公开(公告)号：US20250089164A1

公开(公告)日：2025-03-13

申请号：US18959663

申请日：2024-11-26

Applicant: Innolux Corporation

Inventor： Cheng-Chi WANG ,  Chin-Ming HUANG ,  Chien-Feng LI ,  Chia-Lin YANG

IPC: H05K1/11 ,  H05K3/40 ,  H05K3/46

Abstract: An electronic device including a die and a connection structure electrically connected to the die is disclosed. The connection structure includes a first insulating layer including an opening, a second insulating layer, a first metal element disposed between the first insulating layer and the second insulating layer, a second metal element disposed in the opening and electrically connected to the first metal element, and a conductive element. The second metal element is electrically connected between the conductive element and the first metal element. A first surface and a second surface of the first insulating layer are contacted with the first metal element and the conductive element respectively. The first insulating layer includes first filling elements, the second insulating layer includes second filling elements, and in a cross-sectional view, a second maximum size of the second filling elements is greater than a first maximum size of the first filling elements.

公开(公告)号：US20170053824A1

公开(公告)日：2017-02-23

申请号：US15239885

申请日：2016-08-18

Applicant: InnoLux Corporation

Inventor： Yan-Syun WANG ,  Chi-Che TSAI ,  Chien-Feng LI ,  Wei yun CHANG ,  Wei-Hsien CHANG ,  Po-Ching LIN

IPC: H01L21/762 ,  H01L21/02

CPC classification number: H01L24/29 ,  G06F3/00 ,  H01L21/02118 ,  H01L21/02164 ,  H01L21/02211 ,  H01L21/02422 ,  H01L21/02488 ,  H01L21/2007 ,  H01L21/7624 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/29099 ,  H01L2224/29193

Abstract: An electronic device is disclosed, which comprises: a first substrate; an adhesion layer disposed on the first substrate and comprising a condensation product of silane or derivatives thereof; an inorganic layer disposed on the adhesion layer; and an active unit disposed on the inorganic layer. In addition, the present disclosure also provides a method for manufacturing the aforementioned electronic device.

Abstract translation: 公开了一种电子设备，其包括：第一基板; 粘合层，其设置在所述第一基板上并且包含硅烷或其衍生物的缩合产物; 设置在所述粘合层上的无机层; 以及设置在无机层上的有源单元。 此外，本公开还提供了制造上述电子设备的方法。

公开(公告)号：US20190027458A1

公开(公告)日：2019-01-24

申请号：US16142151

申请日：2018-09-26

Applicant: InnoLux Corporation

Inventor： Yan-Syun WANG ,  Chi-Che TSAI ,  Chien-Feng LI ,  Wei-Yun CHANG ,  Wei-Hsien CHANG ,  Po-Ching LIN

IPC: H01L23/00 ,  H01L21/762 ,  H01L21/02

Abstract: A method for manufacturing an electronic device is disclosed, which includes the following steps: providing a first substrate and modifying a surface of the first substrate to obtain a modified surface; applying silane or derivatives thereof on the modified surface to form an adhesion precursor layer; heat-treating the adhesion precursor layer to form an adhesion layer; forming an inorganic layer on the adhesion layer; and forming an active unit on the inorganic layer, wherein the inorganic layer is disposed between the adhesion layer and the active unit.

公开(公告)号：US20240114619A1

公开(公告)日：2024-04-04

申请号：US18073592

申请日：2022-12-02

Applicant: InnoLux Corporation

Inventor： Cheng-Chi WANG ,  Chin-Ming HUANG ,  Chien-Feng LI ,  Chia-Lin YANG

IPC: H05K1/11 ,  H05K3/40 ,  H05K3/46

CPC classification number: H05K1/113 ,  H05K3/4038 ,  H05K3/4673 ,  H05K2201/0266

Abstract: An electronic device including an electronic unit and a redistribution layer is disclosed. The electronic unit has connection pads. The redistribution layer is electrically connected to the electronic unit and includes a first insulating layer, a first metal layer and a second insulating layer. The first insulating layer is disposed on the electronic unit and has first openings disposed corresponding to the connection pads. The first metal layer is disposed on the first insulating layer and electrically connected to the electronic unit through the connection pads. The second insulating layer is disposed on the first metal layer. The first insulating layer includes first filler particles, and the second insulating layer includes second filler particles. The first filler particles have a first maximum particle size, the second filler particles have a second maximum particle size, and the second maximum particle size is greater than the first maximum particle size.