Lithographic apparatus and device manufacturing method
    2.
    发明授权
    Lithographic apparatus and device manufacturing method 有权
    平版印刷设备和器件制造方法

    公开(公告)号:US08711329B2

    公开(公告)日:2014-04-29

    申请号:US13042972

    申请日:2011-03-08

    申请人: Marc Van Kemenade

    发明人: Marc Van Kemenade

    摘要: A lithographic apparatus and method are used for manufacturing a device. A projection system is configured to project a patterned radiation beam onto a target portion of the substrate. A Higher Order Wafer Alignment (HOWA) model is applied so as to model higher order distortions across the substrate. The model is applied using at least one input parameter for which at least one intra-field effect has been taken into account. In an example, the intra-field effect taken into account is the ScanUp-ScanDown effect and/or the ScanLeft-ScanRight effect.

    摘要翻译: 光刻设备和方法用于制造器件。 投影系统被配置为将图案化的辐射束投影到基板的目标部分上。 应用更高阶的晶圆对准(HOWA)模型,以便模拟跨越衬底的高阶失真。 使用至少一个已经考虑了至少一个场内效应的输入参数来应用该模型。 在一个例子中,考虑到的场内效果是ScanUp-ScanDown效果和/或ScanLeft-ScanRight效果。

    Lithographic Apparatus and Device Manufacturing Method
    3.
    发明申请
    Lithographic Apparatus and Device Manufacturing Method 有权
    光刻设备和器件制造方法

    公开(公告)号:US20120057142A1

    公开(公告)日:2012-03-08

    申请号:US13042972

    申请日:2011-03-08

    申请人: Marc Van Kemenade

    发明人: Marc Van Kemenade

    IPC分类号: G03B27/54

    摘要: A lithographic apparatus and method are used for manufacturing a device. A projection system is configured to project a patterned radiation beam onto a target portion of the substrate. A Higher Order Wafer Alignment (HOWA) model is applied so as to model higher order distortions across the substrate. The model is applied using at least one input parameter for which at least one intra-field effect has been taken into account. In an example, the intra-field effect taken into account is the ScanUp-ScanDown effect and/or the ScanLeft-ScanRight effect.

    摘要翻译: 光刻设备和方法用于制造器件。 投影系统被配置为将图案化的辐射束投影到基板的目标部分上。 应用更高阶晶片对准(HOWA)模型,以便模拟跨衬底的高阶失真。 使用至少一个已经考虑了至少一个场内效应的输入参数来应用该模型。 在一个例子中,考虑到的场内效果是ScanUp-ScanDown效果和/或ScanLeft-ScanRight效果。

    Lithographic Apparatus and Device Manufacturing Method
    4.
    发明申请
    Lithographic Apparatus and Device Manufacturing Method 有权
    光刻设备和器件制造方法

    公开(公告)号:US20100123886A1

    公开(公告)日:2010-05-20

    申请号:US12621143

    申请日:2009-11-18

    IPC分类号: G03B27/42 G03B27/32

    摘要: A method for manufacturing a device includes providing a substrate, the substrate including a plurality of exposure fields, each exposure field including one or more target portions and at least one mark structure, the mark structure being arranged as positional mark for the exposure field; scanning and measuring the mark of each exposure field to obtain alignment information for the respective exposure field; determining an absolute position of each exposure field from the alignment information for the respective exposure field; determining a relative position of each exposure field with respect to at least one other exposure field by use of additional information on the relative parameters of the exposure field and the at least one other exposure field relative to each other; and combining the absolute positions and the determined relative positions into improved absolute positions for each of the plurality of exposure fields.

    摘要翻译: 一种制造器件的方法包括:提供衬底,所述衬底包括多个曝光场,每个曝光场包括一个或多个目标部分和至少一个标记结构,所述标记结构被布置为所述曝光场的位置标记; 扫描和测量每个曝光场的标记以获得相应曝光场的对准信息; 根据相应曝光场的对准信息确定每个曝光场的绝对位置; 通过使用关于相对于彼此的曝光场和至少一个其他曝光场的相对参数的附加信息来确定每个曝光场相对于至少一个其它曝光场的相对位置; 以及将所述绝对位置和所确定的相对位置组合为所述多个曝光场中的每一个的改进的绝对位置。

    Lithographic apparatus and device manufacturing method to determine improved absolute position of exposure fields using mark structures
    5.
    发明授权
    Lithographic apparatus and device manufacturing method to determine improved absolute position of exposure fields using mark structures 有权
    使用标记结构确定改善的曝光场绝对位置的光刻设备和器件制造方法

    公开(公告)号:US08908152B2

    公开(公告)日:2014-12-09

    申请号:US12621143

    申请日:2009-11-18

    IPC分类号: G03B27/32 G03F9/00

    摘要: A method for manufacturing a device includes providing a substrate, the substrate including a plurality of exposure fields, each exposure field including one or more target portions and at least one mark structure, the mark structure being arranged as positional mark for the exposure field; scanning and measuring the mark of each exposure field to obtain alignment information for the respective exposure field; determining an absolute position of each exposure field from the alignment information for the respective exposure field; determining a relative position of each exposure field with respect to at least one other exposure field by use of additional information on the relative parameters of the exposure field and the at least one other exposure field relative to each other; and combining the absolute positions and the determined relative positions into improved absolute positions for each of the plurality of exposure fields.

    摘要翻译: 一种制造器件的方法包括:提供衬底,所述衬底包括多个曝光场,每个曝光场包括一个或多个目标部分和至少一个标记结构,所述标记结构被布置为所述曝光场的位置标记; 扫描和测量每个曝光场的标记以获得相应曝光场的对准信息; 根据相应曝光场的对准信息确定每个曝光场的绝对位置; 通过使用关于相对于彼此的曝光场和至少一个其他曝光场的相对参数的附加信息来确定每个曝光场相对于至少一个其它曝光场的相对位置; 以及将所述绝对位置和所确定的相对位置组合为所述多个曝光场中的每一个的改进的绝对位置。

    Alignment mark and a method of aligning a substrate comprising such an alignment mark
    6.
    发明授权
    Alignment mark and a method of aligning a substrate comprising such an alignment mark 有权
    对准标记和对准包括这种对准标记的基板的方法

    公开(公告)号:US08208121B2

    公开(公告)日:2012-06-26

    申请号:US12363320

    申请日:2009-01-30

    IPC分类号: G03B27/42 G03B27/58

    CPC分类号: G03B27/32 G03F9/7076

    摘要: An alignment mark comprising a periodic structure formed by mark lines is described. In an embodiment, the alignment mark is formed in a scribe lane of a substrate, the scribe lane extending in a scribe lane direction. The alignment mark includes: a first area including a first periodic structure formed by first mark lines extending in a first direction, the first direction being at a first angle α with respect to the scribe lane direction: 0°

    摘要翻译: 描述包括由标记线形成的周期性结构的对准标记。 在一个实施例中,对准标记形成在基板的划线中,刻划线在划线方向延伸。 对准标记包括:第一区域,包括由第一方向延伸的第一标记线形成的第一周期性结构,第一方向相对于划线方向为第一角度α:0°<α<90°, 第二区域包括由沿第二方向延伸的第二标记线形成的第二周期性结构,第二方向为第二角度&amp; bgr; 相对于划线方向:-90°&nlE;&bgr; <0°。