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    Self-calibrated thermal sensors of an integrated circuit die
    2.
    发明授权
    Self-calibrated thermal sensors of an integrated circuit die 有权

    公开(公告)号：US10247624B2

    公开(公告)日：2019-04-02

    申请号：US15285405

    申请日：2016-10-04

    Applicant: INTEL CORPORATION

    Inventor： Mohamed A. Abdelmoneum ,  David E. Duarte ,  Gregory F. Taylor

    IPC: G01K15/00 ,  G01K7/00 ,  G01K11/00 ,  G01K7/32

    Abstract: Embodiments of the present disclosure provide self-calibrated thermal sensors of an integrated circuit (IC) die and associated techniques and configurations. In one embodiment, a self-calibrating thermal sensing device includes a resonator configured to oscillate at a frequency corresponding with a temperature of circuitry of an integrated circuit (IC) die, wherein the resonator is thermally coupled with the circuitry and configured to operate in a first mode and a second mode and logic operatively coupled with the resonator, and configured to calculate a first temperature corresponding with a first frequency of the resonator in the first mode using a first equation, calculate a second temperature corresponding with a second frequency of the resonator in the second mode using a second equation, and add an offset to the first equation and the second equation based on a result of a comparison of the first temperature and the second temperature. Other embodiments may be described and/or claimed.

    LINEAR RATIOMETRIC METAL RESISTOR-BASED TEMPERATURE SENSOR WITH REMOTE SENSING SUPPORT
    4.
    发明申请
    LINEAR RATIOMETRIC METAL RESISTOR-BASED TEMPERATURE SENSOR WITH REMOTE SENSING SUPPORT 有权

    公开(公告)号：US20240393186A1

    公开(公告)日：2024-11-28

    申请号：US18324578

    申请日：2023-05-26

    Applicant: Intel Corporation

    Inventor： David E. Duarte ,  Ayan Kar ,  Sameer Jayanta Joglekar ,  You Li ,  James S. Ayers

    IPC: G01K7/22 ,  H01C7/00

    Abstract: Embodiments herein relate to a temperature-sensing circuit for a semiconductor device. The circuit has a remote temperature-sensing element (RTSE) including a metal thermistor formed in a metal layer on the front side or backside of a substrate. The metal thermistor may be serpentine or spiral shaped. The RTSE communicates with a separate sense circuit at another location such as on the substrate. The RTSE can further include a thin film resistor (TFR) in an adjacent dielectric layer of the stack or within the sense circuit. The RTSE is driven alternately at opposing ends to cancel out the effects of power supply variations. An output voltage which represents a sensed temperature is obtained from a point between the metal thermistor and the TFR for processing by an analog-to-digital converter.

    Self-calibrated thermal sensors of an integrated circuit die
    6.
    发明授权
    Self-calibrated thermal sensors of an integrated circuit die 有权

    公开(公告)号：US09702769B2

    公开(公告)日：2017-07-11

    申请号：US13915453

    申请日：2013-06-11

    Applicant: Intel Corporation

    Inventor： Mohamed A. Abdelmoneum ,  David E. Duarte ,  Gregory F. Taylor

    IPC: G06K15/00 ,  G06K11/00 ,  G01K15/00 ,  G01K7/32

    CPC classification number: G01K15/005 ,  G01K7/00 ,  G01K7/32

    Abstract: Embodiments of the present disclosure provide self-calibrated thermal sensors of an integrated circuit (IC) die and associated techniques and configurations. In one embodiment, a self-calibrating thermal sensing device includes a resonator configured to oscillate at a frequency corresponding with a temperature of circuitry of an integrated circuit (IC) die, wherein the resonator is thermally coupled with the circuitry and configured to operate in a first mode and a second mode and logic operatively coupled with the resonator, and configured to calculate a first temperature corresponding with a first frequency of the resonator in the first mode using a first equation, calculate a second temperature corresponding with a second frequency of the resonator in the second mode using a second equation, and add an offset to the first equation and the second equation based on a result of a comparison of the first temperature and the second temperature. Other embodiments may be described and/or claimed.

    SELF-CALIBRATED THERMAL SENSORS OF AN INTEGRATED CIRCUIT DIE
    7.
    发明申请
    SELF-CALIBRATED THERMAL SENSORS OF AN INTEGRATED CIRCUIT DIE 审中-公开
    集成电路的自校准热传感器

    公开(公告)号：US20170038265A1

    公开(公告)日：2017-02-09

    申请号：US15285405

    申请日：2016-10-04

    Applicant: INTEL CORPORATION

    Inventor： Mohamed A. Abdelmoneum ,  David E. Duarte ,  Gregory F. Taylor

    IPC: G01K15/00 ,  G01K7/00

    CPC classification number: G01K15/005 ,  G01K7/00 ,  G01K7/32

    Abstract: Embodiments of the present disclosure provide self-calibrated thermal sensors of an integrated circuit (IC) die and associated techniques and configurations. In one embodiment, a self-calibrating thermal sensing device includes a resonator configured to oscillate at a frequency corresponding with a temperature of circuitry of an integrated circuit (IC) die, wherein the resonator is thermally coupled with the circuitry and configured to operate in a first mode and a second mode and logic operatively coupled with the resonator, and configured to calculate a first temperature corresponding with a first frequency of the resonator in the first mode using a first equation, calculate a second temperature corresponding with a second frequency of the resonator in the second mode using a second equation, and add an offset to the first equation and the second equation based on a result of a comparison of the first temperature and the second temperature. Other embodiments may be described and/or claimed.

    Abstract translation: 本公开的实施例提供集成电路（IC）管芯的自校准热传感器以及相关技术和配置。 在一个实施例中，自校准热感测装置包括配置成以对应于集成电路（IC）管芯的电路的温度的频率振荡的谐振器，其中谐振器与电路热耦合并且被配置为在 第一模式和第二模式以及与谐振器可操作地耦合的逻辑，并且被配置为使用第一等式计算与第一模式中的谐振器的第一频率相对应的第一温度，计算对应于谐振器的第二频率的第二温度 在第二模式中使用第二等式，并且基于第一温度和第二温度的比较的结果，向第一等式和第二等式添加偏移。 可以描述和/或要求保护其他实施例。

    Self-calibrated thermal sensors of an integrated circuit die
    9.
    发明授权
    Self-calibrated thermal sensors of an integrated circuit die 有权

    公开(公告)号：US09470586B2

    公开(公告)日：2016-10-18

    申请号：US13915453

    申请日：2013-06-11

    Applicant: Intel Corporation

    Inventor： Mohamed A. Abdelmoneum ,  David E. Duarte ,  Gregory F. Taylor

    IPC: G06K15/00 ,  G06K11/00 ,  G01K15/00 ,  G01K7/32

    Abstract: Embodiments of the present disclosure provide self-calibrated thermal sensors of an integrated circuit (IC) die and associated techniques and configurations. In one embodiment, a self-calibrating thermal sensing device includes a resonator configured to oscillate at a frequency corresponding with a temperature of circuitry of an integrated circuit (IC) die, wherein the resonator is thermally coupled with the circuitry and configured to operate in a first mode and a second mode and logic operatively coupled with the resonator, and configured to calculate a first temperature corresponding with a first frequency of the resonator in the first mode using a first equation, calculate a second temperature corresponding with a second frequency of the resonator in the second mode using a second equation, and add an offset to the first equation and the second equation based on a result of a comparison of the first temperature and the second temperature. Other embodiments may be described and/or claimed.

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