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    Compound imaging metrology targets
    1.
    发明授权
    Compound imaging metrology targets 有权

    公开(公告)号：US10527951B2

    公开(公告)日：2020-01-07

    申请号：US15057723

    申请日：2016-03-01

    Applicant: KLA-TENCOR CORPORATION

    Inventor： Raviv Yohanan ,  Eran Amit ,  Mark Ghinovker ,  Tal Itzkovich ,  Nuriel Amir

    IPC: G03F7/20

    Abstract: Imaging metrology targets and methods are provided, which combine one-dimensional (1D) elements designed to provide 1D imaging metrology signals along at least two measurement directions and two-dimensional (2D) elements designed to provide at least one 2D imaging metrology overlay signal. The target area of the 1D elements may enclose the 2D elements or the target areas of the 1D and 2D elements may be partially or fully congruent. The compound targets are small, possibly multilayered, and may be designed to be process compatible (e.g., by segmentation of the elements, interspaces between elements and element backgrounds) and possibly be produced in die. Two dimensional elements may be designed to be periodic to provide additional one dimensional metrology signals.

    Feed Forward of Metrology Data in a Metrology System
    5.
    发明申请
    Feed Forward of Metrology Data in a Metrology System 有权
    计量系统中计量数据的前馈

    公开(公告)号：US20160290796A1

    公开(公告)日：2016-10-06

    申请号：US15090389

    申请日：2016-04-04

    Applicant: KLA-Tencor Corporation

    Inventor： Ady Levy ,  Daniel Kandel ,  Michael E. Adel ,  Leonid Poslavsky ,  John Robinson ,  Tal Marciano ,  Barak Bringoltz ,  Tzahi Grunzweig ,  Dana Klein ,  Tal Itzkovich ,  Nadav Carmel ,  Nuriel Amir ,  Vidya Ramanathan ,  Janay Camp ,  Mark Wagner

    IPC: G01B11/27 ,  G01N21/21

    CPC classification number: G01B11/272 ,  G01N21/211 ,  G01N21/31 ,  G01N21/41 ,  G01N21/4738 ,  G01N21/4788 ,  G01N21/6489 ,  G01N21/9501 ,  G01N2021/213 ,  G03F7/705 ,  G03F7/70525 ,  G03F7/70533 ,  G03F7/70616

    Abstract: A metrology performance analysis system includes a metrology tool including one or more detectors and a controller communicatively coupled to the one or more detectors. The controller is configured to receive one or more metrology data sets associated with a metrology target from the metrology tool in which the one or more metrology data sets include one or more measured metrology metrics and the one or more measured metrology metrics indicate deviations from nominal values. The controller is further configured to determine relationships between the deviations from the nominal values and one or more selected semiconductor process variations, and determine one or more root causes of the deviations from the nominal values based on the relationships between values of the one or more metrology metrics and the one or more selected semiconductor process variations.

    Abstract translation: 计量性能分析系统包括包括一个或多个检测器的计量工具和通信地耦合到所述一个或多个检测器的控制器。 所述控制器被配置为从所述计量工具接收与度量目标相关联的一个或多个度量数据集，其中所述一个或多个测量数据集包括一个或多个测量的度量度量，并且所述一个或多个测量的度量度量指示与标称值的偏差 。 控制器还被配置为确定与标称值和一个或多个所选择的半导体工艺变化的偏差之间的关系，并且基于一个或多个测量值的值之间的关系确定偏离标称值的一个或多个根本原因 度量和一个或多个所选择的半导体工艺变化。

    HYBRID IMAGING AND SCATTEROMETRY TARGETS
    6.
    发明申请
    HYBRID IMAGING AND SCATTEROMETRY TARGETS 有权
    混合成像和分析目标

    公开(公告)号：US20140375984A1

    公开(公告)日：2014-12-25

    申请号：US14338023

    申请日：2014-07-22

    Applicant: KLA-Tencor Corporation

    Inventor： DongSub Choi ,  Tal Itzkovich ,  David Tien

    IPC: G01N21/95

    CPC classification number: G01N21/9501 ,  G01N21/93 ,  G01N21/956 ,  G03F7/70633 ,  G03F7/70683

    Abstract: Metrology targets, design files, and design and production methods thereof are provided. The metrology targets are hybrid in that they comprise at least one imaging target structure configured to be measurable by imaging and at least one scatterometry target structure configured to be measurable by scatterometry. Thus, the hybrid targets may be measured by imaging and scatterometry simultaneously or alternatingly and/or the measurement techniques may be optimized with respect to wafer regions and other spatial parameters, as well as with respect to temporal process parameters. The hybrid targets may be used to monitor process parameters, for example via comparative overlay measurements and/or high resolution measurements.

