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    MODULAR ELECTRONIC INSTRUMENTATION CHASSIS WITH INTEGRATED HIGH PERFORMANCE REFERENCE CLOCK AND ASSOCIATED METHODS
    1.
    发明申请
    MODULAR ELECTRONIC INSTRUMENTATION CHASSIS WITH INTEGRATED HIGH PERFORMANCE REFERENCE CLOCK AND ASSOCIATED METHODS 有权
    具有集成高性能参考时钟和相关方法的模块化电子仪器

    公开(公告)号：US20160234978A1

    公开(公告)日：2016-08-11

    申请号：US14615143

    申请日：2015-02-05

    Applicant: Keysight Technologies, Inc.

    Inventor： Kuen Yew Lam

    IPC: H05K9/00 ,  H05K3/30 ,  H05K3/46 ,  H05K7/14

    CPC classification number: H05K3/46 ,  G01R1/04

    Abstract: The modular electronic instrumentation platform chassis is for use with a plurality of instrumentation modules and includes a frame defining a module area and a non-module area. The module area includes a plurality of slots open to a front of the frame and configured to receive instrumentation modules therein. A front panel may be carried by the front of the frame adjacent the plurality of slots. A chassis power unit is configured to provide power to the plurality of instrumentation modules received in the slots. A reference clock unit carried by the frame in the non-module area and is configured to provide a low phase-noise reference clock for the plurality of instrumentation modules received in the slots. The reference clock unit includes vibration dampening mounts that mount the reference clock unit to the frame, power supply circuitry, reference clock circuitry, a shield to isolate the power supply circuitry from the reference clock circuitry, and a plurality of reference clock outputs mounted in the front panel and coupled to the reference clock circuitry.

    Abstract translation: 模块化电子仪表平台机箱用于多个仪表模块，并且包括限定模块区域和非模块区域的框架。 模块区域包括通向框架的前部的多个槽，并被配置为在其中接收仪表模块。 前面板可以由邻近多个狭槽的框架的前部承载。 机箱电源单元被配置为向在槽中接收的多个仪表模块提供电力。 一种参考时钟单元，由非模块区域中的帧承载，并被配置为为在时隙中接收的多个仪表模块提供低相位噪声参考时钟。 参考时钟单元包括将参考时钟单元安装到框架上的减振装置，电源电路，参考时钟电路，将电源电路与参考时钟电路隔离的屏蔽件以及安装在基板时钟单元中的多个参考时钟输出 前面板并耦合到参考时钟电路。

    PRINTED CIRCUIT BOARD COMPRISING BLIND PRESS-FIT VIAS
    3.
    发明申请
    PRINTED CIRCUIT BOARD COMPRISING BLIND PRESS-FIT VIAS 有权
    印刷电路板包括BLIND PRESS-FIT VIAS

    公开(公告)号：US20150372403A1

    公开(公告)日：2015-12-24

    申请号：US14311293

    申请日：2014-06-21

    Applicant: Keysight Technologies, Inc.

    Inventor： Kuen Yew Lam ,  Thiam Ping Oon ,  Jared Richard

    IPC: H01R12/58 ,  H05K3/46 ,  H05K3/36 ,  H05K3/42 ,  H05K1/18 ,  H05K1/11

    CPC classification number: H01R12/585 ,  H05K1/115 ,  H05K1/162 ,  H05K7/1452 ,  H05K2201/044 ,  H05K2201/09509 ,  H05K2201/1059 ,  Y10T29/49128 ,  Y10T29/51 ,  Y10T156/1057

    Abstract: An apparatus comprises a printed circuit board (PCB) having a first surface and a second surface, a plurality of blind press-fit vias penetrating the first surface and extending partially through the PCB toward the second surface, the blind press-fit vias configured to receive press-fit connectors of at least one component to be connected to the PCB, and a plurality of electrical connectors disposed in a region of the second surface opposite the blind press-fit vias and configured to interface with one or more signal processing components disposed on the second surface.

    Abstract translation: 一种装置包括具有第一表面和第二表面的印刷电路板（PCB），穿过第一表面并且部分地延伸通过PCB朝向第二表面延伸的多个盲压配合通孔，盲压配合通孔被配置为 接收要连接到PCB的至少一个部件的压入连接器;以及多个电连接器，其布置在与所述盲压配合过孔相对的所述第二表面的区域中，并被配置为与设置的一个或多个信号处理部件 在第二个表面。

    Modular electronic instrumentation chassis with integrated high performance reference clock and associated methods
    5.
    发明授权
    Modular electronic instrumentation chassis with integrated high performance reference clock and associated methods 有权

    公开(公告)号：US09723727B2

    公开(公告)日：2017-08-01

    申请号：US14615143

    申请日：2015-02-05

    Applicant: Keysight Technologies, Inc.

    Inventor： Kuen Yew Lam

    IPC: H05K3/46 ,  G01R1/04

    CPC classification number: H05K3/46 ,  G01R1/04

    Abstract: The modular electronic instrumentation platform chassis is for use with a plurality of instrumentation modules and includes a frame defining a module area and a non-module area. The module area includes a plurality of slots open to a front of the frame and configured to receive instrumentation modules therein. A front panel may be carried by the front of the frame adjacent the plurality of slots. A chassis power unit is configured to provide power to the plurality of instrumentation modules received in the slots. A reference clock unit carried by the frame in the non-module area and is configured to provide a low phase-noise reference clock for the plurality of instrumentation modules received in the slots. The reference clock unit includes vibration dampening mounts that mount the reference clock unit to the frame, power supply circuitry, reference clock circuitry, a shield to isolate the power supply circuitry from the reference clock circuitry, and a plurality of reference clock outputs mounted in the front panel and coupled to the reference clock circuitry.

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