公开(公告)号：US09721871B2

公开(公告)日：2017-08-01

申请号：US14958420

申请日：2015-12-03

Applicant: Intel Corporation

Inventor： Emery E. Frey ,  Eric D. McAfee ,  Shankar Krishnan ,  Juan G. Cevallos ,  Roger D. Flynn

IPC: H01L23/473 ,  H01L23/34 ,  H01L23/40 ,  H01L23/28 ,  H01L23/367 ,  H01L23/46 ,  B23P15/26 ,  G06F1/20 ,  H01L21/48 ,  H01L23/00 ,  H01L23/36 ,  H01L23/44

CPC classification number: H01L23/473 ,  B23P15/26 ,  G06F1/20 ,  G06F2200/201 ,  H01L23/28 ,  H01L23/34 ,  H01L23/36 ,  H01L23/3677 ,  H01L23/40 ,  H01L23/44 ,  H01L23/46 ,  H01L24/17 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/1432

Abstract: Methods, apparatuses and systems associated with a heat exchanger for cooling an IC package are disclosed herein. In embodiments, a heat exchanger may include a base plate having a bottom side to be thermally coupled to the IC package, and a fin side, wherein the fin side is to include a plurality of fins to dissipate thermal energy emanated from the IC package. The heat exchanger may further include a manifold structure disposed on top of the base plate, having one or more layers, to regulate a coolant fluid flow to cool the plurality of fins, wherein the one or more layers are to include a plurality of channels and ports complementarily organized to distribute the coolant fluid flow to the plurality of fins tailored to a thermal energy emanation pattern of the integrated circuit package. Other embodiments may be described and/or claimed.

公开(公告)号：US20170162475A1

公开(公告)日：2017-06-08

申请号：US14958420

申请日：2015-12-03

Applicant: Intel Corporation

Inventor： Emery E. Frey ,  Eric D. McAfee ,  Shankar Krishnan ,  Juan G. Cevallos ,  Roger D. Flynn

IPC: H01L23/473 ,  H01L23/00 ,  H01L23/367 ,  H01L21/48 ,  B23P15/26 ,  G06F1/20

CPC classification number: H01L23/473 ,  B23P15/26 ,  G06F1/20 ,  G06F2200/201 ,  H01L23/28 ,  H01L23/34 ,  H01L23/36 ,  H01L23/3677 ,  H01L23/40 ,  H01L23/44 ,  H01L23/46 ,  H01L24/17 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/1432

Abstract: Methods, apparatuses and systems associated with a heat exchanger for cooling an IC package are disclosed herein. In embodiments, a heat exchanger may include a base plate having a bottom side to be thermally coupled to the IC package, and a fin side, wherein the fin side is to include a plurality of fins to dissipate thermal energy emanated from the IC package. The heat exchanger may further include a manifold structure disposed on top of the base plate, having one or more layers, to regulate a coolant fluid flow to cool the plurality of fins, wherein the one or more layers are to include a plurality of channels and ports complementarily organized to distribute the coolant fluid flow to the plurality of fins tailored to a thermal energy emanation pattern of the integrated circuit package. Other embodiments may be described and/or claimed.

公开(公告)号：US20180372551A1

公开(公告)日：2018-12-27

申请号：US15629625

申请日：2017-06-21

Applicant: Intel Corporation

Inventor： Janusz P. Jurski ,  Tozer J. Bandorawalla ,  Ramkumar Nagappan ,  Mariusz Oriol ,  Piotr Sawicki ,  Robin A. Steinbrecher ,  Shankar Krishnan

IPC: G01K3/08 ,  F24F11/00

Abstract: An apparatus is provided which comprises: a first circuitry to receive a measurement of a first temperature of a section of a computing device during a first loading condition of the computing device, and to receive a measurement of a second temperature of the section of the computing device during a second loading condition of the computing device; and a second circuitry to detect a potential fault in a cooling system to cool the computing device, based at least in part on the first temperature and the second temperature.

