公开(公告)号：US20250089164A1

公开(公告)日：2025-03-13

申请号：US18959663

申请日：2024-11-26

Applicant: Innolux Corporation

Inventor： Cheng-Chi WANG ,  Chin-Ming HUANG ,  Chien-Feng LI ,  Chia-Lin YANG

IPC: H05K1/11 ,  H05K3/40 ,  H05K3/46

Abstract: An electronic device including a die and a connection structure electrically connected to the die is disclosed. The connection structure includes a first insulating layer including an opening, a second insulating layer, a first metal element disposed between the first insulating layer and the second insulating layer, a second metal element disposed in the opening and electrically connected to the first metal element, and a conductive element. The second metal element is electrically connected between the conductive element and the first metal element. A first surface and a second surface of the first insulating layer are contacted with the first metal element and the conductive element respectively. The first insulating layer includes first filling elements, the second insulating layer includes second filling elements, and in a cross-sectional view, a second maximum size of the second filling elements is greater than a first maximum size of the first filling elements.

公开(公告)号：US20240114619A1

公开(公告)日：2024-04-04

申请号：US18073592

申请日：2022-12-02

Applicant: InnoLux Corporation

Inventor： Cheng-Chi WANG ,  Chin-Ming HUANG ,  Chien-Feng LI ,  Chia-Lin YANG

IPC: H05K1/11 ,  H05K3/40 ,  H05K3/46

CPC classification number: H05K1/113 ,  H05K3/4038 ,  H05K3/4673 ,  H05K2201/0266

Abstract: An electronic device including an electronic unit and a redistribution layer is disclosed. The electronic unit has connection pads. The redistribution layer is electrically connected to the electronic unit and includes a first insulating layer, a first metal layer and a second insulating layer. The first insulating layer is disposed on the electronic unit and has first openings disposed corresponding to the connection pads. The first metal layer is disposed on the first insulating layer and electrically connected to the electronic unit through the connection pads. The second insulating layer is disposed on the first metal layer. The first insulating layer includes first filler particles, and the second insulating layer includes second filler particles. The first filler particles have a first maximum particle size, the second filler particles have a second maximum particle size, and the second maximum particle size is greater than the first maximum particle size.

公开(公告)号：US20230049123A1

公开(公告)日：2023-02-16

申请号：US17736997

申请日：2022-05-04

Applicant: InnoLux Corporation

Inventor： Kuang-Ming FAN ,  Chia-Lin YANG ,  Liang-Lu CHEN

IPC: H01L21/48 ,  H01L21/66 ,  H01L23/498

Abstract: An electronic device is disclosed and includes a conductive layer, a first dielectric layer, and a second dielectric layer, in which the second dielectric layer is disposed on the first dielectric layer, the conductive layer is disposed between the first dielectric layer and the second dielectric layer, the first dielectric layer has a first transmittance for a light, the second dielectric layer has a second transmittance for the light, and the first transmittance is different from the second transmittance.

公开(公告)号：US20240014116A1

公开(公告)日：2024-01-11

申请号：US17955557

申请日：2022-09-29

Applicant: InnoLux Corporation

Inventor： Chia-Lin YANG ,  Sheng-Nan CHEN ,  Kuang-Ming FAN ,  Kuan-Feng LEE ,  Jui-Jen YUEH ,  Chin-Ming HUANG

IPC: H01L23/498 ,  H01L23/00 ,  H01L23/538 ,  H01L23/367

CPC classification number: H01L23/49838 ,  H01L24/08 ,  H01L24/09 ,  H01L23/49816 ,  H01L23/5386 ,  H01L23/3677 ,  H01L2224/0801 ,  H01L2224/08225 ,  H01L2224/0903 ,  H01L2924/30101

Abstract: An electronic device includes an electronic unit, a circuit layer and a bonding pad. The electronic unit includes a chip, an insulating layer and a first conductor layer. The insulating layer is disposed on the chip, the insulating layer includes a first opening, and the first conductor layer is disposed in the first opening. The circuit layer is disposed corresponding to the electronic unit, and the circuit layer includes a second opening and a second conductor layer disposed in the second opening. The bonding pad is in contact with the second conductor layer, and the bonding pad is electrically connected to electronic unit. The first conductor layer has a first height, the second conductor layer has a second height, and a ratio of the first height to the second height is greater than or equal to 0.1 and less than or equal to 0.9.

