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公开(公告)号：US5758506A
公开(公告)日：1998-06-02
申请号：US675043
申请日：1996-07-03
申请人： John P. Hancock , Jack L. Lawson , James D. Miller
发明人： John P. Hancock , Jack L. Lawson , James D. Miller
CPC分类号： F25B45/00 , B60H1/00585 , F25B2345/001 , F25B2345/002
摘要： A method and apparatus for determining refrigerant density and mass flow rate, and for pressurizing a refrigerant recovery tank while the refrigeration system is being recharged. The mass of a flowing refrigerant is automatically continually determined by reliable static means in a controlled recharging process. Flow-dependent pressure, such as the pressure drop across the orifice, and temperature data are taken from the recharging system and are connected to a data processor which uses the pressure and temperature data to determine the refrigerant density and the mass of the flowing refrigerant that has been used. The pressure of a source of recharging refrigerant can be maintained by withdrawing and heating liquid refrigerant and returning the resulting superheated vapor directly to the source of recharging refrigerant, and recharging operations can proceed during such pressure maintenance.
摘要翻译： 一种用于确定制冷剂密度和质量流量的方法和装置，并且用于在制冷系统被再充电时对制冷剂回收罐加压。 在受控的充电过程中，可靠的静态装置自动连续确定流动的制冷剂的质量。 流量相关压力，例如孔口上的压降和温度数据来自充电系统，并连接到数据处理器，数据处理器使用压力和温度数据来确定制冷剂密度和流动制冷剂的质量 已经用过。 可以通过抽出和加热液体制冷剂并将所得到的过热蒸汽直接返回到再生制冷剂的来源来维持补充制冷剂源的压力，并且在这种压力维持期间可以进行再充电操作。
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公开(公告)号：US20100068091A1
公开(公告)日：2010-03-18
申请号：US12561313
申请日：2009-09-17
摘要： A metal alloy feedstock and method for metal injection molding is disclosed. The alloy includes at least two components, such as a first component and a second component. The first component has a first melting point and the second component has a second melting point higher than the first melting point. The first melting point and the second melting point match to the temperature gradient of the heated barrel of an injection molding machine whereby when fed into the injection molding machine the first component melts prior to the second component melts and enables the second component to solute into the first component. Additional components may also be used.
摘要翻译： 公开了一种用于金属注射成型的金属合金原料和方法。 合金包括至少两种组分，例如第一组分和第二组分。 第一组分具有第一熔点，第二组分具有高于第一熔点的第二熔点。 第一熔点和第二熔点与注射成型机的加热桶的温度梯度相匹配，由此当第一组分进料到注塑机中时，第一组分在第二组分熔化之前熔化并使第二组分溶解成 第一部分。 还可以使用附加组件。
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公开(公告)号：USD543674S1
公开(公告)日：2007-05-29
申请号：US29241444
申请日：2005-10-28
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公开(公告)号：US07094822B2
公开(公告)日：2006-08-22
申请号：US10870629
申请日：2004-06-17
IPC分类号： C08K3/00
CPC分类号： H05K1/0209 , B29C45/0013 , B29C70/58 , B29K2021/00 , B29K2995/0013 , H05K3/284 , H05K3/285 , H05K2201/0133 , H05K2201/0209 , H05K2201/0215 , Y10T428/12028 , Y10T428/12111 , Y10T428/12153 , Y10T428/2958
摘要： The present invention relates to thermally conductive, elastomeric pads. The pads can be made by injection-molding a thermally conductive composition comprising about 30 to 60% by volume of an elastomer polymer matrix and about 25 to 60% by volume of a thermally conductive filler material. The resultant pads have heat transfer properties and can be used as a thermal interface to protect heat-generating electronic devices.
