公开(公告)号：US20230072887A1

公开(公告)日：2023-03-09

申请号：US17691209

申请日：2022-03-10

Applicant: Kioxia Corporation

Inventor： Fuyuma ITO ,  Hiroyasu IIMORI ,  Shinsuke MURAKI ,  Yuya AKEBOSHI ,  Yosuke MARUYAMA ,  Satoshi NAKAOKA

IPC: H01L21/66 ,  H01L21/67

Abstract: In one embodiment, a semiconductor manufacturing apparatus includes a processor configured to process a film provided on an end portion of a substrate. The apparatus further includes a detector configured to detect information relating to a shape of the end portion of the substrate. The apparatus further includes a controller configured to control the processing of the film by the processor, based on the information relating to the shape of the end portion of the substrate.

公开(公告)号：US20240096659A1

公开(公告)日：2024-03-21

申请号：US18456652

申请日：2023-08-28

Applicant: Kioxia Corporation

Inventor： Fuyuma ITO ,  Jun TAKAGI ,  Ai MORI ,  Yosuke MARUYAMA ,  Yuya AKEBOSHI ,  Takashi WATANABE ,  Hiroyasu IIMORI

IPC: H01L21/67 ,  H01L21/311 ,  H01L21/3213

CPC classification number: H01L21/67086 ,  H01L21/31111 ,  H01L21/32134 ,  H01L21/67051

Abstract: A substrate processing apparatus includes: a plurality of roller pairs configured to place a plurality of substrates, respectively, wherein the substrates are arranged side by side in a horizontal direction with a predetermined interval, and rotate the plurality of substrates, respectively, in a circumferential direction; a first, second, and third circulation groove that are disposed along outer peripheral portions of each of the plurality of substrates; a chemical solution supplier configured to supply a chemical solution to the outer peripheral portions of the plurality of substrates through the first circulation groove; a rinse solution supplier configured to supply a rinse solution to the outer peripheral portions of the plurality of substrates through the second circulation groove; and a fluid supplier configured to supply a fluid for drying the rinse solution to the outer peripheral portions of the plurality of substrates through the third circulation groove.

公开(公告)号：US20240087931A1

公开(公告)日：2024-03-14

申请号：US18457821

申请日：2023-08-29

Applicant: Kioxia Corporation

Inventor： Satoshi NAKAOKA ,  Hiroyasu IIMORI

IPC: H01L21/673 ,  H01L21/02 ,  H01L21/306

CPC classification number: H01L21/67386 ,  H01L21/02057 ,  H01L21/30604

Abstract: A wafer transfer carrier includes a container and a lid portion. The container accommodates a wafer and a liquid, and is movable in a state where the wafer is in contact with the liquid. The lid portion is capable of sealing an inside of the container.

公开(公告)号：US20220181171A1

公开(公告)日：2022-06-09

申请号：US17680396

申请日：2022-02-25

Applicant: KIOXIA CORPORATION

Inventor： Yoshihiro UOZUMI ,  Shinsuke KIMURA ,  Yoshihiro OGAWA ,  Hiroyasu IIMORI ,  Tatsuhiko KOIDE ,  Hideaki HIRABAYASHI ,  Yuji NAGASHIMA

IPC: H01L21/67 ,  G03F7/40 ,  G03F7/16 ,  H01L21/677 ,  H01L21/68

Abstract: According to one embodiment, a substrate processing method is disclosed. The method can include treating a substrate with a first liquid. The substrate has a structural body formed on a major surface of the substrate. The method can include forming a support member supporting the structural body by bringing a second liquid into contact with the substrate wetted by the first liquid, and changing at least a portion of the second liquid into a solid by carrying out at least one of causing the second liquid to react, reducing a quantity of a solvent included in the second liquid, and causing at least a portion of a substance dissolved in the second liquid to be separated. The method can include removing the support member by changing at least a part of the support member from a solid phase to a gaseous phase, without passing through a liquid phase.

公开(公告)号：US20210066076A1

公开(公告)日：2021-03-04

申请号：US16811241

申请日：2020-03-06

Applicant: Kioxia Corporation

Inventor： Hiroyasu IIMORI

IPC: H01L21/02 ,  H01L21/67

Abstract: A semiconductor manufacturing apparatus according to an embodiment includes: a stage to have a plurality of pins to hold a semiconductor substrate having a first surface on which a film to be etched is formed and a second surface positioned on an opposite side to the first surface; a nozzle to eject a liquid chemical toward the first surface of the semiconductor substrate from above the stage; and an optical measurer to radiate light toward the second surface of the semiconductor substrate from a side of the stage during ejection of the liquid chemical, and to measure a displacement amount of the semiconductor substrate based on a state of reception of light reflected on the second surface.