公开(公告)号：US20230085198A1

公开(公告)日：2023-03-16

申请号：US17529549

申请日：2021-11-18

Applicant: InnoLux Corporation

Inventor： Liang-Lu CHEN ,  Kuang-Ming FAN ,  Chia-Lin YANG

IPC: H01L21/66 ,  H01L23/544

Abstract: A method for manufacturing a multi-layered structure on a supporting entity is provided. The method includes forming a first layer and a first test mark on the supporting entity, wherein the first test mark has a first predetermined length. The first projected length of the first test mark is measured in a top view. The first warpage degree of the first test mark is calculated according to the first predetermined length and the first projected length.

公开(公告)号：US20230043187A1

公开(公告)日：2023-02-09

申请号：US17528167

申请日：2021-11-16

Applicant: InnoLux Corporation

Inventor： Cheng-Chi WANG ,  Kuang-Ming FAN ,  Liang-Lu CHEN ,  Chia-Lin YANG

IPC: H01L21/66 ,  H01L23/00

Abstract: The present disclosure provides an electronic device and a manufacturing method thereof. The electronic device includes a connecting element. The connecting element includes a first conductive line segment, a second conductive line segment, and a first connecting line segment. The first conductive line segment is electrically connected to the second conductive line segment through the first connecting line segment. In a vertical projection direction, the first connecting line segment has a first height, the first conductive line segment has a second height, and the first height is different from the second height.

公开(公告)号：US20240047288A1

公开(公告)日：2024-02-08

申请号：US17959314

申请日：2022-10-04

Applicant: InnoLux Corporation

Inventor： Sheng-Nan CHEN ,  Chia-Lin YANG ,  Kuan-Feng LEE ,  Jui-Jen YUEH

IPC: H01L23/29 ,  H01L23/00 ,  H01L23/498 ,  H01L21/48 ,  H01L21/56 ,  H01L23/538 ,  H01L23/31

CPC classification number: H01L23/293 ,  H01L24/24 ,  H01L24/19 ,  H01L24/16 ,  H01L23/49833 ,  H01L23/49838 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/563 ,  H01L21/566 ,  H01L23/5383 ,  H01L23/5386 ,  H01L23/3142 ,  H01L23/3135 ,  H01L2924/1811 ,  H01L2924/1815 ,  H01L2924/182 ,  H01L2924/18301 ,  H01L2224/16227 ,  H01L2224/16237 ,  H01L2224/24011 ,  H01L2224/24051 ,  H01L2224/24101 ,  H01L2224/24137 ,  H01L23/3121 ,  H01L2924/186

Abstract: The present disclosure provides an electronic device including a first electronic unit, a second electronic unit, a circuit layer, a protection layer, and a flexible member. The first electronic unit is electrically connected to the second electronic unit through the circuit layer. The protection layer is disposed corresponding to the first electronic unit and the second electronic unit, and the protection layer has an opening. At least a portion of the flexible member is disposed in the opening. The protection layer has a first Young's modulus, the flexible member has a second Young's modulus, and the first Young's modulus is greater than the second Young's modulus.

公开(公告)号：US20230402393A1

公开(公告)日：2023-12-14

申请号：US17819117

申请日：2022-08-11

Applicant: InnoLux Corporation

Inventor： Cheng-Chi WANG ,  Chin-Ming HUANG ,  Chia-Lin YANG

IPC: H01L23/538 ,  H01L21/82 ,  H01L21/469

CPC classification number: H01L23/5389 ,  H01L23/5386 ,  H01L21/82 ,  H01L21/469

Abstract: An electronic device is provided. The electronic device includes an electronic unit, a protective layer, and a circuit layer. The electronic unit includes a chip unit, a first insulating layer, and a second insulating layer. The first insulating layer is disposed on the chip unit, and the second insulating layer is disposed on the first insulating layer. The second insulating layer has a first side. The first side overlaps the chip unit along the normal direction of the electronic unit. The protective layer surrounds the electronic unit, and the circuit layer electrically connects the electronic unit.