公开(公告)号：US10421883B2

公开(公告)日：2019-09-24

申请号：US15386502

申请日：2016-12-21

Applicant: KCTECH CO., LTD.

Inventor： Jang Kuk Kwon ,  Sung Pyo Lee ,  Chang Gil Kwon ,  Jun Ha Hwang

IPC: C09G1/02 ,  C09G1/04 ,  C09K3/14 ,  H01L21/304 ,  H01L21/3105 ,  H01L21/321

Abstract: An abrasive particle-dispersion layer composite and a polishing slurry composition including the abrasive particle-dispersion layer composite are provided. The abrasive particle-dispersion layer composite includes abrasive particles, a first dispersant that is at least one cationic compound among an amino acid, an organic acid, polyalkylene glycol and a high-molecular polysaccharide coupled to a glucosamine compound, and a second dispersant that is a cationic polymer including at least two ionized cations in a molecular formula.

公开(公告)号：US12037516B2

公开(公告)日：2024-07-16

申请号：US17293236

申请日：2019-05-29

Applicant: KCTECH CO., LTD.

Inventor： Kwang Soo Park ,  Jun Ha Hwang ,  Soo Wan Choi ,  Nak Hyun Choi

IPC: C09G1/02 ,  C08K3/14 ,  C09K3/14

CPC classification number: C09G1/02 ,  C09K3/14

Abstract: The present disclosure relates to a polishing slurry composition and a method of producing the same. The polishing slurry composition according to one embodiment of the present disclosure includes: abrasive particles dispersed so as to have positively-charged particle surfaces; a first dispersant including a nonionic linear polymer; and a second dispersant including an anionic coiling polymer, wherein the polishing slurry composition satisfies the following Expressions 1 and 2: [Expression 1] 4≤log(milling energy)

公开(公告)号：US12031062B2

公开(公告)日：2024-07-09

申请号：US17415703

申请日：2019-07-11

Applicant: KCTECH CO., LTD.

Inventor： Jung Yoon Kim ,  Jun Ha Hwang ,  Kwang Soo Park ,  Hae Won Yang

IPC: C09G1/02

CPC classification number: C09G1/02

Abstract: The present disclosure relates to a polishing slurry composition for an STI process and, more specifically, to a polishing slurry composition for an STI process, the polishing slurry composition comprising: a polishing solution including polishing particles; and an additive solution containing a polymer having an amide bond, and a polysilicon film polishing barrier inclusive of a monomer having three or more chains linked to one or more atoms.

公开(公告)号：US20230025469A1

公开(公告)日：2023-01-26

申请号：US17863489

申请日：2022-07-13

Applicant: KCTECH CO., LTD.

Inventor： Jeong Gyu LEE ,  Hyo Jun Jang ,  Jun Ha Hwang

IPC: H01L21/321 ,  C01F17/235

Abstract: Provided is a new cerium-based particle and a polishing slurry composition including the same. The new cerium-based particle may include a self-assembly of fine particles and an organic material.

公开(公告)号：US11384255B2

公开(公告)日：2022-07-12

申请号：US16954350

申请日：2018-11-13

Applicant: KCTECH CO., LTD.

Inventor： Hae Won Yang ,  Jun Ha Hwang ,  Jung Yoon Kim ,  Kwang Soo Park

IPC: C09G1/02 ,  H01L21/321

Abstract: The present invention relates to a polishing slurry composition for an STI process, the polishing slurry composition comprising: a polishing solution including polishing particles; and an additive solution containing a nitride film polishing barrier inclusive of a polymer having an amide bond.