    Abstract translation: 提供了计量目标，设计文件及其设计和制作方法。 度量目标是混合的，因为它们包括被配置为可通过成像测量的至少一个成像目标结构和被配置为可通过散射测量来测量的至少一个散射测量目标结构。 因此，可以通过成像和散射测量同时或交替地测量混合目标，和/或可以相对于晶片区域和其他空间参数以及关于时间过程参数优化测量技术。 混合目标可以用于监测过程参数，例如通过比较覆盖测量和/或高分辨率测量。

    Method and apparatus for direct self assembly in target design and production
    8.
    发明授权
    Method and apparatus for direct self assembly in target design and production 有权

    公开(公告)号：US10303835B2

    公开(公告)日：2019-05-28

    申请号：US14710201

    申请日：2015-05-12

    Applicant: KLA-TENCOR CORPORATION

    Inventor： Eran Amit ,  Raviv Yohanan ,  Tal Itzkovich ,  Nuriel Amir ,  Roie Volkovich ,  Dongsub Choi

    IPC: B32B3/10 ,  G06F17/50 ,  G01N21/93 ,  G01N21/956 ,  H01L21/3105 ,  H01L21/311 ,  G03F7/00

    Abstract: Target designs methods and targets are provided, in which at least some of the differentiation between target elements and their background is carried out by segmenting either of them. Directed self-assembly (DSA) processes are used to generate fine segmentation, and various characteristics of the polymer lines and their guiding lines are used to differentiate target elements from their background. Target designs and design principles are disclosed in relation to the DSA process, as well as optimization of the DSA process to yield high metrology measurement accuracy in face of production inaccuracies. Furthermore, designs and methods are provided for enhancing and using ordered regions of a DSA-produced polymer surface as target elements and as hard masks for production processes. The targets and methods may be configured to enable metrology measurements using polarized light to distinguish target elements or DSA features.

    Hybrid imaging and scatterometry targets
    10.
    发明授权
    Hybrid imaging and scatterometry targets 有权
    混合成像和散射目标

    公开(公告)号：US09476838B2

    公开(公告)日：2016-10-25

    申请号：US14338023

    申请日：2014-07-22

    Applicant: KLA-Tencor Corporation

    Inventor： DongSub Choi ,  Tal Itzkovich ,  David Tien

    IPC: G01N21/00 ,  G01N21/95 ,  G01N21/93 ,  G01N21/956 ,  G03F7/20

    CPC classification number: G01N21/9501 ,  G01N21/93 ,  G01N21/956 ,  G03F7/70633 ,  G03F7/70683

    Abstract: Metrology targets, design files, and design and production methods thereof are provided. The metrology targets are hybrid in that they comprise at least one imaging target structure configured to be measurable by imaging and at least one scatterometry target structure configured to be measurable by scatterometry. Thus, the hybrid targets may be measured by imaging and scatterometry simultaneously or alternatingly and/or the measurement techniques may be optimized with respect to wafer regions and other spatial parameters, as well as with respect to temporal process parameters. The hybrid targets may be used to monitor process parameters, for example via comparative overlay measurements and/or high resolution measurements.

    Abstract translation: 提供了计量目标，设计文件及其设计和制作方法。 度量目标是混合的，因为它们包括被配置为可通过成像测量的至少一个成像目标结构和被配置为可通过散射测量来测量的至少一个散射测量目标结构。 因此，可以通过成像和散射测量同时或交替地测量混合目标，和/或可以相对于晶片区域和其他空间参数以及关于时间过程参数优化测量技术。 混合目标可以用于监测过程参数，例如通过比较覆盖测量和/或高分辨率测量。

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