrees C. or higher to which ultrasound is applied, thereby modifying the perhydro polysilazane into silicon oxide.
摘要翻译： 一种半导体器件的制造方法，将全氢化硅氮烷应用于基板; 并将至少将所述基板的表面施加于含有加氢至120℃以上的水的混合物中，在该混合物中施加全羟基聚硅氮烷，从而将全氟聚硅氮烷改性为氧化硅。
-
7.发明申请Semiconductor substrate cleaning liquid and semiconductor substrate cleaning process 审中-公开半导体衬底清洗液和半导体衬底清洗工艺公开(公告)号：US20060035797A1
公开(公告)日：2006-02-16
申请号：US11201910
申请日：2005-08-10
申请人： Hiroshi Tomita , Yuji Yamada , Hiroaki Yamada , Norio Ishikawa , Yumiko Abe
发明人： Hiroshi Tomita , Yuji Yamada , Hiroaki Yamada , Norio Ishikawa , Yumiko Abe
CPC分类号： H01L21/02052 , C11D7/08 , C11D7/34 , C11D7/36 , C11D11/0047
摘要： A semiconductor substrate cleaning liquid composition is provided that includes one or more types selected from the group consisting of a compound having at least two sulfonic acid groups per molecule, phytic acid, and a condensed phosphoric acid compound; an inorganic acid; and water. There is also provided a process for cleaning a semiconductor substrate that includes a first step of cleaning the semiconductor substrate using the semiconductor substrate cleaning liquid composition and, subsequent to the first step, a second step of cleaning the semiconductor substrate with pure water, ozone water formed by dissolving ozone gas in pure water, or aqueous hydrogen peroxide.
摘要翻译： 提供一种半导体衬底清洗液组合物，其包含一种或多种选自每分子具有至少两个磺酸基的化合物，植酸和缩合磷酸化合物的类型; 无机酸; 和水。 还提供了一种清洗半导体衬底的方法，该方法包括使用半导体衬底清洗液组合物清洗半导体衬底的第一步骤，在第一步骤之后，用纯水，臭氧水清洗半导体衬底的第二步骤 通过将臭氧气体溶解在纯水或过氧化氢水溶液中形成。
-
8.发明授权Semiconductor substrate cleaning liquid and semiconductor substrate cleaning process 有权半导体衬底清洗液和半导体衬底清洗工艺公开(公告)号：US07896970B2
公开(公告)日：2011-03-01
申请号：US11893752
申请日：2007-08-16
申请人： Hiroshi Tomita , Yuji Yamada , Hiroaki Yamada , Norio Ishikawa , Yumiko Abe
发明人： Hiroshi Tomita , Yuji Yamada , Hiroaki Yamada , Norio Ishikawa , Yumiko Abe
IPC分类号： H01L21/02
CPC分类号： H01L21/02052 , C11D7/08 , C11D7/34 , C11D7/36 , C11D11/0047
摘要： A semiconductor substrate cleaning liquid composition is provided that includes one or more types selected from the group consisting of a compound having at least two sulfonic acid groups per molecule, phytic acid, and a condensed phosphoric acid compound; an inorganic acid; and water. There is also provided a process for cleaning a semiconductor substrate that includes a first step of cleaning the semiconductor substrate using the semiconductor substrate cleaning liquid composition and, subsequent to the first step, a second step of cleaning the semiconductor substrate with pure water, ozone water formed by dissolving ozone gas in pure water, or aqueous hydrogen peroxide.
