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公开(公告)号：US10706522B2
公开(公告)日：2020-07-07
申请号：US15394545
申请日：2016-12-29
Applicant: KLA-Tencor Corporation
Inventor： Prasanti Uppaluri , Rajesh Manepalli , Ashok V. Kulkarni , Saibal Banerjee , John Kirkland
Abstract: A method includes receiving one or more sets of wafer data, identifying one or more primitives from one or more shapes in one or more layers in the one or more sets of wafer data, classifying each of the one or more primitives as a particular primitive type, identifying one or more primitive characteristics for each of the one or more primitives, generating a primitive database of the one or more primitives, generating one or more rules based on the primitive database, receiving one or more sets of design data, applying the one or more rules to the one or more sets of design data to identify one or more critical areas, and generating one or more wafer inspection recipes including the one or more critical areas for an inspection sub-system.
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公开(公告)号：US20180130195A1
公开(公告)日：2018-05-10
申请号：US15394545
申请日：2016-12-29
Applicant: KLA-Tencor Corporation
Inventor： Prasanti Uppaluri , Rajesh Manepalli , Ashok V. Kulkarni , Saibal Banerjee , John Kirkland
IPC: G06T7/00
Abstract: A method includes receiving one or more sets of wafer data, identifying one or more primitives from one or more shapes in one or more layers in the one or more sets of wafer data, classifying each of the one or more primitives as a particular primitive type, identifying one or more primitive characteristics for each of the one or more primitives, generating a primitive database of the one or more primitives, generating one or more rules based on the primitive database, receiving one or more sets of design data, applying the one or more rules to the one or more sets of design data to identify one or more critical areas, and generating one or more wafer inspection recipes including the one or more critical areas for an inspection sub-system.
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公开(公告)号：US20150062571A1
公开(公告)日：2015-03-05
申请号：US14470916
申请日：2014-08-27
Applicant: KLA-Tencor Corporation
Inventor： Ashok V. Kulkarni , Lisheng Gao , Junqing Huang
CPC classification number: H01L22/12 , G01N21/9501 , H01L22/20
Abstract: Systems and methods for determining one or more parameters of a wafer inspection process are provided. One method includes aligning optical image(s) of an alignment target to their corresponding electron beam images generated by an electron beam defect review system. The method also includes determining different local coordinate transformations for different subsets of alignment targets based on results of the aligning. In addition, the method includes determining positions of defects in wafer inspection system coordinates based on coordinates of the defects determined by the electron beam defect review system and the different local coordinate transformations corresponding to different groups of the defects into which the defects have been separated. The method further includes determining one or more parameters for an inspection process for the wafer based on defect images acquired at the determined positions by a wafer inspection system.
Abstract translation: 提供了用于确定晶片检查过程的一个或多个参数的系统和方法。 一种方法包括将对准靶的光学图像与由电子束缺陷检查系统产生的相应的电子束图像对准。 该方法还包括基于对准的结果确定不同的对准目标子集的不同局部坐标变换。 此外，该方法包括基于由电子束缺陷评估系统确定的缺陷的坐标以及对应于缺陷已分离的缺陷的不同组的不同局部坐标变换来确定晶片检查系统坐标中缺陷的位置。 该方法还包括基于由晶片检查系统在所确定的位置处获取的缺陷图像来确定用于晶片的检查处理的一个或多个参数。
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公开(公告)号：US09401016B2
公开(公告)日：2016-07-26
申请号：US14707592
申请日：2015-05-08
Applicant: KLA-Tencor Corporation
Inventor： Ashok V. Kulkarni
CPC classification number: G06T7/001 , G01B21/16 , G01N21/8806 , G01N21/8851 , G01N21/9501 , G01N23/2251 , G01N2021/8825 , G01N2021/8887 , G01N2201/10 , G01N2201/12 , G01N2223/6116 , G06F17/5045 , G06T7/60 , G06T7/74 , G06T2207/30148 , H01L21/67288 , H01L22/12
Abstract: Methods and systems for determining a position of inspection data with respect to a stored high resolution die image are provided. One method includes aligning data acquired by an inspection system for alignment sites on a wafer with data for predetermined alignment sites. The predetermined alignment sites have a predetermined position in die image space of a stored high resolution die image for the wafer. The method also includes determining positions of the alignment sites in the die image space based on the predetermined positions of the predetermined alignment sites in the die image space. In addition, the method includes determining a position of inspection data acquired for the wafer by the inspection system in the die image space based on the positions of the alignment sites in the die image space.
