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公开(公告)号:US09579878B1
公开(公告)日:2017-02-28
申请号:US14927486
申请日:2015-10-30
Applicant: Industrial Technology Research Institute
Inventor: Sheng-Feng Chung , Cheng-Yi Shih , Shu-Yi Chang , Yu-Jie Wei , Shih-Ming Lin , Su-Tsai Lu
CPC classification number: B41F9/10 , B41F9/01 , B41F9/1081
Abstract: A gravure printing system is provided. The gravure printing system includes a plate cylinder, an ink source, a cover blade, and a doctor blade. The plate cylinder has a circumferential surface with at least one groove. The ink source is adapted to provider an ink onto the circumferential surface of the plate cylinder. The cover blade is adapted to form an anti-drying layer on the plate cylinder from the ink. The doctor blade is adapted to contact the plate cylinder and fill the at least one groove with the ink. A point on the circumferential surface sequentially passes by the ink source, the cover blade, and the doctor blade as the plate cylinder rotates. A Young's modulus of a material of the cover blade is less than a Young's modulus of a material of the doctor blade. A method of using the gravure printing system is also provided.
Abstract translation: 提供凹版印刷系统。 凹版印刷系统包括印版滚筒,墨源,盖片和刮刀。 印版滚筒具有至少一个凹槽的圆周表面。 墨源适于将油墨提供到印版滚筒的圆周表面上。 盖片适于在印版滚筒上从墨水形成防干燥层。 刮刀适于接触印版滚筒并且用墨水填充至少一个凹槽。 当印版滚筒旋转时,圆周表面上的点依次通过墨源,盖片和刮刀。 覆盖叶片的材料的杨氏模量小于刮刀材料的杨氏模量。 还提供了使用凹版印刷系统的方法。
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公开(公告)号:US12166278B2
公开(公告)日:2024-12-10
申请号:US17409714
申请日:2021-08-23
Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Inventor: Shih-Ming Lin , Wei Chung , Chen-Chun Yu , Hsin-Chu Chen , Wei-Yu Li
Abstract: A transparent antenna includes a substrate, an antenna grid layer, and a ground grid layer. The substrate has an electrically conductive hole extending from two opposite surfaced of the substrate. The antenna grid layer is formed on a surface of the substrate. The antenna grid layer includes a feeding portion and a transmission portion. The ground grid layer is formed on another surface of the substrate. The ground grid layer is coupled to the feeding portion of the antenna grid layer via the electrically conductive hole. An offset distance between a projection of a gridline of the antenna grid layer on the first surface and a projection of a gridline of the ground grid layer on the first surface is smaller than or equal to half of a difference between a line width of the antenna grid layer and a line width of the ground grid layer.
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公开(公告)号:US11414776B2
公开(公告)日:2022-08-16
申请号:US16411589
申请日:2019-05-14
Applicant: Industrial Technology Research Institute
Inventor: Shih-Ming Lin , Ming-Huei Yen
Abstract: An electrochemical processing device includes a current supply unit, a jig, and a controller. The current supply unit provides current for an electrochemical process. The jig includes a clamping region for clamping a substrate, a plurality of processing electrodes disposed in the clamping region and connected to the current supply unit, and a plurality of measuring electrodes disposed in the clamping region. The controller is connected to the plurality of measuring electrodes. When the jig clamps the substrate to perform the electrochemical process, the controller provides a measuring current to the measuring electrode to measure the thickness of the metal layer of the substrate.
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公开(公告)号:US20180342461A1
公开(公告)日:2018-11-29
申请号:US15705277
申请日:2017-09-15
Applicant: Industrial Technology Research Institute
Inventor: Chun-Ting Liu , Shih-Ming Lin , Je-Ping Hu , Jung-Shiuan Liou
IPC: H01L23/538 , H01L23/15 , H01L21/48 , H01L25/18 , H01L23/66
Abstract: A sensing system including a substrate, at least one explicit device, at least one inner operation device, a plurality of conductors, and a plurality of conductive traces is provided. The substrate has a first surface and a second surface opposite to the first surface, and has a plurality of vias communicating the first surface and the second surface. The explicit device is disposed on the first surface. The explicit device includes a display, a sensor, or a combination thereof. The inner operation device is totally disposed on the second surface. The inner operation device includes a signal processor, a driver, or a combination thereof. The conductors are disposed in the vias, respectively, and connect the at least one explicit device with the at least one inner operation device. The conductive traces are disposed on at least one of the first surface and the second surface.
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公开(公告)号:US20220141961A1
公开(公告)日:2022-05-05
申请号:US17134132
申请日:2020-12-24
Applicant: Industrial Technology Research Institute
Inventor: Chih-I Wu , Shih-Ming Lin , Pin-Hao Hu , Yu-Chung Lin , Hsin-Yu Chang , Fu-Lung Chou , Chien-Jung Huang
Abstract: A method of fabricating a substrate having a through via includes: providing a carrier board having a release layer thereon; attaching the substrate onto the carrier board via the release layer; applying a light beam to the substrate to form a first blind hole in the substrate, wherein the first blind hole penetrates a first surface and a second surface of the substrate; performing an enlargement process on the first blind hole to form a second blind hole; forming a through via in the second blind hole; and performing a de-bonding process to release the substrate having a through via from the carrier board.
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公开(公告)号:US11406022B2
公开(公告)日:2022-08-02
申请号:US17134132
申请日:2020-12-24
Applicant: Industrial Technology Research Institute
Inventor: Chih-I Wu , Shih-Ming Lin , Pin-Hao Hu , Yu-Chung Lin , Hsin-Yu Chang , Fu-Lung Chou , Chien-Jung Huang
IPC: H05K1/11 , H05K3/00 , H05K3/42 , H01L23/498
Abstract: A method of fabricating a substrate having a through via includes: providing a carrier board having a release layer thereon; attaching the substrate onto the carrier board via the release layer; applying a light beam to the substrate to form a first blind hole in the substrate, wherein the first blind hole penetrates a first surface and a second surface of the substrate; performing an enlargement process on the first blind hole to form a second blind hole; forming a through via in the second blind hole; and performing a de-bonding process to release the substrate having a through via from the carrier board.
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