摘要翻译： 本发明涉及导热弹性垫。 垫可以通过注塑成型包含约30至60体积％的弹性体聚合物基质和约25至60体积％的导热填料的导热组合物来制备。 所得到的垫片具有传热性能，并且可以用作热界面以保护发热电子器件。
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5.发明授权公开(公告)号：US06986435B2
公开(公告)日：2006-01-17
申请号：US10225918
申请日：2002-08-22
申请人： E. Mikhail Sagal , James D. Miller
发明人： E. Mikhail Sagal , James D. Miller
IPC分类号： A47J39/00
CPC分类号： B65D81/3484 , A47J36/28
摘要： The present invention relates to a self-heating container for heating consumable items such as food and beverages. The container assembly includes a star-shaped inner container for holding heating media that produces an exothermic reaction, and an outer container for holding a consumable item such as food and beverages. The inner container includes a thermally conductive polymer composition, and the outer container includes a heat-insulating material. The thermally conductive polymer composition includes a base polymer matrix and filler material.
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公开(公告)号：US06620497B2
公开(公告)日：2003-09-16
申请号：US09757895
申请日：2001-01-10
IPC分类号： B32B1800
CPC分类号： C08K9/02 , B29C45/00 , B29K2105/16 , B29K2995/0007 , B29K2995/0013 , B29L2031/3061 , Y10T428/25 , Y10T428/252 , Y10T428/29 , Y10T428/2982 , Y10T428/2991 , Y10T428/2993
摘要： A thermally conductive and electrically insulative polymer composition and a method for creating the same is provided. Thermally conductive filler material is coated with a thermally conductive and electrically insulative coating material and mixed with a base polymer matrix. The mixture is molded into the desired shape. The electrically insulative coating material prevents the transfer of electricity through the filler material thus resulting in an electrically insulative composition.
摘要翻译： 提供导热和电绝缘聚合物组合物及其制备方法。 导热填充材料涂覆有导热和电绝缘涂层材料，并与基础聚合物基体混合。 将混合物模塑成所需的形状。 电绝缘涂层材料防止电穿过填料，从而导致电绝缘组合物。
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公开(公告)号：US06585039B2
公开(公告)日：2003-07-01
申请号：US09774519
申请日：2001-01-31
IPC分类号： F28F700
CPC分类号： F28D15/02 , B29C45/14622 , B29C45/14819 , B29K2105/16 , B29K2995/0013 , F28F2255/146 , H01L23/427 , H01L23/552 , H01L2924/0002 , Y10T29/4935 , Y10T29/49353 , Y10T29/4998 , H01L2924/00
摘要： The present invention discloses a heat pipe construction that includes a heat pipe with phase change media therein with a conductive composition molded about the heat pipe. The thermally conductive composition absorbs or reflects electro magnetic interference waves and prevents their transmission into and through the heat pipe to the electronic components being cooled by the heat pipe.
摘要翻译： 本发明公开了一种热管结构，其包括其中具有相变介质的热管，导热组合物围绕热管模制。 导热组合物吸收或反射电磁干扰波，并防止它们传输进入并通过热管到由热管冷却的电子部件。
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公开(公告)号：US06557859B2
公开(公告)日：2003-05-06
申请号：US09893853
申请日：2001-06-28
IPC分类号： F16J1502
CPC分类号： F16J15/064 , Y10S277/936 , Y10S277/938
摘要： A net-shape molded elastomeric gasket for dissipating heat and providing electro-magnetic interference (EMI) shielding for an electronic device is formed by loading a base elastomeric matrix material with thermally conductive filler and EMI reflective metallic filler and injecting the mixture into a mold cavity. The gasket of the present invention provides superior sealing between the case sections of an electronic device by shielding the device from EMI infiltration along the seam between the sections. In addition, the gasket of the present invention is in thermal communication with the case sections of the electronic device to provide thermal transfer and dissipation between the separate parts of the device.
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公开(公告)号：USD551418S1
公开(公告)日：2007-09-18
申请号：US29270155
申请日：2006-12-18
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公开(公告)号：USD547521S1
公开(公告)日：2007-07-24
申请号：US29269361
申请日：2006-11-30
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