公开(公告)号：US20040000725A1

公开(公告)日：2004-01-01

申请号：US10463984

申请日：2003-06-18

申请人： INPAQ Technology Co., Ltd.

发明人： Chun-Yuan Lee

IPC分类号： H01L021/48 ,  H01L023/52

CPC分类号： H01L23/62 ,  H01C7/1013 ,  H01C7/12 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/057 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/50 ,  H01L24/10 ,  H01L24/48 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48472 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2224/45099 ,  H01L2924/00

摘要： The present invention relates to an IC substrate provided with over voltage protection functions and thus, a plurality of over voltage protection devices are provided on a single substrate to protect an IC chip directly. According to the present invention, there is no need to install protection devices at respective I/O ports on a printed circuit board to prevent the IC devices from damage by surge pulses. Therefore, the costs to design circuits are reduced, the limited space is efficiently utilized, and unit costs to install respective protection devices are lowered down.

摘要翻译： 本发明涉及具有过电压保护功能的IC基板，因此，在单个基板上设置多个过电压保护装置，以直接保护IC芯片。 根据本发明，不需要在印刷电路板上的相应I / O端口处安装保护装置，以防止IC器件被浪涌脉冲损坏。 因此，减少设计电路的成本，有效利用有限的空间，并且降低安装各个保护装置的单位成本。

公开(公告)号：US20030038345A1

公开(公告)日：2003-02-27

申请号：US10219514

申请日：2002-08-15

申请人： Inpaq Technology Co., Ltd.

发明人： Chun-Yuan Lee

IPC分类号： H01L021/48 ,  H01L023/552 ,  H01L029/40

CPC分类号： H01L23/62 ,  H01L2224/16225

摘要： The present invention relates to an IC package substrate provided with over voltage protection function and thus, a plurality of over voltage protection devices are provided on a single substrate to protect an IC chip directly. According to the present invention, there is no need to install multiple protection devices on a printed circuit board. Therefore, the costs to design circuits are reduced, the limited space is effectively utilized, and unit costs to install respective protection devices are lowered down.

摘要翻译： 本发明涉及具有过电压保护功能的IC封装基板，因此，在单个基板上设置多个过电压保护器件，以直接保护IC芯片。 根据本发明，不需要在印刷电路板上安装多个保护装置。 因此，减少了设计电路的成本，有效地利用了有限的空间，并且降低了安装各个保护装置的单位成本。