公开(公告)号：US12183650B2

公开(公告)日：2024-12-31

申请号：US17131642

申请日：2020-12-22

Applicant: Intel Corporation

Inventor： Aditi Mallik ,  Chen Zhuang ,  Raghuram Narayan

IPC: H01L23/10 ,  H01L23/367 ,  H01L23/373

Abstract: A semiconductor package comprises a substrate and a ceramic carrier mounted to the substrate. An integrated circuit (IC) die is mounted to the ceramic carrier. A heat extraction path away from the IC die comprises: i) a thermal interface material over the IC die, the thermal interface material having a thickness of approximately 25 to 80 um; ii) an integrated heat spreader over the thermal interface material; iii) a ceramic carrier plate over the integrated heat spreader; and iv) an electrically conductive thermal pad between the ceramic carrier plate and a housing of the semiconductor package.

公开(公告)号：US20190149241A1

公开(公告)日：2019-05-16

申请号：US16231464

申请日：2018-12-22

Applicant: Intel Corporation

Inventor： Hyoung-Jun Kim ,  Hwee Chin Ong ,  Sang Yup Kim ,  Raghuram Narayan ,  Jeffrey B. Driscoll ,  Woosung Kim

IPC: H04B10/516 ,  H04B10/572 ,  G02F1/21

Abstract: Embodiments may relate to an optical modulator system. The optical modulator system may include a first photodiode to measure a first optical level at an output of a Mach-Zehnder modulator (MZM). The system may further include a second photodiode to measure a second optical level at a termination of the MZM. The system may further include a logic coupled with the first photodiode and the second photodiode, the logic to identify a modulator bias that minimizes the first optical level. Other embodiments may be described or claimed.

公开(公告)号：US11894474B2

公开(公告)日：2024-02-06

申请号：US16562889

申请日：2019-09-06

Applicant: Intel Corporation

Inventor： Priyanka Dobriyal ,  Ankur Agrawal ,  Susheel Jadhav ,  Quan Tran ,  Raghuram Narayan ,  Raiyomand Aspandiar ,  Kenneth Brown ,  John Heck

IPC: H01L31/02 ,  H01L31/0232 ,  G02B3/00 ,  H01L31/0216 ,  H01L25/16 ,  H01L31/18 ,  G02B1/11 ,  G02B6/42 ,  H01L23/538 ,  G02B6/24

CPC classification number: H01L31/02327 ,  G02B1/11 ,  G02B3/0012 ,  G02B3/0056 ,  G02B6/428 ,  H01L23/5385 ,  H01L25/167 ,  H01L31/02005 ,  H01L31/02019 ,  H01L31/02161 ,  H01L31/1876 ,  G02B6/241

Abstract: Embodiments disclosed herein include optoelectronic systems and methods of forming such systems. In an embodiment the optoelectronic system comprises a board, and a carrier attached to the board. In an embodiment, a first die is on the carrier. In an embodiment, the first die is a photonics die, and a surface of the first die is covered by an optically transparent layer.

公开(公告)号：US10790910B2

公开(公告)日：2020-09-29

申请号：US16231464

申请日：2018-12-22

Applicant: Intel Corporation

Inventor： Hyoung-Jun Kim ,  Hwee Chin Ong ,  Sang Yup Kim ,  Raghuram Narayan ,  Jeffrey B. Driscoll ,  Woosung Kim

IPC: H04B10/564 ,  H04B10/516 ,  G02F1/21 ,  H04B10/572 ,  G02F1/225 ,  G02F1/01

Abstract: Embodiments may relate to an optical modulator system. The optical modulator system may include a first photodiode to measure a first optical level at an output of a Mach-Zehnder modulator (MZM). The system may further include a second photodiode to measure a second optical level at a termination of the MZM. The system may further include a logic coupled with the first photodiode and the second photodiode, the logic to identify a modulator bias that minimizes the first optical level. Other embodiments may be described or claimed.

公开(公告)号：US20190137842A1

公开(公告)日：2019-05-09

申请号：US16231915

申请日：2018-12-24

Applicant: Intel Corporation

Inventor： Syed S. Islam ,  Raghuram Narayan ,  Syed Reza Bahadur ,  Bharadwaj Parthasarathy

IPC: G02F1/225 ,  G02F1/025 ,  H04B10/548

Abstract: Embodiments may relate to a segment driver that is to be coupled with a modulator segment of a Mach-Zehnder modulator. The segment driver may include a continuous-time linear equalizer (CTLE) incorporated within an amplifier stage of the modulator. The CTLE may be configured to identify an electrical signal that is related to an optical signal of the Mach-Zehnder modulator; reduce inter-symbol interference (ISI) of the electrical signal to generate a processed electrical signal; and output the processed electrical signal to the amplifier stage. Other embodiments may be described or claimed.