Abstract translation: 提供了用于确定检查数据相对于存储的高分辨率管芯图像的位置的方法和系统。 一种方法包括将通过检查系统获取的数据对准用于晶片上的对准位置的数据与用于预定对准位置的数据。 预定的对准位置在晶片的存储的高分辨率芯片图像的管芯图像空间中具有预定位置。 该方法还包括基于管芯图像空间中的预定对准位置的预定位置来确定管芯图像空间中的对准位置的位置。 此外，该方法包括基于管芯图像空间中的对准位置的位置来确定由管芯图像空间中的检查系统为晶片获取的检查数据的位置。
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公开(公告)号：US09262821B2
公开(公告)日：2016-02-16
申请号：US14707573
申请日：2015-05-08
Applicant: KLA-Tencor Corporation
Inventor： Eugene Shifrin , Chetana Bhaskar , Ashok V. Kulkarni , Chien-Huei (Adam) Chen , Kris Bhaskar , Brian Duffy
CPC classification number: G06T7/001 , G06T2200/28 , G06T2207/30148
Abstract: Systems and methods for generating information for use in a wafer inspection process are provided. One method includes acquiring output of an inspection system for die(s) located on wafer(s), combining the output for the die(s) based on within die positions of the output, determining, on a within die position basis, a statistical property of variation in values of characteristic(s) of the combined output, and assigning the within die positions to different groups based on the statistical properties determined for the within die positions. The method also includes storing information for the within die positions and the different groups to which the within die positions are assigned in a storage medium that is accessible to the inspection system for performing the wafer inspection process, which includes applying defect detection parameter(s) to additional output of the inspection system generated for a wafer based on the information thereby detecting defects on the wafer.
Abstract translation: 提供了用于生成用于晶片检查过程的信息的系统和方法。 一种方法包括获取位于晶片上的模具的检查系统的输出，基于输出的管芯位置组合用于管芯的输出，在内部管芯位置的基础上确定统计学 基于针对模具位置确定的统计特性，将组合输出的特性值的变化的属性以及将模具位置分配给不同的组。 该方法还包括在用于执行晶片检查过程的检查系统可访问的存储介质中存储用于管芯位置和内部管芯位置分配的不同组的信息，其包括应用缺陷检测参数， 基于该信息为晶片生成的检查系统的附加输出，从而检测晶片上的缺陷。
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Patent Agency Ranking
6.发明申请Adaptive Sampling for Semiconductor Inspection Recipe Creation, Defect Review, and Metrology 有权半导体检测配方创建，缺陷评估和计量学的自适应采样公开(公告)号：US20140301630A1
公开(公告)日：2014-10-09
申请号：US14228023
申请日：2014-03-27
Applicant: KLA-Tencor Corporation
Inventor： Ashok V. Kulkarni , Saibal Banerjee
IPC: G06T7/00
CPC classification number: G06T7/0004 , G06T2207/10061 , G06T2207/30148
Abstract: Methods and systems for adaptive sampling for semiconductor inspection recipe creation, defect review, and metrology are provided. The embodiments provide image processing and pattern recognition algorithms and an adaptive sampling method for extracting critical areas from SEM image patches for use in a wafer inspection system when design data for a semiconductor chip is not available. The embodiments also provide image processing and pattern recognition algorithms for efficiently discovering critical defects and significant deviations in the normal manufacturing process, using the output from a wafer inspection system and an adaptive sampling method to select wafer locations to be examined on a high resolution review or metrology tool.
Abstract translation: 提供了用于半导体检测配方创建，缺陷检查和计量的自适应采样的方法和系统。 实施例提供了图像处理和模式识别算法以及用于在半导体芯片的设计数据不可用时从用于晶片检查系统的SEM图像补片提取临界区域的自适应采样方法。 实施例还提供图像处理和模式识别算法，用于在正常制造过程中有效地发现关键缺陷和显着偏差，使用晶片检查系统的输出和自适应采样方法来选择要在高分辨率检查中检查的晶片位置， 计量工具
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公开(公告)号：US20160314578A1
公开(公告)日：2016-10-27
申请号：US15135465
申请日：2016-04-21
Applicant: KLA-Tencor Corporation
Inventor： Saibal Banerjee , Ashok V. Kulkarni
IPC: G06T7/00
CPC classification number: G06T7/001 , G06T2207/20021 , G06T2207/30148
Abstract: Methods and systems for identifying outliers in multiple instances of a pattern of interest (POI) are provided. One system includes one or more computer subsystems configured for acquiring images generated by an imaging subsystem at multiple instances of a POI within a die formed on the specimen. The multiple instances include two or more instances that are located at aperiodic locations within the die. The computer subsystem(s) are also configured for determining a feature of each of the images generated at the multiple instances of the POI. In addition, the computer subsystem(s) are configured for identifying one or more outliers in the multiple instances of the POI based on the determined features.