摘要翻译： 提供一种半导体衬底清洗液组合物，其包含一种或多种选自每分子具有至少两个磺酸基的化合物，植酸和缩合磷酸化合物的类型; 无机酸; 和水。 还提供了一种清洗半导体衬底的方法，该方法包括使用半导体衬底清洗液组合物清洗半导体衬底的第一步骤，在第一步骤之后，用纯水，臭氧水清洗半导体衬底的第二步骤 通过将臭氧气体溶解在纯水或过氧化氢水溶液中形成。
-
9.发明申请SEMICONDUCTOR SUBSTRATE CLEANING METHOD USING BUBBLE/CHEMICAL MIXED CLEANING LIQUID 审中-公开使用泡沫/化学混合清洗液的半导体基板清洗方法公开(公告)号：US20080308132A1
公开(公告)日：2008-12-18
申请号：US12129074
申请日：2008-05-29
申请人： Hiroshi Tomita , Hiroyasu Iimori , Hiroaki Yamada , Minako Inukai
发明人： Hiroshi Tomita , Hiroyasu Iimori , Hiroaki Yamada , Minako Inukai
CPC分类号： H01L21/02057 , B08B3/10 , B08B3/12 , C11D3/0052 , C11D11/0047 , H01L21/02052 , H01L21/67057
摘要： A method has been disclosed which cleans a semiconductor substrate using a cleaning liquid produced by mixing bubbles of a gas into an acid solution in which the gas has been dissolved to the saturated concentration and which brings the zeta potentials of the semiconductor substrate and adsorbed particles into the negative region by the introduction of an interfacial active agent. Alternatively, a semiconductor substrate is cleaned using a cleaning liquid produced by mixing bubbles of a gas into an alkaline solution in which the gas has been dissolved to the saturated concentration and whose pH is 9 or more.
摘要翻译： 已经公开了一种方法，其使用通过将气体的气泡混合到其中已经溶解气体的酸溶液达到饱和浓度并且将半导体衬底和吸附的颗粒的ζ电位引入的清洗液清洗半导体衬底 通过引入界面活性剂的负面区域。 或者，使用将气体的气泡混合到其中溶解有气体至饱和浓度并且pH为9以上的碱性溶液中制备的清洗液来清洗半导体衬底。
-
10.发明申请Semiconductor substrate processing apparatus and semiconductor device fabrication method 审中-公开半导体衬底处理设备和半导体器件制造方法公开(公告)号：US20060081335A1
公开(公告)日：2006-04-20
申请号：US11246140
申请日：2005-10-11
申请人： Hiroyasu Iimori , Hiroshi Tomita , Hiroaki Yamada
发明人： Hiroyasu Iimori , Hiroshi Tomita , Hiroaki Yamada
CPC分类号： H01L21/67253 , H01L21/67086
摘要： According to the present invention, there is provided a semiconductor substrate processing apparatus comprising: a processing bath which etches a semiconductor substrate by dipping the semiconductor substrate into a processing solution; an outer bath which is positioned outside said processing bath and receives the processing solution overflowing from said processing bath; a circulation channel which resupplies the processing solution discharged from said outer bath to said processing bath; a heater which adjusts a temperature of the processing solution flowing through said circulation channel; a filter which removes foreign matter in the processing solution flowing through said circulation channel; and a controller which measures, after the semiconductor substrate is loaded into said processing bath, one of the temperature of the processing solution in said processing bath and a time during which the temperature of the processing solution restores a predetermined temperature, calculates a processing time during which the semiconductor substrate is etched on the basis of the measurement result, and etches the semiconductor substrate on the basis of the calculated processing time.
摘要翻译： 根据本发明，提供了一种半导体衬底处理装置，包括：通过将半导体衬底浸入处理溶液来蚀刻半导体衬底的处理槽; 位于所述处理槽外部并接收从所述处理槽溢出的处理溶液的外浴; 循环通道，其将从所述外浴排出的处理溶液补给所述处理槽; 调节流过所述循环通道的处理溶液的温度的加热器; 过滤器，其去除流过所述循环通道的处理溶液中的异物; 以及控制器，其在半导体衬底被加载到所述处理槽中之后，测量所述处理槽中的处理溶液的温度和处理溶液的温度恢复预定温度的时间之一，计算处理溶液的处理时间 基于测量结果蚀刻半导体衬底，并且基于所计算的处理时间蚀刻半导体衬底。
-
-
-
-
-
-
-
-
-
搜索结果
97 条记录 (耗时 0.024 秒)
