公开(公告)号：US09870333B1

公开(公告)日：2018-01-16

申请号：US14484597

申请日：2014-09-12

Applicant: KEYSIGHT TECHNOLOGIES, INC.

Inventor： Kuen Yew Lam ,  Jared Richard ,  Chris R. Jacobsen ,  James Benson

IPC: H05K7/10 ,  G06F13/40 ,  G06F13/38

CPC classification number: G06F13/4068 ,  G06F13/385 ,  G06F13/4022 ,  G06F13/4027 ,  G06F13/409

Abstract: A peripheral component interconnect express (PCIe) eXtensions for instrumentation (PXIe) chassis includes a backplane, multiple peripheral slots, a mezzanine card and an integrated accelerator module. The peripheral slots are located on the backplane and configured to receive insertable PXIe peripheral modules, respectively. The mezzanine card is on the backplane and configured to accommodate at least one of connectors, integrated circuits (ICs) and signal lines incorporated in the PXIe chassis. The integrated accelerator module is on the mezzanine card within the PXIe chassis and configured to accelerate processing of signals received from the PXIe peripheral modules.

公开(公告)号：US09837736B2

公开(公告)日：2017-12-05

申请号：US14311293

申请日：2014-06-21

Applicant: Keysight Technologies, Inc.

Inventor： Kuen Yew Lam ,  Thiam Ping Oon ,  Jared Richard

IPC: H05K7/00 ,  H01R12/58 ,  H05K1/11 ,  H05K7/14 ,  H05K1/16

CPC classification number: H01R12/585 ,  H05K1/115 ,  H05K1/162 ,  H05K7/1452 ,  H05K2201/044 ,  H05K2201/09509 ,  H05K2201/1059 ,  Y10T29/49128 ,  Y10T29/51 ,  Y10T156/1057

Abstract: An apparatus comprises a printed circuit board (PCB) having a first surface and a second surface, a plurality of blind press-fit vias penetrating the first surface and extending partially through the PCB toward the second surface, the blind press-fit vias configured to receive press-fit connectors of at least one component to be connected to the PCB, and a plurality of electrical connectors disposed in a region of the second surface opposite the blind press-fit vias and configured to interface with one or more signal processing components disposed on the second surface.

公开(公告)号：US20150372403A1

公开(公告)日：2015-12-24

申请号：US14311293

申请日：2014-06-21

Applicant: Keysight Technologies, Inc.

Inventor： Kuen Yew Lam ,  Thiam Ping Oon ,  Jared Richard

IPC: H01R12/58 ,  H05K3/46 ,  H05K3/36 ,  H05K3/42 ,  H05K1/18 ,  H05K1/11

CPC classification number: H01R12/585 ,  H05K1/115 ,  H05K1/162 ,  H05K7/1452 ,  H05K2201/044 ,  H05K2201/09509 ,  H05K2201/1059 ,  Y10T29/49128 ,  Y10T29/51 ,  Y10T156/1057

Abstract: An apparatus comprises a printed circuit board (PCB) having a first surface and a second surface, a plurality of blind press-fit vias penetrating the first surface and extending partially through the PCB toward the second surface, the blind press-fit vias configured to receive press-fit connectors of at least one component to be connected to the PCB, and a plurality of electrical connectors disposed in a region of the second surface opposite the blind press-fit vias and configured to interface with one or more signal processing components disposed on the second surface.

Abstract translation: 一种装置包括具有第一表面和第二表面的印刷电路板（PCB），穿过第一表面并且部分地延伸通过PCB朝向第二表面延伸的多个盲压配合通孔，盲压配合通孔被配置为 接收要连接到PCB的至少一个部件的压入连接器;以及多个电连接器，其布置在与所述盲压配合过孔相对的所述第二表面的区域中，并被配置为与设置的一个或多个信号处理部件 在第二个表面。

公开(公告)号：US20240220380A1

公开(公告)日：2024-07-04

申请号：US18098495

申请日：2023-01-18

Applicant: Keysight Technologies, Inc.

Inventor： Jared Richard ,  Chris R. Jacobsen ,  Gregory S. Hill

IPC: G06F11/22

CPC classification number: G06F11/2221 ,  G06F11/2294

Abstract: A system is proved for performing testing of devices under test (DUTs). The system includes edge sensors configured to collect measurement data from and to provide stimulus data to the DUTs for performing testing of the DUTs, where each edge sensor includes a data transducer and an intelligent network interface card configured to manage a transfer of the measurement data via a high-speed data network using remote direct memory access (RDMA); and a remote data center remote from the edge sensors, where the remote data center is scalable with respect to the number of edge sensors, and is configured to communicate with the edge sensors over the high-speed data network, where communicating with the edge sensors includes at least sending control signals for controlling the testing, receiving the measurement data, and/or sending the stimulus data.