公开(公告)号：US08564953B2

公开(公告)日：2013-10-22

申请号：US13013987

申请日：2011-01-26

申请人： Keisuke Horiuchi ,  Michiaki Hiyoshi ,  Koji Sasaki

发明人： Keisuke Horiuchi ,  Michiaki Hiyoshi ,  Koji Sasaki

IPC分类号： H05K7/20

CPC分类号： H01L23/473 ,  F28F3/12 ,  H01L23/053 ,  H01L25/165 ,  H01L2924/0002 ,  H05K7/20927 ,  Y10T29/4998 ,  Y10T29/49989 ,  H01L2924/00

摘要： In order to achieve reduction in loss, a semiconductor power module comprises DC terminals to be connected to a condenser module and the semiconductor power module is used in combination with a cooling jacket for cooling, and the DC terminals protrude toward the condenser module beyond the cooling jacket.

摘要翻译： 为了实现减少损耗，半导体功率模块包括要连接到电容器模块的DC端子，并且半导体功率模块与用于冷却的冷却套组合使用，并且DC端子朝着冷凝器模块突出超过冷却 夹克。

公开(公告)号：US20110188204A1

公开(公告)日：2011-08-04

申请号：US13013987

申请日：2011-01-26

申请人： Keisuke HORIUCHI ,  Michiaki Hiyoshi ,  Koji Sasaki

发明人： Keisuke HORIUCHI ,  Michiaki Hiyoshi ,  Koji Sasaki

IPC分类号： H05K7/20 ,  B23P17/00

CPC分类号： H01L23/473 ,  F28F3/12 ,  H01L23/053 ,  H01L25/165 ,  H01L2924/0002 ,  H05K7/20927 ,  Y10T29/4998 ,  Y10T29/49989 ,  H01L2924/00

摘要： In order to achieve reduction in loss, a semiconductor power module comprises DC terminals to be connected to a condenser module and the semiconductor power module is used in combination with a cooling jacket for cooling, and the DC terminals protrude toward the condenser module beyond the cooling jacket.

摘要翻译： 为了实现减少损耗，半导体功率模块包括要连接到电容器模块的DC端子，并且半导体功率模块与用于冷却的冷却套组合使用，并且DC端子朝着冷凝器模块突出超过冷却 夹克。

公开(公告)号：US20100327654A1

公开(公告)日：2010-12-30

申请号：US12826409

申请日：2010-06-29

申请人： Katsunori AZUMA ,  Mutsuhiro Mori ,  Michiaki Hiyoshi ,  Seiichi Hayakawa ,  Koji Sasaki ,  Isamu Yoshida

发明人： Katsunori AZUMA ,  Mutsuhiro Mori ,  Michiaki Hiyoshi ,  Seiichi Hayakawa ,  Koji Sasaki ,  Isamu Yoshida

IPC分类号： B60L1/00

CPC分类号： B60L11/04 ,  B60L2200/26 ,  H01L24/28 ,  H01L24/29 ,  H01L24/48 ,  H01L25/072 ,  H01L25/16 ,  H01L2224/48091 ,  H01L2224/4847 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3025 ,  H02M7/003 ,  H03K17/08148 ,  H03K2017/0806 ,  H05K7/1432 ,  Y02T10/70 ,  Y02T10/7077 ,  Y10T307/74 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A power module includes an upper arm circuit unit and a lower arm circuit unit each having a power semiconductor element; an insulating substrate with the units mounted on one surface thereof; a metal base bonded onto the other surface of the substrate opposite to the one surface where the units are mounted; a first connection conductor for supplying a high potential to the upper unit from outside; a second connection conductor for supplying a low potential to the lower unit from outside; an insulating sheet interposed between the conductors; and a resin case disposed on the metal base to support the conductors, the conductors are flat conductors and laminated with the sheet sandwiched therebetween; the sheet extends from one end of the laminated structure to secure the creepage distance between the conductors; and the case is furnished with a recess for containing the laminated structure.

