摘要:
Estimating model parameters of a lithographic apparatus and controlling lithographic processing by a lithographic apparatus includes performing an exposure using a lithographic apparatus projecting a pattern onto a wafer. A set of predetermined wafer measurement locations is measured. Predetermined and measured locations of the marks are used to generate radial basis functions. Model parameters of said substrate are calculated using the generated radial basis functions as a basis function across said substrate. Finally, the estimated model parameters are used to control the lithographic apparatus in order to expose the substrate.
摘要:
An alignment mark comprising a periodic structure formed by mark lines is described. In an embodiment, the alignment mark is formed in a scribe lane of a substrate, the scribe lane extending in a scribe lane direction. The alignment mark includes: a first area including a first periodic structure formed by first mark lines extending in a first direction, the first direction being at a first angle α with respect to the scribe lane direction: 0°
摘要:
An alignment mark comprising a periodic structure formed by mark lines is described. In an embodiment, the alignment mark is formed in a scribe lane of a substrate, the scribe lane extending in a scribe lane direction. The alignment mark includes: a first area including a first periodic structure formed by first mark lines extending in a first direction, the first direction being at a first angle α with respect to the scribe lane direction: 0°
摘要:
A lithographic apparatus and method are used for manufacturing a device. A projection system is configured to project a patterned radiation beam onto a target portion of the substrate. A Higher Order Wafer Alignment (HOWA) model is applied so as to model higher order distortions across the substrate. The model is applied using at least one input parameter for which at least one intra-field effect has been taken into account. In an example, the intra-field effect taken into account is the ScanUp-ScanDown effect and/or the ScanLeft-ScanRight effect.
摘要:
A lithographic apparatus and method are used for manufacturing a device. A projection system is configured to project a patterned radiation beam onto a target portion of the substrate. A Higher Order Wafer Alignment (HOWA) model is applied so as to model higher order distortions across the substrate. The model is applied using at least one input parameter for which at least one intra-field effect has been taken into account. In an example, the intra-field effect taken into account is the ScanUp-ScanDown effect and/or the ScanLeft-ScanRight effect.
摘要:
A method for manufacturing a device includes providing a substrate, the substrate including a plurality of exposure fields, each exposure field including one or more target portions and at least one mark structure, the mark structure being arranged as positional mark for the exposure field; scanning and measuring the mark of each exposure field to obtain alignment information for the respective exposure field; determining an absolute position of each exposure field from the alignment information for the respective exposure field; determining a relative position of each exposure field with respect to at least one other exposure field by use of additional information on the relative parameters of the exposure field and the at least one other exposure field relative to each other; and combining the absolute positions and the determined relative positions into improved absolute positions for each of the plurality of exposure fields.
摘要:
A method for manufacturing a device includes providing a substrate, the substrate including a plurality of exposure fields, each exposure field including one or more target portions and at least one mark structure, the mark structure being arranged as positional mark for the exposure field; scanning and measuring the mark of each exposure field to obtain alignment information for the respective exposure field; determining an absolute position of each exposure field from the alignment information for the respective exposure field; determining a relative position of each exposure field with respect to at least one other exposure field by use of additional information on the relative parameters of the exposure field and the at least one other exposure field relative to each other; and combining the absolute positions and the determined relative positions into improved absolute positions for each of the plurality of exposure fields.