公开(公告)号：US20170071079A1

公开(公告)日：2017-03-09

申请号：US15356873

申请日：2016-11-21

Applicant: Intel Corporation

Inventor： Shankar Krishnan ,  Richard C. Stamey ,  Brian S. Jarrett ,  Geoffrey G. Von Allmen

IPC: H05K7/20

CPC classification number: H05K7/20836 ,  H01L23/44 ,  H05K7/20236 ,  H05K7/20272 ,  H05K7/20281 ,  H05K7/203 ,  H05K7/20772 ,  H05K7/20781 ,  H05K7/2079

Abstract: Apparatuses, methods and storage media associated with cooling one or more heat-generating components of an electronic device are disclosed herein. In embodiments, an electronic device may include a tank that may include a dielectric fluid and one or more heat-generating components. The electronic device may further include one or more transducers coupled with the tank. The transducers may be configured to generate an ultrasonic wave that controls movement of the dielectric fluid at a location within the tank. Other embodiments may be described and/or claimed.

Abstract translation: 本文公开了与冷却电子设备的一个或多个发热部件相关联的装置，方法和存储介质。 在实施例中，电子设备可以包括可以包括介电流体和一个或多个发热部件的罐。 电子设备还可以包括与罐相耦合的一个或多个换能器。 换能器可以被配置为产生超声波，其控制介质流体在罐内的位置的运动。 可以描述和/或要求保护其他实施例。

公开(公告)号：US09516792B2

公开(公告)日：2016-12-06

申请号：US14668331

申请日：2015-03-25

Applicant: Intel Corporation

Inventor： Shankar Krishnan ,  Richard C. Stamey ,  Brian S. Jarrett ,  Geoffrey G. Von Allmen

IPC: H05K7/20 ,  G06F1/20

CPC classification number: H05K7/20836 ,  H01L23/44 ,  H05K7/20236 ,  H05K7/20272 ,  H05K7/20281 ,  H05K7/203 ,  H05K7/20772 ,  H05K7/20781 ,  H05K7/2079

Abstract: Apparatuses, methods and storage media associated with cooling one or more heat-generating components of an electronic device are disclosed herein. In embodiments, an electronic device may include a tank that may include a dielectric fluid and one or more heat-generating components. The electronic device may further include one or more transducers coupled with the tank. The transducers may be configured to generate an ultrasonic wave that controls movement of the dielectric fluid at a location within the tank. Other embodiments may be described and/or claimed.

Abstract translation: 本文公开了与冷却电子设备的一个或多个发热部件相关联的装置，方法和存储介质。 在实施例中，电子设备可以包括可以包括介电流体和一个或多个发热部件的罐。 电子设备还可以包括与罐相耦合的一个或多个换能器。 换能器可以被配置为产生超声波，其控制介质流体在罐内的位置的运动。 可以描述和/或要求保护其他实施例。

公开(公告)号：US20160044833A1

公开(公告)日：2016-02-11

申请号：US14455337

申请日：2014-08-08

Applicant: Intel Corporation

Inventor： Shankar Krishnan ,  Eric D. McAfee ,  Tod A. Byquist

IPC: H05K7/20

CPC classification number: H05K7/20818 ,  H05K7/203

Abstract: Embodiments of the present disclosure are directed toward techniques and configurations for immersion cooling. In embodiments, an apparatus configured for immersion cooling may include a number of trays and a fluid circulation system. The number of trays may be configured to hold one or more circuit boards and may have a first opening to allow dielectric fluid to be injected into the tray, and a second opening to allow for escape of the dielectric fluid. The fluid circulation system may include a catchment area to collect the dielectric fluid that escapes from the plurality of trays and a distribution manifold coupled with the catchment area, to deliver the dielectric fluid collected in the catchment area back to the plurality of trays. Other embodiments may be described and/or claimed.

Abstract translation: 本公开的实施例涉及浸入式冷却的技术和配置。 在实施例中，配置用于浸没冷却的装置可以包括多个托盘和流体循环系统。 托盘的数量可以被配置为保持一个或多个电路板，并且可以具有第一开口以允许电介质流体被注入到托盘中，以及第二开口以允许电介质流体逸出。 流体循环系统可以包括收集从多个托盘逸出的电介质流体的集水区域和与集水区域联接的分配歧管，以将收集在集水区域中的介电流体输送回多个托盘。 可以描述和/或要求保护其他实施例。

公开(公告)号：US09433132B2

公开(公告)日：2016-08-30

申请号：US14455337

申请日：2014-08-08

Applicant: Intel Corporation

Inventor： Shankar Krishnan ,  Eric D. McAfee ,  Tod A. Byquist

IPC: H05K7/20 ,  H01L23/473

CPC classification number: H05K7/20818 ,  H05K7/203

Abstract: Embodiments of the present disclosure are directed toward techniques and configurations for immersion cooling. In embodiments, an apparatus configured for immersion cooling may include a number of trays and a fluid circulation system. The number of trays may be configured to hold one or more circuit boards and may have a first opening to allow dielectric fluid to be injected into the tray, and a second opening to allow for escape of the dielectric fluid. The fluid circulation system may include a catchment area to collect the dielectric fluid that escapes from the plurality of trays and a distribution manifold coupled with the catchment area, to deliver the dielectric fluid collected in the catchment area back to the plurality of trays. Other embodiments may be described and/or claimed.