摘要翻译： 功率模块包括上臂电路单元和下臂电路单元，每个具有功率半导体元件; 绝缘基板，其单元安装在其一个表面上; 金属底座粘合到与安装单元的一个表面相对的基板的另一个表面上; 用于从外部向上部单元提供高电位的第一连接导体; 用于从外部向下部单元提供低电位的第二连接导体; 插入在导体之间的绝缘片; 以及设置在金属基座上以支撑导体的树脂壳体，导体是扁平导体，并且夹在其间的片材层压; 片材从层压结构的一端延伸，以确保导体之间的爬电距离; 并且壳体设置有用于容纳层压结构的凹部。

公开(公告)号：US08519561B2

公开(公告)日：2013-08-27

申请号：US12826409

申请日：2010-06-29

申请人： Katsunori Azuma ,  Mutsuhiro Mori ,  Michiaki Hiyoshi ,  Seiichi Hayakawa ,  Koji Sasaki ,  Isamu Yoshida

发明人： Katsunori Azuma ,  Mutsuhiro Mori ,  Michiaki Hiyoshi ,  Seiichi Hayakawa ,  Koji Sasaki ,  Isamu Yoshida

IPC分类号： B60R16/03

CPC分类号： B60L11/04 ,  B60L2200/26 ,  H01L24/28 ,  H01L24/29 ,  H01L24/48 ,  H01L25/072 ,  H01L25/16 ,  H01L2224/48091 ,  H01L2224/4847 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3025 ,  H02M7/003 ,  H03K17/08148 ,  H03K2017/0806 ,  H05K7/1432 ,  Y02T10/70 ,  Y02T10/7077 ,  Y10T307/74 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A power module includes an upper arm circuit unit and a lower arm circuit unit each having a power semiconductor element; an insulating substrate with the units mounted on one surface thereof; a metal base bonded onto the other surface of the substrate opposite to the one surface where the units are mounted; a first connection conductor for supplying a high potential to the upper unit from outside; a second connection conductor for supplying a low potential to the lower unit from outside; an insulating sheet interposed between the conductors; and a resin case disposed on the metal base to support the conductors, the conductors are flat conductors and laminated with the sheet sandwiched therebetween; the sheet extends from one end of the laminated structure to secure the creepage distance between the conductors; and the case is furnished with a recess for containing the laminated structure.

摘要翻译： 功率模块包括上臂电路单元和下臂电路单元，每个具有功率半导体元件; 绝缘基板，其单元安装在其一个表面上; 金属底座粘合到与安装单元的一个表面相对的基板的另一个表面上; 用于从外部向上部单元提供高电位的第一连接导体; 用于从外部向下部单元提供低电位的第二连接导体; 插入在导体之间的绝缘片; 以及设置在金属基座上以支撑导体的树脂壳体，导体是扁平导体，并且夹在其间的片材层压; 片材从层压结构的一端延伸，以确保导体之间的爬电距离; 并且壳体设置有用于容纳层压结构的凹部。

公开(公告)号：US10827095B2

公开(公告)日：2020-11-03

申请号：US16031532

申请日：2018-07-10

申请人： Atsushi Sakagami ,  Naoto Sakurai ,  Koji Sasaki ,  Daiya Miyasaka ,  Tomoko Nishizawa ,  Yasuhiko Tsugawa ,  Yohei Ono

发明人： Atsushi Sakagami ,  Naoto Sakurai ,  Koji Sasaki ,  Daiya Miyasaka ,  Tomoko Nishizawa ,  Yasuhiko Tsugawa ,  Yohei Ono

IPC分类号： H04N1/00 ,  H04N1/44 ,  G06F3/12 ,  H04N1/21

摘要： A disclosed managing apparatus and image forming apparatus management system ensure confidentiality of information in an image forming apparatus while usability is maintained. An image forming apparatus acquires IC card identifying information with an IC card reader. A management server acquires a user ID associated with the acquired IC card identifying information and use limit information concerning use of the image forming apparatus. A process is performed in the image forming apparatus in accordance with the use limit information.

