公开(公告)号：US5258324A

公开(公告)日：1993-11-02

申请号：US668493

申请日：1991-03-20

Applicant: Keita Matsunaga ,  Shinichiro Kuriya ,  Kiyoyuki Ogata ,  Hiroyuki Hamaguchi ,  Chuhei Nojiri ,  Osamu Makabe ,  Takeo Nomura ,  Kozo Nagaoka

Inventor： Keita Matsunaga ,  Shinichiro Kuriya ,  Kiyoyuki Ogata ,  Hiroyuki Hamaguchi ,  Chuhei Nojiri ,  Osamu Makabe ,  Takeo Nomura ,  Kozo Nagaoka

IPC: A61K38/00 ,  C07K14/53 ,  C12N5/08 ,  C12P21/02 ,  A01N37/18 ,  A61K37/00 ,  C07K3/00

CPC classification number: C07K14/53 ,  A61K38/00

Abstract: A novel megakaryocyte colony stimulating factor has been isolated from the supernatant of the culture obtained by cultivating a cell strain of a human large cell lung cancer. When the factor is applied to human or murine bone-marrow cells in vitro, it forms a megakaryocyte colony. Also, the factor increases the number of platelets in peripheral blood in vivo.

Abstract translation: PCT No.PCT / JP89 / 00960 Sec。 371日期1991年3月20日 102（e）1991年3月20日PCT PCT 1989年9月21日PCT公布。 第WO90 / 03397号公报 1990年04月5日。从通过培养人大细胞肺癌的细胞株获得的培养物的上清液中分离出新的巨核细胞集落刺激因子。 当该因子在体外应用于人或鼠骨髓细胞时，其形成巨核细胞集落。 此外，该因子增加了体外外周血中的血小板数量。

公开(公告)号：USD587259S1

公开(公告)日：2009-02-24

申请号：US29303992

申请日：2008-02-22

Applicant: Hiroyuki Hamaguchi ,  Keisuke Nakayama ,  Tetsuya Nagata

Designer： Hiroyuki Hamaguchi ,  Keisuke Nakayama ,  Tetsuya Nagata

公开(公告)号：US20070080454A1

公开(公告)日：2007-04-12

申请号：US11545674

申请日：2006-10-11

Applicant: Hiroyuki Hamaguchi

Inventor： Hiroyuki Hamaguchi

IPC: H01L23/48

CPC classification number: H01L23/3114 ,  H01L21/563 ,  H01L23/49827 ,  H01L23/642 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/051 ,  H01L2224/05568 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/812 ,  H01L2224/81801 ,  H01L2224/83851 ,  H01L2924/01019 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A structure for sufficiently alleviating the thermal stress between an LSI and substrate and allowing the LSI to be detached from a substrate easily is provided. In a flip-chip type assembly according to the present invention, an interposer made of silicon intervenes between the device and the substrate. The LSI and the interposer are connected with a solder and, the interposer and the substrate are connected with a conductive resin. The conductive resin alleviates the thermal stress between the substrate and the interposer. The LSI can be detached easily by heating the solder. The thermal stress between the LSI and the interposer can be reduced because both of them are made of silicon.

Abstract translation: 提供了用于充分减轻LSI和基板之间的热应力并允许LSI容易从基板分离的结构。 在根据本发明的倒装芯片型组件中，由硅制成的插入件插入在器件和衬底之间。 LSI和插入器与焊料连接，并且插入器和衬底与导电树脂连接。 导电树脂减轻了基板和插入件之间的热应力。 通过加热焊料可以容易地分离LSI。 LSI和内插器之间的热应力可以降低，因为它们都由硅制成。

公开(公告)号：US07582973B2

公开(公告)日：2009-09-01

申请号：US11545674

申请日：2006-10-11

Applicant: Hiroyuki Hamaguchi

Inventor： Hiroyuki Hamaguchi

IPC: H01L23/14

CPC classification number: H01L23/3114 ,  H01L21/563 ,  H01L23/49827 ,  H01L23/642 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/051 ,  H01L2224/05568 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/812 ,  H01L2224/81801 ,  H01L2224/83851 ,  H01L2924/01019 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A structure for sufficiently alleviating the thermal stress between an LSI and substrate and allowing the LSI to be detached from a substrate easily is provided. In a flip-chip type assembly according to the present invention, an interposer made of silicon intervenes between the device and the substrate. The LSI and the interposer are connected with a solder and, the interposer and the substrate are connected with a conductive resin. The conductive resin alleviates the thermal stress between the substrate and the interposer. The LSI can be detached easily by heating the solder. The thermal stress between the LSI and the interposer can be reduced because both of them are made of silicon.

Abstract translation: 提供了用于充分减轻LSI和基板之间的热应力并允许LSI容易从基板分离的结构。 在根据本发明的倒装芯片型组件中，由硅制成的插入件插入在器件和衬底之间。 LSI和插入器与焊料连接，并且插入器和衬底与导电树脂连接。 导电树脂减轻了基板和插入件之间的热应力。 通过加热焊料可以容易地分离LSI。 LSI和内插器之间的热应力可以降低，因为它们都由硅制成。

公开(公告)号：USD588593S1

公开(公告)日：2009-03-17

申请号：US29303994

申请日：2008-02-22

Applicant: Hiroyuki Hamaguchi ,  Keisuke Nakayama ,  Tetsuya Nagata

Designer： Hiroyuki Hamaguchi ,  Keisuke Nakayama ,  Tetsuya Nagata

公开(公告)号：US4578304A

公开(公告)日：1986-03-25

申请号：US678828

申请日：1984-12-06

Applicant: Hiroyuki Hamaguchi

Inventor： Hiroyuki Hamaguchi

IPC: H05K3/46 ,  H01L23/538 ,  H05K1/02 ,  H05K3/32 ,  B32B15/00 ,  B32B3/00 ,  C25D5/10 ,  C25D5/28

CPC classification number: H05K1/0271 ,  H01L23/538 ,  H01L23/5385 ,  H01L2224/48471 ,  H01L2224/48472 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/0102 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/14 ,  H05K1/02 ,  H05K2201/09781 ,  H05K2201/10477 ,  H05K2201/10946 ,  H05K2201/2009 ,  H05K2203/0195 ,  H05K2203/049 ,  H05K3/328 ,  Y10S428/901 ,  Y10T156/1089 ,  Y10T428/12806 ,  Y10T428/12847 ,  Y10T428/12875 ,  Y10T428/12882 ,  Y10T428/24917

Abstract: A multilayer wiring substrate composed of organic dielectric layers with wiring layers disposed therein supports large-scale integrated circuit chips and bonding pads. To prevent damage to the wiring layers when wires from the integrated circuit chips are attached to the bonding pads by thermocompression bonding, a metallic layer is interposed between the wiring layers and the bonding pads.

Abstract translation: 由布置有布线层的有机电介质层构成的多层布线基板支撑大规模集成电路芯片和接合焊盘。 为了防止当通过热压接将集成电路芯片的电线连接到接合焊盘时对布线层造成损坏，在布线层和接合焊盘之间插入金属层。