Abstract translation: 本公开的实施例涉及浸入式冷却的技术和配置。 在实施例中，配置用于浸没冷却的装置可以包括多个托盘和流体循环系统。 托盘的数量可以被配置为保持一个或多个电路板，并且可以具有第一开口以允许电介质流体被注入到托盘中，以及第二开口以允许电介质流体逸出。 流体循环系统可以包括收集从多个托盘逸出的介电流体的集水区域和与集水区域联接的分配歧管，以将收集在集水区域中的介电流体输送回多个托盘。 可以描述和/或要求保护其他实施例。

公开(公告)号：US20160178475A1

公开(公告)日：2016-06-23

申请号：US14574321

申请日：2014-12-17

Applicant: Intel Corporation

Inventor： Shankar Krishnan ,  Scott M. Rider ,  Wilson E. Smoak

IPC: G01M3/40 ,  H05K7/20 ,  G01N21/80

CPC classification number: H05K7/20772 ,  G01M3/16 ,  G01N21/80 ,  H05K7/20272 ,  H05K7/20836

Abstract: The present disclosure describes embodiments of a computing system having a circuit for detecting a leak of a liquid in the cooling system and associated techniques and configurations. In some embodiments, the computing system includes a server board having a cooling system, and the circuit, wherein the circuit includes a first conducting element disposed on a substrate and coupled to a first voltage and a second conducting element disposed on the substrate and coupled to a second voltage. The first and second conducting elements are proximately disposed near each other, and the proximate positions are selected such that voltage across the conducting elements changes when a liquid is in simultaneous contact with the two conducting elements. In some embodiments, a detection circuit is coupled to the two electrodes to detect when the liquid is in simultaneous contact with the two conducting elements. Other embodiments may be disclosed and/or claimed.

Abstract translation: 本公开描述了具有用于检测冷却系统中的液体泄漏的电路的计算系统的实施例以及相关联的技术和配置。 在一些实施例中，计算系统包括具有冷却系统和电路的服务器板，其中电路包括设置在基板上并耦合到第一电压的第一导电元件和设置在基板上的第二导电元件， 第二电压。 第一和第二导电元件彼此靠近地设置，并且选择邻近位置使得当液体同时接触两个导电元件时，导电元件两端的电压发生变化。 在一些实施例中，检测电路耦合到两个电极以检测液体何时与两个导电元件同时接触。 可以公开和/或要求保护其他实施例。

公开(公告)号：US20160286694A1

公开(公告)日：2016-09-29

申请号：US14668331

申请日：2015-03-25

Applicant: Intel Corporation

Inventor： Shankar Krishnan ,  Richard C. Stamey ,  Brian S. Jarrett ,  Geoffrey G. Von Allmen

IPC: H05K7/20

CPC classification number: H05K7/20836 ,  H01L23/44 ,  H05K7/20236 ,  H05K7/20272 ,  H05K7/20281 ,  H05K7/203 ,  H05K7/20772 ,  H05K7/20781 ,  H05K7/2079

Abstract: Apparatuses, methods and storage media associated with cooling one or more heat-generating components of an electronic device are disclosed herein. In embodiments, an electronic device may include a tank that may include a dielectric fluid and one or more heat-generating components. The electronic device may further include one or more transducers coupled with the tank. The transducers may be configured to generate an ultrasonic wave that controls movement of the dielectric fluid at a location within the tank. Other embodiments may be described and/or claimed.

Abstract translation: 本文公开了与冷却电子设备的一个或多个发热部件相关联的装置，方法和存储介质。 在实施例中，电子设备可以包括可以包括介电流体和一个或多个发热部件的罐。 电子设备还可以包括与罐相耦合的一个或多个换能器。 换能器可以被配置为产生超声波，其控制介质流体在罐内的位置的运动。 可以描述和/或要求保护其他实施例。