公开(公告)号：US09307117B2

公开(公告)日：2016-04-05

申请号：US14866474

申请日：2015-09-25

申请人： Atsushi Sakagami ,  Naoto Sakurai ,  Daiya Miyasaka ,  Koji Sasaki ,  Tomoko Nishizawa

发明人： Atsushi Sakagami ,  Naoto Sakurai ,  Daiya Miyasaka ,  Koji Sasaki ,  Tomoko Nishizawa

IPC分类号： G06K15/00 ,  H04N1/44 ,  H04N1/32

CPC分类号： H04N1/4426 ,  G06F3/1222 ,  G06F21/34 ,  G06F21/608 ,  G06F21/629 ,  G06K15/40 ,  G06K15/4095 ,  H04N1/32122 ,  H04N1/32561 ,  H04N1/4413 ,  H04N1/4433 ,  H04N1/444 ,  H04N2201/0094 ,  H04N2201/3205 ,  H04N2201/3221

摘要： A management apparatus connected to an image forming apparatus for managing usage of the image forming apparatus is disclosed. The management apparatus includes a user data storage part for storing user identification data and use restriction data corresponding to the user identification data, and a use restriction data acquiring part for acquiring the use restriction data corresponding to the user identification data.

公开(公告)号：US20160021279A1

公开(公告)日：2016-01-21

申请号：US14866474

申请日：2015-09-25

申请人： Atsushi Sakagami ,  Naoto Sakurai ,  Daiya Miyasaka ,  Koji Sasaki ,  Tomoko Nishizawa

发明人： Atsushi Sakagami ,  Naoto Sakurai ,  Daiya Miyasaka ,  Koji Sasaki ,  Tomoko Nishizawa

IPC分类号： H04N1/44 ,  H04N1/32

CPC分类号： H04N1/4426 ,  G06F3/1222 ,  G06F21/34 ,  G06F21/608 ,  G06F21/629 ,  G06K15/40 ,  G06K15/4095 ,  H04N1/32122 ,  H04N1/32561 ,  H04N1/4413 ,  H04N1/4433 ,  H04N1/444 ,  H04N2201/0094 ,  H04N2201/3205 ,  H04N2201/3221

摘要： A management apparatus connected to an image forming apparatus for managing usage of the image forming apparatus is disclosed. The management apparatus includes a user data storage part for storing user identification data and use restriction data corresponding to the user identification data, and a use restriction data acquiring part for acquiring the use restriction data corresponding to the user identification data.

公开(公告)号：US08553245B2

公开(公告)日：2013-10-08

申请号：US12485206

申请日：2009-06-16

申请人： Atsushi Sakagami ,  Naoto Sakurai ,  Koji Sasaki ,  Tomoko Saeki ,  Tsuyoshi Hoshino

发明人： Atsushi Sakagami ,  Naoto Sakurai ,  Koji Sasaki ,  Tomoko Saeki ,  Tsuyoshi Hoshino

IPC分类号： G06K15/00

CPC分类号： H04N1/00856 ,  G03G15/5016 ,  G03G15/5091 ,  G03G2215/00109 ,  H04L63/0853 ,  H04N1/00244 ,  H04N1/00344 ,  H04N1/0035 ,  H04N1/00514 ,  H04N1/4406 ,  H04N1/442 ,  H04N1/4426 ,  H04N1/4433 ,  H04N2201/0039 ,  H04N2201/0094

摘要： An image forming apparatus connected via a network with an authentication server for user authentication based on biometric information about a user. The image forming apparatus is also connected with a managing server for managing an operation of the image forming apparatus. The image forming apparatus includes a transmission unit transmitting the biometric information about the user to the authentication server, a reception unit receiving use limit information corresponding to the biometric information about the user from the managing server, and a control unit controlling the operation of the image forming apparatus based on the use limit information.

