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公开(公告)号:US20160167080A1
公开(公告)日:2016-06-16
申请号:US14948395
申请日:2015-11-23
Applicant: Industrial Technology Research Institute
Inventor: Chun-An Lu , Yuan-Ling Tsai , Chiung-Hsiung Chen , Jiun-Jang Yu , Chin-Tien Yang
CPC classification number: C23C24/08
Abstract: A coating device is provided, and includes a coater and an electrical field generator. The coater contains a slurry or ink and has an outlet. The slurry or ink is coated on a substrate through the outlet. The substrate is disposed adjacent to the outlet, and loads the slurry or ink from the outlet of the coater to form a wet film. The electrical field generator is disposed under the substrate and provides the electrical field, and thus the wet film stacks tightly on the substrate due to the attraction of the electrical field.
Abstract translation: 提供涂覆装置,并且包括涂布机和电场发生器。 涂布机含有浆料或油墨并具有出口。 浆料或油墨通过出口涂覆在基材上。 衬底邻近出口设置,并从涂布机的出口装载浆料或油墨以形成湿膜。 电场发生器设置在基板下方并提供电场,因此湿膜由于电场的吸引而紧密堆叠在基板上。
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公开(公告)号:US11245168B2
公开(公告)日:2022-02-08
申请号:US16935144
申请日:2020-07-21
Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Inventor: Jiun-Jang Yu
Abstract: The disclosure relates to a filter including dielectric substrate, ground and microstrip line layers, and signal and ground vias. The ground layer is formed on the dielectric substrate and has a ground plane and signal terminal contacts. The microstrip line layer is located on the dielectric substrate and includes microstrip resonators, common electrode and input and output terminal contacts. The input and output terminal contacts are connected to the microstrip resonators. The signal and ground vias extend among the ground layer, the dielectric substrate, and the microstrip line layer. The signal terminal contacts are connected to the input and output terminal contacts through the signal vias. The ground plane is connected to the common electrode through the ground vias. The filter further includes at least one capacitive coupling unit capacitive-coupled with two of the microstrip resonators adjacent to each other.
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公开(公告)号:US12283737B2
公开(公告)日:2025-04-22
申请号:US18089241
申请日:2022-12-27
Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Inventor: Joseph Poujiong Wang , Wei-Yu Li , Wei Chung , Chun-An Lu , Jiun-Jang Yu
Abstract: An electromagnetic wave guidance and beam reshaping structure is favorable to incorporate a radiation source antenna into an energy focusing system. The electromagnetic wave guidance and beam reshaping structure includes a substrate, a plurality of metal patterns and a plurality of hollow structures. The substrate includes a central portion and a peripheral portion that surrounds the central portion. The plurality of metal patterns are disposed on the central portion. The plurality of hollow structures are disposed in the peripheral portion. The metal patterns are axisymmetrically arranged with respect to a central axis of the substrate, and the hollow structures are axisymmetrically arranged with respect to the central axis of the substrate.
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公开(公告)号:US20170148540A1
公开(公告)日:2017-05-25
申请号:US14983484
申请日:2015-12-29
Applicant: Industrial Technology Research Institute
Inventor: Yuan-Ling Tsai , Ying-Jung Chiang , Jiun-Jang Yu
CPC classification number: H01B3/30 , B32B3/26 , B32B3/263 , B32B3/30 , B32B7/04 , B32B15/01 , B32B15/04 , B32B15/043 , B32B15/092 , B32B15/16 , B32B15/20 , H01B1/20 , H01B1/22 , Y10T428/12389 , Y10T428/12396 , Y10T428/12438 , Y10T428/12451 , Y10T428/12472 , Y10T428/12479 , Y10T428/12486 , Y10T428/12493 , Y10T428/12535 , Y10T428/12569 , Y10T428/12896 , Y10T428/12903 , Y10T428/1291 , Y10T428/12931 , Y10T428/12944 , Y10T428/12993
Abstract: A metal conducting structure includes a first metal conducting layer, a second metal conducting layer, and a third metal conducting layer. The first metal conducting layer consists of a first polymer material and first metal particles. The first metal conducting layer is covered by the second metal conducting layer which is a structure with pores, the structure consists of second metal particles. The second metal conducting layer is covered by the third metal conducting layer. The pores of the second metal conducting layer are filled with a metal material of the third metal conducting layer.
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公开(公告)号:US09905327B2
公开(公告)日:2018-02-27
申请号:US14983484
申请日:2015-12-29
Applicant: Industrial Technology Research Institute
Inventor: Yuan-Ling Tsai , Ying-Jung Chiang , Jiun-Jang Yu
IPC: H01B3/30 , B32B15/01 , B32B3/26 , B32B7/04 , B32B3/30 , B32B15/04 , B32B15/092 , B32B15/16 , B32B15/20 , H01B1/22 , H01B1/20
CPC classification number: H01B3/30 , B32B3/26 , B32B3/263 , B32B3/30 , B32B7/04 , B32B15/01 , B32B15/04 , B32B15/043 , B32B15/092 , B32B15/16 , B32B15/20 , H01B1/20 , H01B1/22 , Y10T428/12389 , Y10T428/12396 , Y10T428/12438 , Y10T428/12451 , Y10T428/12472 , Y10T428/12479 , Y10T428/12486 , Y10T428/12493 , Y10T428/12535 , Y10T428/12569 , Y10T428/12896 , Y10T428/12903 , Y10T428/1291 , Y10T428/12931 , Y10T428/12944 , Y10T428/12993
Abstract: A metal conducting structure includes a first metal conducting layer, a second metal conducting layer, and a third metal conducting layer. The first metal conducting layer consists of a first polymer material and first metal particles. The first metal conducting layer is covered by the second metal conducting layer which is a structure with pores, the structure consists of second metal particles. The second metal conducting layer is covered by the third metal conducting layer. The pores of the second metal conducting layer are filled with a metal material of the third metal conducting layer.
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