Abstract translation: 提供了用于识别感兴趣模式（POI）的多个实例中的异常值的方法和系统。 一个系统包括一个或多个计算机子系统，其配置用于在形成在样本上的模具内的POI的多个实例处获取由成像子系统生成的图像。 多个实例包括位于管芯内非周期位置的两个或多个实例。 计算机子系统还被配置用于确定在POI的多个实例处生成的每个图像的特征。 另外，计算机子系统被配置为基于所确定的特征来识别POI的多个实例中的一个或多个异常值。
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公开(公告)号：US09224660B2
公开(公告)日：2015-12-29
申请号：US14470916
申请日：2014-08-27
Applicant: KLA-Tencor Corporation
Inventor： Ashok V. Kulkarni , Lisheng Gao , Junqing Huang
CPC classification number: H01L22/12 , G01N21/9501 , H01L22/20
Abstract: Systems and methods for determining one or more parameters of a wafer inspection process are provided. One method includes aligning optical image(s) of an alignment target to their corresponding electron beam images generated by an electron beam defect review system. The method also includes determining different local coordinate transformations for different subsets of alignment targets based on results of the aligning. In addition, the method includes determining positions of defects in wafer inspection system coordinates based on coordinates of the defects determined by the electron beam defect review system and the different local coordinate transformations corresponding to different groups of the defects into which the defects have been separated. The method further includes determining one or more parameters for an inspection process for the wafer based on defect images acquired at the determined positions by a wafer inspection system.
Abstract translation: 提供了用于确定晶片检查过程的一个或多个参数的系统和方法。 一种方法包括将对准靶的光学图像与由电子束缺陷检查系统产生的相应的电子束图像对准。 该方法还包括基于对准的结果确定不同的对准目标子集的不同局部坐标变换。 此外，该方法包括基于由电子束缺陷评估系统确定的缺陷的坐标以及对应于缺陷已分离的缺陷的不同组的不同局部坐标变换来确定晶片检查系统坐标中缺陷的位置。 该方法还包括基于由晶片检查系统在所确定的位置处获取的缺陷图像来确定用于晶片的检查处理的一个或多个参数。
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公开(公告)号：US20150324965A1
公开(公告)日：2015-11-12
申请号：US14707592
申请日：2015-05-08
Applicant: KLA-Tencor Corporation
Inventor： Ashok V. Kulkarni
CPC classification number: G06T7/001 , G01B21/16 , G01N21/8806 , G01N21/8851 , G01N21/9501 , G01N23/2251 , G01N2021/8825 , G01N2021/8887 , G01N2201/10 , G01N2201/12 , G01N2223/6116 , G06F17/5045 , G06T7/60 , G06T7/74 , G06T2207/30148 , H01L21/67288 , H01L22/12
Abstract: Methods and systems for determining a position of inspection data with respect to a stored high resolution die image are provided. One method includes aligning data acquired by an inspection system for alignment sites on a wafer with data for predetermined alignment sites. The predetermined alignment sites have a predetermined position in die image space of a stored high resolution die image for the wafer. The method also includes determining positions of the alignment sites in the die image space based on the predetermined positions of the predetermined alignment sites in the die image space. In addition, the method includes determining a position of inspection data acquired for the wafer by the inspection system in the die image space based on the positions of the alignment sites in the die image space.
Abstract translation: 提供了用于确定检查数据相对于存储的高分辨率管芯图像的位置的方法和系统。 一种方法包括将通过检查系统获取的数据对准用于晶片上的对准位置的数据与用于预定对准位置的数据。 预定的对准位置在晶片的存储的高分辨率芯片图像的管芯图像空间中具有预定位置。 该方法还包括基于管芯图像空间中的预定对准位置的预定位置来确定管芯图像空间中的对准位置的位置。 此外，该方法包括基于管芯图像空间中的对准位置的位置来确定由管芯图像空间中的检查系统为晶片获取的检查数据的位置。
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公开(公告)号：US20150324964A1
公开(公告)日：2015-11-12
申请号：US14707573
申请日：2015-05-08
Applicant: KLA-Tencor Corporation
Inventor： Eugene Shifrin , Chetana Bhaskar , Ashok V. Kulkarni , Chien-Huei (Adam) Chen , Kris Bhaskar , Brian Duffy
IPC: G06T7/00
CPC classification number: G06T7/001 , G06T2200/28 , G06T2207/30148
Abstract: Systems and methods for generating information for use in a wafer inspection process are provided. One method includes acquiring output of an inspection system for die(s) located on wafer(s), combining the output for the die(s) based on within die positions of the output, determining, on a within die position basis, a statistical property of variation in values of characteristic(s) of the combined output, and assigning the within die positions to different groups based on the statistical properties determined for the within die positions. The method also includes storing information for the within die positions and the different groups to which the within die positions are assigned in a storage medium that is accessible to the inspection system for performing the wafer inspection process, which includes applying defect detection parameter(s) to additional output of the inspection system generated for a wafer based on the information thereby detecting defects on the wafer.
Abstract translation: 提供了用于生成用于晶片检查过程的信息的系统和方法。 一种方法包括获取位于晶片上的模具的检查系统的输出，基于输出的管芯位置组合用于管芯的输出，在内部管芯位置的基础上确定统计学 基于针对模具位置确定的统计特性，将组合输出的特性值的变化的属性以及将模具位置分配给不同的组。 该方法还包括在用于执行晶片检查过程的检查系统可访问的存储介质中存储用于管芯位置和内部管芯位置分配的不同组的信息，其包括应用缺陷检测参数， 基于该信息为晶片生成的检查系统的附加输出，从而检测晶片上的缺陷。
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