摘要翻译： 一种通过网络与基于用户认证的认证服务器连接的图像形成装置，用于基于关于用户的生物特征信息。 图像形成装置还与用于管理图像形成装置的操作的管理服务器连接。 所述图像形成装置包括：发送单元，向所述认证服务器发送关于所述用户的生物体信息;接收单元，从所述管理服务器接收与所述用户的生物体信息对应的使用限制信息;以及控制单元，控制所述图像的操作 基于使用限制信息的成形装置。

公开(公告)号：US08434850B2

公开(公告)日：2013-05-07

申请号：US13233875

申请日：2011-09-15

申请人： Satoshi Ibe ,  Hiroto Komiyama ,  Toshiaki Kurosu ,  Kouji Hasegawa ,  Koji Sasaki

发明人： Satoshi Ibe ,  Hiroto Komiyama ,  Toshiaki Kurosu ,  Kouji Hasegawa ,  Koji Sasaki

IPC分类号： B41J29/377 ,  B41J2/05

CPC分类号： B41J2/14129 ,  B41J2/1603 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1631 ,  B41J2/1639 ,  B41J2/1642 ,  B41J2/1645 ,  B41J2/1646 ,  Y10T29/49401

摘要： A liquid discharge head having a liquid discharge head substrate including an element row in which a plurality of energy generating elements for generating thermal energy for use in discharging liquid are arranged, and a discharge port member corresponding to each of the plurality of energy generating elements, the discharge port members including a plurality of walls in contact with the liquid discharge head substrate to form a plurality of liquid chambers for storing liquid and a plurality of discharge ports which communicate with each of the plurality of the liquid chambers to discharge liquid with the thermal energy generated by the energy generating element. The liquid discharge head further includes a plurality of heat dissipating members corresponding to each of the plurality of the liquid chambers and having a first portion exposed to the liquid chamber and a second portion exposed to the atmosphere.

摘要翻译： 一种液体排出头，其具有排液头基板，该液体排出头基板包括排列有用于产生排出液体的热能的多个能量产生元件的元件列，以及与多个能量产生元件中的每一个对应的排出口构件， 所述排出口构件包括与所述液体排出头基板接触的多个壁，以形成用于储存液体的多个液体室和与所述多个所述液体室中的每一个连通的多个排出口，以将热量排出液体 由能量产生元件产生的能量。 液体排出头还包括对应于多个液体室中的每一个的多个散热构件，并且具有暴露于液体室的第一部分和暴露于大气的第二部分。

公开(公告)号：US08421232B2

公开(公告)日：2013-04-16

申请号：US13117544

申请日：2011-05-27

申请人： Osamu Ikeda ,  Masato Nakamura ,  Satoshi Matsuyoshi ,  Koji Sasaki ,  Shinji Hiramitsu

发明人： Osamu Ikeda ,  Masato Nakamura ,  Satoshi Matsuyoshi ,  Koji Sasaki ,  Shinji Hiramitsu

IPC分类号： H01L23/48 ,  H01L23/52

CPC分类号： H05K3/3463 ,  B23K35/262 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/16 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/29144 ,  H01L2224/29211 ,  H01L2224/29311 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/32507 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83801 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/13055 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/351 ,  H05K3/244 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/01016 ,  H01L2924/01028 ,  H01L2924/01032 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929

摘要： A semiconductor device includes a semiconductor element, a support member bonded to a first surface of the semiconductor element with a first bonding material and a lead electrode bonded to a second surface of the semiconductor element supported on the support member with a second bonding material, and further including a method of producing the semiconductor device. Respective connecting parts of the support member and the lead electrode are Ni-plated and each of the first and the second bonding material is a Sn solder having a Cu6Sn5 content greater than a eutectic content.

摘要翻译： 半导体器件包括半导体元件，利用第一接合材料接合到半导体元件的第一表面的支撑构件和利用第二接合材料接合到支撑在支撑构件上的半导体元件的第二表面的引线电极，以及 还包括制造半导体器件的方法。 支撑构件和引线电极的各个连接部分是镀镍的，并且第一和第二接合材料中的每一个是Cu 6 Sn 5含量大于共晶含量的Sn焊料。